公开(公告)号：US20130105957A1

公开(公告)日：2013-05-02

申请号：US13659557

申请日：2012-10-24

Applicant: Shinji Watanabe ,  Akihisa Eimori

Inventor： Shinji Watanabe ,  Akihisa Eimori

IPC: H01L23/495

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.

Abstract translation: 引线框架包括：设置在前表面上的芯片安装区域; 引线区域，包括沿芯片安装区域的面内方向布置的多个凹凸部分; 以及布置在所述凹部中的端子。 前表面的引线区域的厚度小于端子从前表面的厚度。

公开(公告)号：US08399574B2

公开(公告)日：2013-03-19

申请号：US12529274

申请日：2007-12-03

Applicant: Shinya Fujibayashi ,  Shinji Watanabe ,  Chikara Ohto ,  Shuji Nakagawa ,  Ikuo Takahashi ,  Shigekazu Suzuki

Inventor： Shinya Fujibayashi ,  Shinji Watanabe ,  Chikara Ohto ,  Shuji Nakagawa ,  Ikuo Takahashi ,  Shigekazu Suzuki

IPC: C08G18/02 ,  C08G18/09 ,  C08G18/10 ,  C08G18/48

CPC classification number: B29C41/18 ,  B60R13/02 ,  B60R13/0892 ,  C08G18/12 ,  C08G18/2825 ,  C08G18/4202 ,  C08G18/797 ,  C08G2140/00 ,  C08L75/04 ,  C08L79/00 ,  C08L2666/20 ,  C08G18/3256

Abstract: The present invention provides a resin powder composition for slush molding which can give slush molded articles with more excellent hydrolysis resistance. The present invention relates to a resin powder composition for slush molding which is characterized by comprising as the main component a thermoplastic polyurethane resin powder, preferably a thermoplastic polyurethane elastomer powder, and containing a polycarbodiimide prepared by polymerizing tetramethylxylylene diisocyanate, alkoxy terminated one having a number average molecular weight of 500 to 30,000.

Abstract translation: 本发明提供了一种用于搪塑的树脂粉末组合物，其可以提供具有更优异的耐水解性的搪塑制品。 本发明涉及一种用于搪塑的树脂粉末组合物，其特征在于，以热塑性聚氨酯树脂粉末为主要成分，优选热塑性聚氨酯弹性体粉末，并含有通过聚合四甲基亚二甲苯基二异氰酸酯制备的聚碳化二亚胺， 平均分子量为500〜30,000。

公开(公告)号：US08304905B2

公开(公告)日：2012-11-06

申请号：US13192049

申请日：2011-07-27

Applicant: Satoshi Matsui ,  Tsuyoshi Eda ,  Akira Matsumoto ,  Yoshitaka Kyougoku ,  Shinji Watanabe ,  Hirokazu Honda

Inventor： Satoshi Matsui ,  Tsuyoshi Eda ,  Akira Matsumoto ,  Yoshitaka Kyougoku ,  Shinji Watanabe ,  Hirokazu Honda

IPC: H01L23/48 ,  H01L29/40

CPC classification number: H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/11622 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13147 ,  H01L2224/1354 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A semiconductor device includes a semiconductor chip, wiring formed thereon, a first insulating film formed on the wiring, provided with a first opening, a pad electrode formed so as to be in contact with the wiring, a second insulating film formed on the pad electrode film, provided with a second opening, and a flip chip bump formed so as to be in contact with the pad electrode film. In this case, the second insulating film exists between the flip chip bump and the pad electrode film, in a region directly underneath the outer edge of the flip chip bump, as seen in a plan view, and the outer edge of the flip chip bump is formed in a region inside the outer edge of the pad electrode film.

Abstract translation: 半导体器件包括半导体芯片，形成在其上的布线，形成在布线上的第一绝缘膜，设置有第一开口，形成为与布线接触的焊盘电极，形成在焊盘电极上的第二绝缘膜 具有第二开口的膜，以及形成为与焊盘电极膜接触的倒装芯片凸块。 在这种情况下，如俯视图所示，第二绝缘膜存在于倒装芯片凸块和焊盘电极膜之间的直接在倒装芯片凸块的外边缘下方的区域中，并且倒装芯片凸块的外边缘 形成在焊盘电极膜的外边缘内的区域中。

公开(公告)号：US08144482B2

公开(公告)日：2012-03-27

申请号：US12227803

申请日：2007-05-14

Applicant: Junya Sato ,  Toru Taura ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

Inventor： Junya Sato ,  Toru Taura ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/144 ,  H01R12/52 ,  H05K1/0218 ,  H05K3/325 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49126

Abstract: A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.

