公开(公告)号：US06806428B1

公开(公告)日：2004-10-19

申请号：US09719631

申请日：2001-02-12

申请人： Suzushi Kimura ,  Tsuyoshi Himori ,  Koji Hashimoto

发明人： Suzushi Kimura ,  Tsuyoshi Himori ,  Koji Hashimoto

IPC分类号： H05K116

CPC分类号： H05K1/184 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/161 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

摘要： The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.

摘要翻译： 本发明涉及一种具有埋入电路板中的芯片组件的模块组件及其制造方法，更具体地说，涉及一种能够获得希望的电路特性并能够稳定地工作的模块组件，如果该组件的尺寸减小 ，非常有效地生产并且适合于机器安装及其制造方法。 根据本发明，由于根据规定通过设置特定数量的芯片部件来构成所需的电路，因此在形成模块时不需要在高温下加热埋层芯片部件，以特定值获得芯片部件 ，并且电路特性，功能和尺寸精度都按照设计得到稳定的获得，而且由于芯片部件按照规定进行配置，因此即使是 芯片部件的尺寸减小，并且仅通过改变芯片部件的插入位置和类型可以灵活且容易地改变电路组成。

公开(公告)号：US06546622B2

公开(公告)日：2003-04-15

申请号：US09808980

申请日：2001-03-16

申请人： Masahiro Iba ,  Hisashi Wakako ,  Kazuhisa Sato ,  Haruhiko Murata ,  Kazuyuki Takahashi ,  Kenzo Kawaguchi

发明人： Masahiro Iba ,  Hisashi Wakako ,  Kazuhisa Sato ,  Haruhiko Murata ,  Kazuyuki Takahashi ,  Kenzo Kawaguchi

IPC分类号： H05K302

CPC分类号： H01L23/5383 ,  H01L2224/16225 ,  H05K1/0266 ,  H05K3/28 ,  H05K3/381 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2203/107 ,  H05K2203/122 ,  H05K2203/161 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158

摘要： A printed-wiring substrate 1 includes internal dielectric resin layers 12 and 14. A main-surface-side external dielectric resin layer 13 is formed on the internal dielectric resin layer 12 such that the surface thereof serves as a substrate main-surface 1A. A back-surface-side external dielectric resin layer 15 is formed on the internal dielectric resin layer 14 such that the surface thereof serves as a substrate back-surface 1B. A surface 12A of the main-surface-side internal dielectric resin layer 12 and a surface 14A of the back-surface-side internal dielectric resin layer 14 are roughened. The substrate main-surface 1A and the substrate back-surface 1B are roughened such that surface roughness thereof is lower than that of the surfaces 12A and 14A.

摘要翻译： 印刷布线基板1包括内部电介质树脂层12和14.主表面侧外部电介质树脂层13形成在内部电介质树脂层12上，使得其表面用作基板主表面1A。 在内部电介质树脂层14上形成背面侧外部电介质树脂层15，使其表面作为基板背面1B。 主表面侧内部电介质树脂层12的表面12A和背面侧内部电介质树脂层14的表面14A被粗糙化。 基板主表面1A和基板背面1B被粗糙化，使得表面粗糙度低于表面12A和14A的表面粗糙度。

公开(公告)号：US20030058311A1

公开(公告)日：2003-03-27

申请号：US10253544

申请日：2002-09-25

发明人： Chih-Ching Chen ,  Yi-Jing Leu

IPC分类号： B41J002/175

CPC分类号： B41J2/17546 ,  B41J2/1753 ,  H05K1/0266 ,  H05K3/28 ,  H05K2203/122 ,  H05K2203/161

摘要： An inkjet print cartridge and a method of identifying the colors of ink contained therein by a color flexible PCB are disclosed. The inkjet cartridge includes a casing and a flexible printed circuit board (PCB). The casing has an ink reservoir for containing ink. The flexible PCB, disposed to the casing, includes a flexible substrate, a conductive trace, and a printing ink layer, wherein the flexible substrate has a first surface, and the conductive trace is formed thereon. The printing ink layer is formed on the first surface of the flexible substrate, and the first surface is partially covered by the printing ink layer to bare parts of the conductive trace. Also, at least one identifiable area is formed at the printing ink layer for identification, wherein the color of the identifiable area is associated with the color of ink in the ink reservoir.

