公开(公告)号：US08253229B2

公开(公告)日：2012-08-28

申请号：US11976249

申请日：2007-10-23

申请人： Takaharu Yamano ,  Tsuyoshi Kobayashi

发明人： Takaharu Yamano ,  Tsuyoshi Kobayashi

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： In a stacked layer type semiconductor package constructed by stacking a plurality of packages with each other, the plurality of packages include a semiconductor package including: a semiconductor chip; a substrate in which a concave portion has been formed, the semiconductor chip being mounted in the concave portion; and a wiring line structure constructed in such a manner that the wiring line structure can be externally connected to the semiconductor chip at least just above and just under the semiconductor chip.

摘要翻译： 在通过将多个封装彼此堆叠而构成的堆叠层型半导体封装中，所述多个封装包括半导体封装，包括：半导体芯片; 形成有凹部的基板，将半导体芯片安装在凹部内; 以及以这样的方式构成的布线线路结构，使得布线线结构可以至少刚好在半导体芯片的正上方和外部连接到半导体芯片。

公开(公告)号：US08211825B2

公开(公告)日：2012-07-03

申请号：US12401255

申请日：2009-03-10

申请人： Wu Mei ,  Taishi Fukazawa ,  Itsuko Mizutani ,  Tsuyoshi Kobayashi ,  Yoshihiko Nakano ,  Mina Farag ,  Shinji Aoki ,  Yi-Qun Li

发明人： Wu Mei ,  Taishi Fukazawa ,  Itsuko Mizutani ,  Tsuyoshi Kobayashi ,  Yoshihiko Nakano ,  Mina Farag ,  Shinji Aoki ,  Yi-Qun Li

IPC分类号： B01J23/42 ,  B01J23/58 ,  B01J23/00 ,  B01J23/20

CPC分类号： H01M4/921 ,  B01J21/18 ,  B01J23/6486 ,  B01J23/6525 ,  B01J23/6527 ,  B01J23/898 ,  B01J23/8993 ,  B01J35/006 ,  B82Y30/00 ,  C22C5/04 ,  H01M4/9041 ,  H01M4/925 ,  H01M4/926

摘要： A methanol oxidation catalyst comprises a material of composition: PtxMzTau in which Pt is platinum, Ta is tantalum, M is an element includes at least one selected from the group consisting of V (vanadium), W (tungsten), Ni (nickel) and Mo (molybdenum), x is 40 to 98 at. %, z is 1.5 to 55 at. %, and u is 0.5 to 40 at. %. To maximize catalytic activity the material is preferably in the form of nanoparticles. The values of x, z and u are selected such that the element exhibits X-ray photoelectron spectroscopy peaks derived from an oxygen bond and a metal bond in which a peak area derived from the oxygen bond is twice or less of a peak area derived from the metal bond.

摘要翻译： 甲醇氧化催化剂包括组成为PtxMzTau的材料，其中Pt是铂，Ta是钽，M是元素，包括选自V（钒），W（钨），Ni（镍）和 Mo（钼），x为40〜98原子。 ％，z为1.5〜55at。 ％，u为0.5〜40at。 ％。 为了最大化催化活性，该材料优选为纳米颗粒的形式。 选择x，z和u的值，使得该元件显示衍生自氧键和金属键的X射线光电子能谱峰，其中衍生自氧键的峰面积是衍生自氧键的峰面积的两倍或更少 金属键。

公开(公告)号：US08211246B2

公开(公告)日：2012-07-03

申请号：US13049518

申请日：2011-03-16

申请人： Masaya Hagiwara ,  Shinya Sakurada ,  Yosuke Horiuchi ,  Keiko Okamoto ,  Tsuyoshi Kobayashi ,  Shiori Kaji

发明人： Masaya Hagiwara ,  Shinya Sakurada ,  Yosuke Horiuchi ,  Keiko Okamoto ,  Tsuyoshi Kobayashi ,  Shiori Kaji

IPC分类号： H01F1/055

CPC分类号： H02K1/02 ,  C21D8/1205 ,  C22C1/02 ,  C22C28/00 ,  C22C33/04 ,  C22C38/005 ,  C22C38/02 ,  C22C38/04 ,  C22C38/10 ,  C22C38/14 ,  C22C38/16 ,  C22C2202/02 ,  H01F1/0596 ,  H02K1/2766

摘要： In one embodiment, a permanent magnet has a composition represented by (Sm1-xRx)(FepMqCurCo1-p-q-r)z, where R is at least one element selected from Nd and Pr, M is at least one element selected from Ti, Zr and Hf, and 0.22≦p≦0.45, 0.005≦q≦0.05, 0.01 ≦r≦0.1, 0.05≦x