Abstract translation: 电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及 一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板 一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起 和 106）电连接。

公开(公告)号：US08119918B2

公开(公告)日：2012-02-21

申请号：US12066474

申请日：2006-09-01

Applicant: Junya Sato ,  Shinji Watanabe ,  Nobuhiro Mikami ,  Atsumasa Sawada

Inventor： Junya Sato ,  Shinji Watanabe ,  Nobuhiro Mikami ,  Atsumasa Sawada

IPC: H05K1/11

CPC classification number: H01L23/49827 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H05K1/0271 ,  H05K1/115 ,  H05K3/108 ,  H05K3/403 ,  H05K3/421 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09645 ,  H05K2201/09745 ,  H05K2201/09909 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 11, an electrical insulating base material 12 formed on the first wiring layer 11 and including a via base hole 12a that leads to the first wiring layer 11, and a second wiring layer 16 that is formed on the electrical insulating base material 12 and is electrically connected to the first wiring layer 11 through the via base hole 12a. In a region of the second wiring layer 16 disposed at least in the vicinity of the via base hole 12a, a stress relieving portion 17 is formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base material 12 is curved.

Abstract translation: 本发明的目的在于防止电路故障的发生，例如由于印刷电路板是由印刷电路板所产生的各种应力引起的通孔和印刷电路板之间的剥离引起的信号断开等。 弯曲。 印刷电路板包括第一布线层11，形成在第一布线层11上的电绝缘基材12，并且包括通向第一布线层11的通孔基底孔12a和形成在第一布线层11上的第二布线层16 电绝缘基材12，并且通过通孔基底孔12a与第一布线层11电连接。 在至少设置在通孔基底孔12a附近的第二布线层16的区域中，形成有减轻应力消除部分17，该部分减轻了当电绝缘材料时可能产生的弯曲应力，拉伸应力，压缩应力和剪切应力 基材12弯曲。

公开(公告)号：US20100307782A1

公开(公告)日：2010-12-09

申请号：US12867239

申请日：2009-02-16

Applicant: Kazutaka Iwata ,  Kenichirou Yoshida ,  Shinji Watanabe

Inventor： Kazutaka Iwata ,  Kenichirou Yoshida ,  Shinji Watanabe

IPC: B25F5/00 ,  B25B21/00 ,  H02P29/02

CPC classification number: B25F5/00 ,  H02H7/0854 ,  H02P29/0241

Abstract: A current detection circuit (18) detects that a drive current of the stator coil (2d) is exceeding a threshold value Ir. A rotation number detection circuit (17) detects that the number of rotations of a rotor (2a) is lower than a threshold value Nr. A computing part (20) outputs a PWM signal which switches a semiconductor switching element (3a) of the inverter circuit part (3). The computing part (20) changes the threshold values Ir and Nr in accordance with the PWM duty of the PWM signal determined in accordance with a pressed distance of a switch trigger (7) and detects a locked state of the motor (2) on the conditions that the motor current I is exceeding the set threshold value Ir and that the number of rotations N thereof is lower than the threshold value Nr.

Abstract translation: 电流检测电路（18）检测出定子线圈（2d）的驱动电流超过阈值Ir。 旋转数检测电路（17）检测转子（2a）的转数低于阈值Nr。 计算部件（20）输出切换逆变器电路部（3）的半导体开关元件（3a）的PWM信号。 计算部件（20）根据根据开关触发器（7）的按压距离确定的PWM信号的PWM占空比来改变阈值Ir和Nr，并检测电动机（2）的锁定状态 电动机电流I超过设定阈值Ir并且其转数N低于阈值Nr的条件。

公开(公告)号：US07847389B2

公开(公告)日：2010-12-07

申请号：US12093896

申请日：2006-11-13

Applicant: Nobuhiro Mikami ,  Shinji Watanabe ,  Junya Sato ,  Atsumasa Sawada

Inventor： Nobuhiro Mikami ,  Shinji Watanabe ,  Junya Sato ,  Atsumasa Sawada

IPC: H01L23/48

CPC classification number: H01L23/4985 ,  H01L23/49816 ,  H01L24/50 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.

