公开(公告)号：US09921114B2

公开(公告)日：2018-03-20

申请号：US15388629

申请日：2016-12-22

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yoshihiko Fuji ,  Kei Masunishi ,  Hideaki Fukuzawa ,  Yoshihiro Higashi ,  Michiko Hara ,  Akio Hori ,  Tomohiko Nagata ,  Shiori Kaji ,  Akiko Yuzawa

IPC: G01L1/22 ,  G01L1/12 ,  G01L5/16 ,  G01L9/00 ,  H04R1/02 ,  H04R1/04 ,  H04R7/00 ,  H04R19/00 ,  G06F3/041 ,  A61B5/00 ,  A61B5/021 ,  A61B5/024 ,  G01L1/20 ,  H04R19/04

CPC classification number: G01L1/2287 ,  A61B5/02141 ,  A61B5/02438 ,  A61B5/7475 ,  G01L1/12 ,  G01L1/205 ,  G01L1/2262 ,  G01L1/2293 ,  G01L5/161 ,  G01L9/0051 ,  G06F3/041 ,  G06F3/0414 ,  G06F2203/04105 ,  H04R1/028 ,  H04R1/04 ,  H04R7/00 ,  H04R19/005 ,  H04R19/04 ,  H04R2499/11

Abstract: According to one embodiment, a pressure sensor includes a film part, and a sensing unit. A circumscribing rectangle circumscribing a configuration of a film surface of the film part has a first side, a second side, a third side connected to one end of the first side and one end of the second side, a fourth side connected to one other end of the first side and one other end of the second side, and a centroid of the circumscribing rectangle. The circumscribing rectangle includes a first region enclosed by the first side, line segments connecting the centroid to the one end of the first side, and to the one other end of the first side. The sensing unit includes sensing elements provided on a portion of the film surface overlapping the first region. Each sensing element includes a first, second magnetic layers, and a spacer layer.

公开(公告)号：US09918168B1

公开(公告)日：2018-03-13

申请号：US15417189

申请日：2017-01-26

Applicant: Rui Zhang ,  Ting Kang

Inventor： Rui Zhang ,  Ting Kang

IPC: H04R19/04 ,  H04R19/00 ,  H04R1/04 ,  B81B5/00 ,  H04R1/22 ,  H04R1/38

CPC classification number: H04R19/04 ,  B81B5/00 ,  B81B2201/0257 ,  B81B2203/053 ,  B81B2203/06 ,  H04R1/04 ,  H04R1/222 ,  H04R1/38 ,  H04R19/005 ,  H04R2201/003 ,  H04R2499/11

Abstract: A microphone is disclosed. The microphone includes a housing and a circuit board cooperatively forming an accommodation space to accommodate a MEMS chip. The housing forms a first sound channel and the circuit board forms a second sound channel. Further, the microphone includes a controller for controlling the switch of the first and second sound channels.

公开(公告)号：US20180070162A1

公开(公告)日：2018-03-08

申请号：US15813103

申请日：2017-11-14

Applicant: Knowles Electronics, LLC

Inventor： Tony K. Lim ,  Norman Dannis Talag

IPC: H04R1/08 ,  H04R19/04 ,  H04R1/04 ,  G01L9/00

CPC classification number: H04R1/086 ,  G01L9/0042 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2499/11 ,  H01L2224/45099

Abstract: A microphone includes a base and a microelectromechanical system (MEMS) die and an integrated circuit (IC) disposed on the base. The microphone also includes a cover mounted on the base and covering the MEMS die and the IC. The cover includes an indented region or an inwardly drawn region that define a top port through which acoustic energy can enter the microphone and be incident on the MEMS die. The microphone also includes a filtering material disposed on the top port on an outside surface of the cover and within the indented region or the inwardly drawn region. The filtering material provides resistance to ingression of solid particles or liquids into the microphone.

公开(公告)号：US09910636B1

公开(公告)日：2018-03-06

申请号：US15179092

申请日：2016-06-10

Applicant: Jeremy M. Chevalier

Inventor： Jeremy M. Chevalier

IPC: H04R1/10 ,  G06F3/16 ,  H04R1/02 ,  H04R1/04 ,  H04R1/08

CPC classification number: G06F3/167 ,  G06F3/162 ,  H04R1/028 ,  H04R1/04 ,  H04R1/083 ,  H04R1/1008 ,  H04R1/1041 ,  H04R5/033 ,  H04R2201/023 ,  H04R2420/07

Abstract: A control device for a portable digital media player is contained within a communications headset attached to a first ear of a user and complimented by an interpreter circuit adaptively paired with that media player. A microphone, located within the headset, is configured to receive vocal commands from the user and transmit those commands, via any wireless communication technology, to the interpreter interface removably inserted into a specialized port of the media player. The electronic circuitry within the adapter searches the input for recognizable phrases which have been pre-programmed to exert control over the media player. The adapter then converts the proper input into control signals for execution in the media player. The output of the media player is wirelessly transmitted back to the headset for the auditory enjoyment of the user. The headset is equipped with an auxiliary earpiece which is configured to wirelessly receive at least a portion of the media player output to accomplish a stereoscopic presentation when that earpiece is inserted into the auditory canal of a second ear.