摘要翻译： 在一个实施例中，永磁体具有由（Sm1-xRx）（FepMqCurCo1-pqr）z表示的组成，其中R是选自Nd和Pr中的至少一种元素，M是选自Ti，Zr和Hf中的至少一种元素 ，和0.22＆nlE; p＆nlE; 0.45,0.005＆nlE; q＆nlE; 0.05,0.01＆nlE; r＆nlE; 0.1,0.05＆amp; nlE; x <0.5和7＆amp; nlE; z＆nlE; 永磁体包括Th2Zn17晶相作为主相，以及粉末X射线衍射中的Th2Zn17结晶相的（113）面衍射峰强度I（113）与衍射峰强度I（300）的比例 粉末X射线衍射中的（300）平面在0.9＆amp; 11E的范围内; I（113）/ I（300）＆nlE; 1.7。

公开(公告)号：US20120075046A1

公开(公告)日：2012-03-29

申请号：US13049518

申请日：2011-03-16

申请人： Masaya Hagiwara ,  Shinya Sakurada ,  Yosuke Horiuchi ,  Keiko Okamoto ,  Tsuyoshi Kobayashi ,  Shiori Kaji

发明人： Masaya Hagiwara ,  Shinya Sakurada ,  Yosuke Horiuchi ,  Keiko Okamoto ,  Tsuyoshi Kobayashi ,  Shiori Kaji

IPC分类号： H01F7/02

CPC分类号： H02K1/02 ,  C21D8/1205 ,  C22C1/02 ,  C22C28/00 ,  C22C33/04 ,  C22C38/005 ,  C22C38/02 ,  C22C38/04 ,  C22C38/10 ,  C22C38/14 ,  C22C38/16 ,  C22C2202/02 ,  H01F1/0596 ,  H02K1/2766

摘要： In one embodiment, a permanent magnet has a composition represented by (Sm1-xRx)(FepMqCurCo1·p·q·r)z, where R is at least one element selected from Nd and Pr, M is at least one element selected from Ti, Zr and Hf, and 0.22≦p≦0.45, 0.005≦q≦0.05, 0.01≦r≦0.1, 0.05≦x

摘要翻译： 在一个实施例中，永磁体具有由（Sm1-xRx）（FepMqCurCo1·p·q·r）z表示的组成，其中R是选自Nd和Pr中的至少一种元素，M是选自Ti ，Zr和Hf，和0.22＆nlE; p＆nlE; 0.45,0.005＆nlE; q＆nlE; 0.05,0.01＆nlE; r＆nlE; 0.1,0.05＆nlE; x <0.5和7＆ 永磁体包括Th2Zn17晶相作为主相，以及粉末X射线衍射中的Th2Zn17结晶相的（113）面衍射峰强度I（113）与衍射峰强度I（300）的比例 粉末X射线衍射中的（300）平面在0.9＆amp; 11E的范围内; I（113）/ I（300）＆nlE; 1.7。

公开(公告)号：US08115300B2

公开(公告)日：2012-02-14

申请号：US11763053

申请日：2007-06-14

申请人： Shigetsugu Muramatsu ,  Tsuyoshi Kobayashi ,  Takashi Kurihara

发明人： Shigetsugu Muramatsu ,  Tsuyoshi Kobayashi ,  Takashi Kurihara

IPC分类号： H01L23/12

CPC分类号： H05K3/4647 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/48227 ,  H05K1/111 ,  H05K3/108 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09909 ,  Y02P70/611

摘要： In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wiring patterns are formed are covered with an insulating layer. Surfaces of connection parts of the wiring patterns formed on the tops of the protrusions are formed with the surfaces of the connection parts exposed to a surface of the insulating layer on a level with the surface of the insulating layer or in a position lower than the surface of the insulating layer. The connection parts are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element is mounted by making electrical connection to the connection parts by flip chip bonding.

摘要翻译： 在半导体装置中，将半导体元件安装在布线基板上。 布线图案和突起形成在基板的表面上，布线图案在突起的顶部延伸。 其上形成有布线图案的基板的表面被绝缘层覆盖。 形成在突起的顶部上的布线图形的连接部分的表面形成有连接部分的表面暴露于绝缘层的表面与绝缘层的表面或低于表面的位置 的绝缘层。 连接部分形成为与半导体元件的连接电极对准形成的用于连接的焊盘。 半导体元件通过倒装芯片接合与连接部分进行电连接来安装。

公开(公告)号：US07882627B2

公开(公告)日：2011-02-08

申请号：US12007040

申请日：2008-01-04

申请人： Tetsuya Koyama ,  Tsuyoshi Kobayashi ,  Hiroyuki Kato ,  Yoshihiro Machida

发明人： Tetsuya Koyama ,  Tsuyoshi Kobayashi ,  Hiroyuki Kato ,  Yoshihiro Machida

IPC分类号： H01K3/00

CPC分类号： H05K3/4614 ,  H05K3/462 ,  H05K3/4647 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1327 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

摘要： First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.