摘要翻译： 公开了一种喷墨打印盒和通过彩色柔性PCB识别其中容纳的墨的颜色的方法。 喷墨墨盒包括壳体和柔性印刷电路板（PCB）。 壳体具有用于容纳墨水的墨水容器。 布置在壳体上的柔性PCB包括柔性基板，导电迹线和印刷油墨层，其中柔性基板具有第一表面，并且导电迹线形成在其上。 印刷油墨层形成在柔性基板的第一表面上，并且第一表面被印刷油墨层部分地覆盖到导电迹线的裸露部分。 此外，在印刷油墨层上形成至少一个可识别区域用于识别，其中可识别区域的颜色与油墨储存器中的油墨颜色相关。

公开(公告)号：US20030024732A1

公开(公告)日：2003-02-06

申请号：US10254851

申请日：2002-09-26

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Ryoji Ninomiya

IPC分类号： H05K007/06

CPC分类号： H05K1/0246 ,  H05K1/0231 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/0269 ,  H05K1/112 ,  H05K1/162 ,  H05K3/28 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2201/10022 ,  H05K2201/10636 ,  H05K2203/161 ,  Y02P70/611

摘要： An insulation layer is formed on a ground layer. The insulation layer includes first and second regions for forming wiring layers. The impedance of a wiring layer formed on the second region is lower than that of a wiring layer formed on the first region. A signal line pattern is formed on the wiring layer on the first region of the insulation layer. A power supply plane is formed on the wiring layer on the second region of the insulation layer in order to feed power to the signal line pattern through a termination resistor connected to the signal line pattern.

公开(公告)号：US06480396B2

公开(公告)日：2002-11-12

申请号：US09803024

申请日：2001-03-12

申请人： Ryoji Ninomiya

发明人： Ryoji Ninomiya

IPC分类号： H05K702

CPC分类号： H05K1/0246 ,  H05K1/0231 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/0269 ,  H05K1/112 ,  H05K1/162 ,  H05K3/28 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2201/10022 ,  H05K2201/10636 ,  H05K2203/161 ,  Y02P70/611

摘要： An insulation layer is formed on a ground layer. The insulation layer includes first and second regions for forming wiring layers. The impedance of a wiring layer formed on the second region is lower than that of a wiring layer formed on the first region. A signal line pattern is formed on the wiring layer on the first region of the insulation layer. A power supply plane is formed on the wiring layer on the second region of the insulation layer in order to feed power to the signal line pattern through a termination resistor connected to the signal line pattern.

摘要翻译： 在地层上形成绝缘层。 绝缘层包括用于形成布线层的第一和第二区域。 形成在第二区域上的布线层的阻抗低于形成在第一区域上的布线层的阻抗。 在绝缘层的第一区域上的布线层上形成信号线图形。 在绝缘层的第二区域上的布线层上形成电源平面，以便通过连接到信号线图形的终端电阻向信号线图案供电。

公开(公告)号：US20020131258A1

公开(公告)日：2002-09-19

申请号：US09995643

申请日：2001-11-29

申请人： Murata Manufacturing Co., Ltd.

发明人： Keiji Inoue ,  Yasuo Ohashi ,  Toru Yoshikawa

IPC分类号： H05K001/14

CPC分类号： H05K1/144 ,  H05K1/0269 ,  H05K1/141 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/09409 ,  H05K2201/10386 ,  H05K2203/082 ,  H05K2203/1572 ,  H05K2203/161 ,  H05K2203/168

摘要： A plurality of module substrates have circuit boards, respectively. The circuit boards are stacked with a space therebetween, and are connected to first end portions of connecting members. The second end portions of the connecting members are connected to connecting pads disposed on a motherboard. The module substrates are thus stacked and mounted on the motherboard so as to increase the mounting density. By causing the connecting members for the upper circuit board to project further than the connecting members for the lower circuit board, the connecting members for the upper and lower circuit boards are prevented from touching each other.

摘要翻译： 多个模块基板分别具有电路板。 电路板在它们之间堆叠起来，并连接到连接件的第一端部。 连接构件的第二端部连接到设置在母板上的连接垫。 因此，模块基板堆叠并安装在母板上，以增加安装密度。 通过使上部电路基板的连接部件比下部电路基板的连接部件进一步突出，能够防止上下电路基板的连接部件相互接触。

公开(公告)号：US06413619B1

公开(公告)日：2002-07-02

申请号：US09627847

申请日：2000-07-28

申请人： Noriaki Hamada ,  Youji Furukubo

发明人： Noriaki Hamada ,  Youji Furukubo

IPC分类号： B32B300

CPC分类号： H05K1/0269 ,  C03C4/02 ,  C03C10/0009 ,  C04B33/14 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2203/1105 ,  H05K2203/161 ,  Y10T428/24917 ,  H01L2924/00

摘要： According to the present invention, there is provided a method of marking a ceramic member, which comprises firing, in an atmosphere, a ceramic green body containing at least 0.05% by weight of a color changing agent capable of developing different color tones by heating in different atmospheres, and heating a specific portion of the resulting sintered body in the other atmosphere to form a marking portion whose color tone is different from that of the other portion, and a marked ceramic member, thereby making it possible to easily form a mark having excellent visibility in a short time without increasing the number of processes.