公开(公告)号：US20180014123A1

公开(公告)日：2018-01-11

申请号：US15202404

申请日：2016-07-05

Applicant: Knowles Electronics, LLC

Inventor： Mohammad SHAJAAN ,  Claus Erdmann FÜRST ,  Per Flemming HØVESTEN ,  Kim Spetzler BERTHELSEN ,  Henrik THOMSEN

IPC: H04R3/02

CPC classification number: H04R3/02 ,  H03F3/34 ,  H03F3/70 ,  H03G3/30 ,  H03M1/181 ,  H03M3/464 ,  H03M3/48 ,  H03M3/49 ,  H04R1/04 ,  H04R3/04

Abstract: A microphone assembly includes a transducer element and a processing circuit. The processing circuit includes an analog-to-digital converter (ADC) configured to receive, sample and quantize a microphone signal generated by the transducer element to generate a corresponding digital microphone signal. The processing circuit includes a feedback path including a digital loop filter configured to receive and filter the digital microphone signal to provide a first digital feedback signal and a digital-to-analog converter (DAC) configured to convert the first digital feedback signal into a corresponding analog feedback signal. The processing circuit additionally includes a summing node at the transducer output configured to combine the microphone signal and the analog feedback signal.

公开(公告)号：US20170374469A1

公开(公告)日：2017-12-28

申请号：US15682422

申请日：2017-08-21

Applicant: Knowles Electronics, LLC

Inventor： Sagnik Pal ,  Sung Bok Lee

IPC: H04R7/24 ,  H04R19/00 ,  H04R1/04 ,  H04R7/12

CPC classification number: H04R7/24 ,  H04R1/04 ,  H04R7/122 ,  H04R19/005

Abstract: An acoustic apparatus includes a back plate, a diaphragm, and at least one pillar. The diaphragm and the back plate are disposed in spaced relation to each other. At least one pillar is configured to at least temporarily connect the back plate and the diaphragm across the distance. The diaphragm stiffness is increased as compared to a diaphragm stiffness in absence of the pillar. The at least one pillar provides a clamped boundary condition when the diaphragm is electrically biased and the clamped boundary is provided at locations where the diaphragm is supported by the at least one pillar.

公开(公告)号：US20170365910A1

公开(公告)日：2017-12-21

申请号：US15187063

申请日：2016-06-20

Applicant: Shure Acquisition Holdings, Inc.

Inventor： Christopher Zachara ,  Gregory W. Bachman

IPC: H01Q1/22 ,  H01Q1/50 ,  H01Q1/36 ,  H04B1/3827 ,  H01Q5/50

CPC classification number: H01Q1/2291 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q5/50 ,  H04B1/3833 ,  H04R1/00 ,  H04R1/04 ,  H04R2420/07

Abstract: Embodiments include a wireless microphone comprising an elongated main body configured for handheld operation of the microphone; a display bezel area included in the main body; a first antenna positioned at a bottom end of the main body; and a second antenna integrated into the display bezel area. Embodiments also include a wireless handheld microphone comprising a main body having a conductive housing and a tubular shape configured for handheld operation of the microphone; an opening included on a side surface of the conductive housing; a non-conductive cover coupled to the conductive housing and configured to cover the opening; and an antenna positioned adjacent to the non-conductive cover.

公开(公告)号：US09832556B2

公开(公告)日：2017-11-28

申请号：US15178728

申请日：2016-06-10

Applicant: KABUSHIKI KAISHA AUDIO-TECHNICA

Inventor： Hiroshi Akino

IPC: H04R1/04 ,  H04R1/08 ,  H01R13/187 ,  H01R13/627 ,  H01R24/76

CPC classification number: H04R1/04 ,  H01R13/187 ,  H01R13/6277 ,  H01R24/76 ,  H04R1/08 ,  H04R2201/025

Abstract: There are provided a microphone stand having a connector supporting groove, and a microphone body supported by the microphone stand as a result of insertion of a connector case into the connector supporting groove. A resilient conductive cloth which comes into contact with the connector case is arranged in the connector supporting groove, with the connector case inserted in the connector supporting groove. The conductive cloth is preferably arranged in a ring shape along a lower bottom portion of the annularly formed connector supporting groove. This configuration mitigates rattling generated between the connector supporting groove and the connector case, thereby suppressing generation of a vibration noise due to microphone shaking.

公开(公告)号：US20170332176A1

公开(公告)日：2017-11-16

申请号：US15585333

申请日：2017-05-03

Applicant: Robert Bosch GmbH

Inventor： Daniel Pantel ,  Fabian Purkl ,  Kerrin Doessel

IPC: H04R17/02 ,  H01L41/113 ,  H01L41/053 ,  H01L41/23 ,  H04R1/04

CPC classification number: H04R17/02 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L41/0533 ,  H01L41/1132 ,  H01L41/1134 ,  H01L41/23 ,  H01L2224/48137 ,  H04R1/04 ,  H04R17/025 ,  H04R31/00 ,  H04R2201/003

Abstract: A micromechanical component having a substrate which includes a micro-electromechanical microphone structure, the micro-electromechanical microphone structure encompassing at least one piezoelectric layer and at least one polymer mass as at least part of a packaging of the substrate fitted with the micro-electromechanical microphone structure, which is in contact with at least a partial outer surface of the substrate fitted with the micro-electromechanical microphone structure. A method is also described for packaging a substrate having a micro-electromechanical microphone structure encompassing at least one piezoelectric layer by developing at least a portion of a packaging of the substrate fitted with the micro-electromechanical microphone structure from at least one polymer mass, and the at least one polymer mass being applied directly on at least a partial outer surface of the substrate fitted with the micro-electromechanical microphone structure.

公开(公告)号：US09804003B2

公开(公告)日：2017-10-31

申请号：US14687438

申请日：2015-04-15

Applicant: Apple Inc.

Inventor： Henry H. Yang

IPC: G01D11/30 ,  G01D11/24 ,  H04R1/04 ,  G01N33/00 ,  H04R1/02

CPC classification number: G01D11/245 ,  G01D11/30 ,  G01N33/0004 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/15192 ,  H01L2924/16151 ,  H01L2924/16251 ,  H04M2250/12 ,  H04R1/021 ,  H04R1/04 ,  H04R2499/11

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.