Abstract translation: 即使当安装了半导体封装的衬底弯曲时，电气连接上的应力减轻，从而消除了连接错误并提高了连接的可靠性。 半导体芯片在其第二面具有电极。 能够弯曲和弯曲的支撑块被放置在半导体芯片的第一面的外围边缘上的两个位置处。 放置插入件以跨越支撑块，其中插入其自身和半导体芯片之间的支撑块，并且在柔性树脂膜中具有布线图案。 插入器的两端部被折回到半导体芯片的第二面的一侧，并且其布线图案电连接到半导体芯片的电极。

公开(公告)号：US20090306874A1

公开(公告)日：2009-12-10

申请号：US12340262

申请日：2008-12-19

Applicant: Toru Tanaka ,  Shinji Watanabe ,  Tatsuhiko Takahashi ,  Masayoshi Ito

Inventor： Toru Tanaka ,  Shinji Watanabe ,  Tatsuhiko Takahashi ,  Masayoshi Ito

IPC: F02D45/00

CPC classification number: F02D41/0002 ,  F02D2041/001 ,  F02D2041/1409 ,  F02D2041/1422 ,  F02D2041/2065 ,  Y02T10/42

Abstract: Provided is a control apparatus for an internal combustion engine, capable of improving a response characteristic of a PID feedback control, including: an oil pressure regulating valve having a solenoid; a variable cam phase mechanism for changing a cam phase; and an ECU for controlling the oil pressure regulating valve. The ECU includes: an actual cam phase detecting unit for detecting the cam phase; a target cam phase setting unit for setting a target cam phase; an output duty calculating unit for calculating an output duty; a feedback control unit for controlling the cam phase via the output duty calculating unit with PID feedback control; a coil temperature detecting unit for detecting a temperature of a coil; a circuit resistance calculating unit for calculating a resistance of an electric circuit by correcting a resistance of the coil based upon the temperature of the coil; and an integral term initial value calculating unit for calculating a holding output duty based upon the resistance of the electric circuit. When an integral term is initialized, the feedback control unit sets the holding output duty as the integral term.

Abstract translation: 提供一种能够提高PID反馈控制的响应特性的内燃机的控制装置，包括：具有螺线管的油压调节阀; 用于改变凸轮相位的可变凸轮相位机构; 以及用于控制油压调节阀的ECU。 ECU包括：用于检测凸轮相位的实际凸轮相位检测单元; 目标凸轮相位设定单元，用于设定目标凸轮相位; 用于计算输出占空比的输出占空比计算单元; 反馈控制单元，用于经由具有PID反馈控制的输出占空比计算单元控制凸轮相位; 线圈温度检测单元，用于检测线圈的温度; 电路电阻计算单元，用于通过基于线圈的温度校正线圈的电阻来计算电路的电阻; 以及积分项初始值计算单元，用于基于电路的电阻来计算保持输出占空比。 当积分项被初始化时，反馈控制单元将保持输出占空比设置为积分项。

公开(公告)号：US07603980B2

公开(公告)日：2009-10-20

申请号：US11303987

申请日：2005-12-19

Applicant: Shinji Watanabe

Inventor： Shinji Watanabe

IPC: F02D11/10 ,  G06F19/00

CPC classification number: F02D9/02 ,  F02D11/107 ,  F02D2200/0404 ,  F02D2200/602 ,  F02D2400/08

Abstract: An electronic throttle control apparatus includes first and second throttle position sensors that detect an opening of a throttle valve for adjusting an amount of supply air to an internal combustion engine, a throttle control unit that controls to drive the throttle valve, first and second accelerator position sensors that detect an operation amount of an accelerator pedal, and an ECU that calculates control parameters for the internal combustion engine on the basis of internal combustion engine operation information including an accelerator opening and a throttle opening and controls a throttle actuator such that a throttle opening position coincides with a target throttle opening position included in the control parameters. The ECU surely detects an abnormality in a sensor output due to contact failure or the like of the throttle position sensors and the accelerator position sensors. As a result, it is possible to provide an electronic throttle control apparatus that can prevent an unintended increase in the number of revolutions of the internal combustion engine, an engine trouble, and the like.

Abstract translation: 一种电子节气门控制装置，包括：第一和第二节气门位置传感器，其检测用于调节向内燃机供给的空气量的节流阀的开度;控制驱动节流阀的节气门控制单元;第一和第二加速器位置 检测加速器踏板的操作量的传感器，以及基于包括加速器开度和节气门开度的内燃机运转信息来计算内燃机的控制参数的ECU，并且控制节流阀致动器，使得节气门开度 位置与包括在控制参数中的目标节气门打开位置一致。 由于节气门位置传感器和加速器位置传感器的接触不良等，ECU确实检测出传感器输出的异常。 结果，能够提供能够防止内燃机的转速的意外增加，发动机故障等的电子节气门控制装置。

公开(公告)号：US20090135573A1

公开(公告)日：2009-05-28

申请号：US12227803

申请日：2007-05-14

Applicant: Junya Sato ,  Toru Taura ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

Inventor： Junya Sato ,  Toru Taura ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01R12/52 ,  H05K1/0218 ,  H05K3/325 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49126

Abstract: A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.

Abstract translation: 电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及 一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板 一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起 和 106）电连接。