摘要翻译： 首先，制造单层布线板，其具有在绝缘基材的两侧形成为所需形状的布线层; 以及在所述绝缘基体的一侧上的所述布线层上形成的金属凸块。 然后，准备并堆叠所需数量的单层板。 在这种情况下，准备设置在最上层的板，而不具有金属凸块。 这些板被定位和堆叠，使得相邻板中的一个的金属凸块连接到另一个板的对应的布线层。 此后，将树脂填充到堆叠板之间的间隙中，并且在通过上述步骤获得的多层板的两侧上形成绝缘层，以覆盖除了布线上的预定位置限定的焊盘区域之外的整个表面 层。

公开(公告)号：US07847384B2

公开(公告)日：2010-12-07

申请号：US11465284

申请日：2006-08-17

申请人： Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Takaharu Yamano

发明人： Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Takaharu Yamano

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049

摘要： A semiconductor package 100 is constructed of a semiconductor chip 110, a sealing resin 106 for sealing this semiconductor chip 110, and wiring 105 formed inside the sealing resin 106. And, the wiring 105 is constructed of pattern wiring 105b connected to the semiconductor chip 110 and also formed so as to be exposed to a lower surface 106b of the sealing resin 106, and a post part 105a formed so as to extend in a thickness direction of the sealing resin 106, the post part in which one end is connected to the pattern wiring 105b and also the other end is formed so as to be exposed to an upper surface 106a of the sealing resin 106.

摘要翻译： 半导体封装100由半导体芯片110，用于密封该半导体芯片110的密封树脂106和形成在密封树脂106内部的布线105构成。布线105由连接到半导体芯片110的图案布线105b构成 并且还形成为暴露于密封树脂106的下表面106b，以及沿密封树脂106的厚度方向延伸形成的柱部105a，其一端连接到密封树脂106的后部 图案布线105b，另一端形成为暴露于密封树脂106的上表面106a。

公开(公告)号：US07846862B2

公开(公告)日：2010-12-07

申请号：US11863856

申请日：2007-09-28

申请人： Wu Mei ,  Taishi Fukazawa ,  Itsuko Mizutani ,  Tsuyoshi Kobayashi ,  Yoshihiko Nakano ,  Mina Farag ,  Yi-Qun Li ,  Shinji Aoki

发明人： Wu Mei ,  Taishi Fukazawa ,  Itsuko Mizutani ,  Tsuyoshi Kobayashi ,  Yoshihiko Nakano ,  Mina Farag ,  Yi-Qun Li ,  Shinji Aoki

IPC分类号： H01M4/02 ,  H01M4/36 ,  H01M4/92 ,  H01M4/90 ,  C22C5/04 ,  B01J23/00 ,  B01J23/40 ,  B01J23/42 ,  B01J23/44 ,  B01J21/18 ,  B01J23/74 ,  B01J27/185 ,  B01J27/02

CPC分类号： B01J23/652 ,  B01J21/18 ,  B01J23/648 ,  B01J23/8993 ,  B82Y30/00 ,  H01M4/921 ,  H01M4/925 ,  H01M8/1011 ,  Y02E60/523 ,  Y02P70/56 ,  Y10T428/13

摘要： A methanol oxidation catalyst is provided, which includes nanoparticles having a composition represented by the following formula 1: PtxRuyTzQu   formula 1 In the formula 1, the T-element is at least one selected from a group consisting of Mo, W and V and the Q-element is at least one selected from a group consisting of Nb, Cr, Zr and Ti, x is 40 to 90 at. %, y is 0 to 9.9 at. %, z is 3 to 70 at. % and u is 0.5 to 40 at. %. The area of the peak derived from oxygen bond of T-element is 80% or less of the area of the peak derived from metal bond of T-element in a spectrum measured by an X-ray photoelectron spectral method.