摘要翻译： 根据本发明，提供了一种标记陶瓷构件的方法，该方法包括在大气中烧结含有至少0.05重量％的能够通过加热形成不同色调的变色剂的陶瓷生坯 在另一个气氛中加热所得烧结体的特定部分以形成其色调与另一部分的色调不同的标记部分，以及标记的陶瓷部件，从而可以容易地形成具有 良好的可视性在短时间内不增加流程数量。

公开(公告)号：US06272018B1

公开(公告)日：2001-08-07

申请号：US09247811

申请日：1999-02-11

申请人： Michael Feld ,  David Tordjman ,  Alex Feld

发明人： Michael Feld ,  David Tordjman ,  Alex Feld

IPC分类号： H05K702

CPC分类号： H05K1/0269 ,  G01R31/2813 ,  H05K3/303 ,  H05K2201/10689 ,  H05K2203/161 ,  H05K2203/163 ,  H05K2203/168 ,  Y10T29/49131 ,  Y10T29/49133

摘要： The invention relates to a method for the verification of the presence and proper orientation of a component on a printed circuit board. The board has a plurality of areas for receiving a component respectively. Each area is marked in the center thereof with a first marker. Adjacent each area, and indicative of the polarity of the component, a second marker is marked on the board. The presence or absence of a component can be evaluated by inspecting the board after it has been populated and determining whether any of the first markers appear, indicating that a component is missing. Verification of the polarity of a component is done by placing a marker on a portion of a component required to be installed in a predetermined position indicative of polarity. Inspection of the board once it has been populated will determine if the component is in the proper orientation by verifying if the second marker and the marker on the component are in alignment. Preferably, the first marker and the second marker are of different colors, and are preferably UV reflecting coatings.

摘要翻译： 本发明涉及一种用于验证印刷电路板上部件的存在和正确取向的方法。 该板具有分别用于接收部件的多个区域。 每个区域的中心都标有第一个标记。 邻近每个区域，并指示组件的极性，在板上标记第二个标记。 组件的存在或不存在可以通过在填充板之后检查板来确定是否出现任何第一个标记，指示组件丢失，来评估。 通过将标记放置在需要安装在指示极性的预定位置的部件的一部分上来实现部件的极性的验证。 一旦填充了板的检查，将通过验证组件上的第二个标记和标记是否对齐来确定组件是否处于正确的方向。 优选地，第一标记和第二标记具有不同的颜色，并且优选地是UV反射涂层。

公开(公告)号：US06194085B1

公开(公告)日：2001-02-27

申请号：US08936030

申请日：1997-09-27

申请人： Benjamin V. Fasano ,  James N. Humenik ,  David C. Long ,  Cynthia J. Calli

发明人： Benjamin V. Fasano ,  James N. Humenik ,  David C. Long ,  Cynthia J. Calli

IPC分类号： H01L2912

CPC分类号： H01L22/24 ,  H05K1/0269 ,  H05K1/092 ,  H05K3/0076 ,  H05K3/285 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2203/161 ,  Y10T428/12528 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/24802

摘要： A coating material used in the fabrication of electronic components such as a metallized paste is provided comprising a material to be coated on the electronic component substrate and an identifying component which identifying component can be identified and which identifying component identifies the coating material. Optical dyes visible to the eye can be used as the identifying component with a preferred dye being a UV fluorescent dye which is colorless under visible light and visible under UV light. A process for making an electronic component using the coating materials of the invention and electronic components made using the coating material are also provided.

摘要翻译： 提供了用于制造诸如金属化糊料的电子部件的涂层材料，其包括要涂覆在电子部件基板上的材料和识别部件，并且识别部件识别涂层材料。 眼睛可见的光学染料可用作识别组分，优选的染料是紫外线荧光染料，其在可见光下是无色的并且在紫外光下是可见的。 还提供了使用本发明的涂层材料制成电子部件的方法和使用该涂层材料制成的电子部件。

公开(公告)号：US06187417B1

公开(公告)日：2001-02-13

申请号：US09458487

申请日：1999-12-09

申请人： Donald S. Farquhar ,  Konstantinos I. Papathomas

发明人： Donald S. Farquhar ,  Konstantinos I. Papathomas

IPC分类号： B32B300

CPC分类号： H05K1/0269 ,  H05K1/0373 ,  H05K3/4644 ,  H05K2203/161 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31522

摘要： A dielectric for use in making high optical contrast and UV light fluorescing substrates usable in printed circuit boards, which in turn may form part of an electronic package. The dielectric comprises a resin, a coloring agent, and a fluorescing agent and does not include a reinforcing material. The substrate also includes a first conductive layer on the dielectric layer.

摘要翻译： 用于制造可用于印刷电路板的高光学对比度和UV光发荧光基板的电介质，其又可以形成电子封装的一部分。 电介质包括树脂，着色剂和荧光剂，并且不包括增强材料。 衬底还包括介电层上的第一导电层。