摘要翻译： 提供了甲醇氧化催化剂，其包括具有由下式1表示的组成的纳米颗粒：PtxRuyTzQu式1在式1中，T元素是选自Mo，W和V中的至少一种，Q - 元素为选自Nb，Cr，Zr和Ti中的至少一种，x为40〜90at。 ％，y为0〜9.9。 ％，z为3〜70at。 ％，u为0.5〜40at。 ％。 由X元素的氧键衍生的峰的面积是通过X射线光电子能谱法测定的光谱中T元素的金属键衍生峰的面积的80％以下。

公开(公告)号：US20100284579A1

公开(公告)日：2010-11-11

申请号：US11996731

申请日：2006-07-12

申请人： Tsuyoshi Kobayashi

发明人： Tsuyoshi Kobayashi

IPC分类号： G06K9/00 ,  G06K9/40

CPC分类号： G06T7/0012 ,  A61B6/502 ,  A61B6/563 ,  G06T7/11 ,  G06T7/155 ,  G06T2207/10116 ,  G06T2207/30068 ,  G06T2207/30096

摘要： It is possible to improve processing efficiency and detection accuracy during detection of an abnormal shade candidate. In an image processing device (2), an inputted breast image is reduced and subjected to a smoothing processing by using a first and a second smoothing filter so as to extract a detection object region of an abnormal shade candidate. After this, in the extracted region, an abnormal shade candidate is detected by using a curved filter and an abnormal shade candidate region is detected. The detection result is displayed.

摘要翻译： 可以提高检测异常阴影候选者的处理效率和检测精度。 在图像处理装置（2）中，通过使用第一和第二平滑滤波器，减少输入的乳房图像并进行平滑化处理，以提取异常候选色调的检测对象区域。 之后，在提取区域中，通过使用弯曲滤波器检测出异常候选色，并且检测到异常色候候选区域。 显示检测结果。

公开(公告)号：US07772970B2

公开(公告)日：2010-08-10

申请号：US11783111

申请日：2007-04-05

申请人： Toshio Masuda ,  Kenichi Yamamoto ,  Kenji Hijikata ,  Satoshi Satomura ,  Hiroshi Oishi ,  Toyohide Sunaguchi ,  Yoshio Iwakami ,  Munenori Homma ,  Kouji Kaneda ,  Atsushi Atake ,  Tatsuru Fukuda ,  Masayuki Ushiki ,  Minoru Yuki ,  Tsuyoshi Kobayashi ,  Masahito Motoi ,  Naoki Shibata ,  Hiroshi Ogiwara ,  Katsumasa Igarashi ,  Junzo Shinozuka ,  Akihisa Nakamura

发明人： Toshio Masuda ,  Kenichi Yamamoto ,  Kenji Hijikata ,  Satoshi Satomura ,  Hiroshi Oishi ,  Toyohide Sunaguchi ,  Yoshio Iwakami ,  Munenori Homma ,  Kouji Kaneda ,  Atsushi Atake ,  Tatsuru Fukuda ,  Masayuki Ushiki ,  Minoru Yuki ,  Tsuyoshi Kobayashi ,  Masahito Motoi ,  Naoki Shibata ,  Hiroshi Ogiwara ,  Katsumasa Igarashi ,  Junzo Shinozuka ,  Akihisa Nakamura

IPC分类号： B60Q1/00

CPC分类号： F02D11/105 ,  B60K2350/1092 ,  F02D2200/604 ,  Y02T10/84

摘要： The present invention provides a vehicle display device which can display fuel consumption information of a vehicle in a useful and optimum mode for a driver. A meter_EUC calculates an instantaneous fuel consumption of a vehicle based on a mileage and a fuel injection quantity within a set time, calculates an average fuel consumption of the vehicle based on respective cumulative values of the mileage and the fuel injection quantity repeatedly calculated for every set time, and displays the deviation of the instantaneous fuel consumption with respect to the average fuel consumption as fuel consumption information on a fuel consumption meter. The display on the fuel consumption meter is performed by swinging a pointer with respect to a neutral position. When the deviation takes a positive value, the pointer is swung in the pulse direction with a swinging width corresponding to the deviation quantity, while when the deviation takes a negative value, the pointer is swung in the minus direction with a swinging width corresponding to the deviation quantity.

摘要翻译： 本发明提供一种能够以驾驶员的有用且最佳模式显示车辆的燃料消耗信息的车辆显示装置。 根据在设定时间内的里程和燃料喷射量计算车辆的瞬时燃料消耗量，根据对于每个集合重复计算的里程和燃料喷射量的累计值，计算出车辆的平均燃料消耗量 时间，并且将相对于平均燃料消耗的瞬时燃料消耗的偏差显示为燃料消耗计量器上的燃料消耗信息。 通过相对于中立位置摆动指针来执行燃料消耗计的显示。 当偏差为正值时，指针以对应于偏差量的摆动宽度在脉冲方向上摆动，而当偏差为负值时，指针以负方向摆动，摆动宽度对应于 偏差量。