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18 条记录 (耗时 0.026 秒)

    Tensioner device
    2.
    发明授权
    Tensioner device 失效
    张紧装置

    公开(公告)号：US06620067B1

    公开(公告)日：2003-09-16

    申请号：US09868896

    申请日：2001-07-06

    申请人： Kensuke Nakamura ,  Sadao Kojima ,  Atsushi Tanaka ,  Shinji Yamada ,  Hajime Maeda ,  Hidehiko Kamiyama

    发明人： Kensuke Nakamura ,  Sadao Kojima ,  Atsushi Tanaka ,  Shinji Yamada ,  Hajime Maeda ,  Hidehiko Kamiyama

    IPC分类号： F16H708

    CPC分类号： F01L1/024 ,  F16H7/18 ,  F16H2007/0804 ,  F16H2007/0872

    摘要： A tensioner device 14 for an engine 1 comprises a support member 16, a blade shoe 17 coming into sliding contact with a timing chain 11 having a base end section 17a held by a cylinder block 3 and a tip end section 17b supported by the support member 16, and a leaf spring 18 held by the blade shoe 1 for pressing the blade shoe 17 against the timing chain 11 elastically. The support member 16 is formed integrally with the cylinder block 3. The tip end section 17b comes into sliding contact with a guide surface 16a formed on the support member 16 to be supported.

    摘要翻译： 用于发动机1的张紧装置14包括支撑构件16，与具有由气缸体3保持的基端部17a的正时链11滑动接触的叶片靴17和由支撑构件支撑的前端部17b 由叶片1保持的板簧18，用于将刀片17弹性地压靠正时链11。 支撑构件16与气缸体3一体地形成。前端部17b与形成在支撑构件16上的引导面16a滑动接触以被支撑。

    Memory card
    3.
    发明授权
    Memory card 失效
    存储卡

    公开(公告)号：US5363274A

    公开(公告)日：1994-11-08

    申请号：US836712

    申请日：1992-02-19

    申请人： Makoto Omori ,  Jun Ohbuchi ,  Hajime Maeda ,  Yasushi Kasatani

    发明人： Makoto Omori ,  Jun Ohbuchi ,  Hajime Maeda ,  Yasushi Kasatani

    IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K1/14 ,  H05K3/34

    CPC分类号： H05K1/0256 ,  G06K19/077 ,  H05K1/05 ,  H05K1/144 ,  H05K1/09 ,  H05K2201/10522 ,  H05K3/3421

    摘要： A memory card having no ordinary type circuit board and a reduced thickness. Insulating layers are disposed on reverse surfaces of a pair of metallic panels, and circuit patterns are formed on the insulating layers. A plurality of electronic parts are mounted on the metallic panels by, for example, being soldered to the circuit patterns. The pair of metallic panels on which the electronic parts are mounted are fitted and bonded to openings formed in a frame of the card so that the electronic parts are accommodated inside the frame facing each other.

    摘要翻译： 不具有普通型电路板和减小厚度的存储卡。 绝缘层设置在一对金属板的反面上，电路图案形成在绝缘层上。 通过例如焊接到电路图案，将多个电子部件安装在金属板上。 安装有电子部件的一对金属板被安装并结合到形成在卡的框架中的开口，使得电子部件容纳在彼此面对的框架内。

    Battery terminal mounting means for a portable electrical device
    4.
    发明授权
    Battery terminal mounting means for a portable electrical device 失效
    用于便携式电气设备的电池端子安装装置

    公开(公告)号：US5299955A

    公开(公告)日：1994-04-05

    申请号：US872031

    申请日：1992-04-23

    申请人： Hajime Maeda ,  Toru Tachikawa ,  Hitoshi Yoshikawa

    发明人： Hajime Maeda ,  Toru Tachikawa ,  Hitoshi Yoshikawa

    IPC分类号： H01M2/10 ,  H01M2/20 ,  H01R9/16 ,  H01R13/24 ,  H01R13/00

    CPC分类号： H01R13/24 ,  H01M2/1066 ,  H01M2/20 ,  H01R9/16

    摘要： In a portable electrical device, a plurality of engaging portions of a frame on surfaces of the frame are directed in the same direction and engaging portions on two connecting terminals can be brought into engagement with the engaging portions along the same direction. Thus, both of the connecting terminals can be mounted on the frame from the same direction, and the efficiency of the mounting operation is improved and can be automated. Furthermore, deformation of or damage to the connecting terminals, caused by the mounting process, is reduced.

    摘要翻译： 在便携式电气设备中，框架的表面上的框架的多个接合部分被引向相同的方向，并且两个连接端子上的接合部分可以沿着相同的方向与接合部分接合。 因此，两个连接端子可以从相同的方向安装在框架上，并且提高了安装操作的效率并且可以自动化。 此外，减少了由安装过程引起的连接端子的变形或损坏。

    Conveyor apparatus using automotive cart
    5.
    发明授权
    Conveyor apparatus using automotive cart 失效
    使用汽车推车的输送设备

    公开(公告)号：US4944230A

    公开(公告)日：1990-07-31

    申请号：US453332

    申请日：1989-12-18

    申请人： Hajime Maeda ,  Masayuki Tsuneda

    发明人： Hajime Maeda ,  Masayuki Tsuneda

    IPC分类号： B61B13/00 ,  B61C11/04 ,  B61C13/04

    CPC分类号： B61B13/00 ,  B61C11/04 ,  B61C13/04

    摘要： A conveyor apparatus comprising a rail device and automotive carts supported and guided by the rail device to be travelled. The rail device comprises an automotive cart guiding member having a C letter-shaped section provided with an opened portion for travelling the cart therethrough and a duct member communicating with the guiding member through a slit. The cleaning of the inside of the duct member, the installation of various kinds of instrument and the wiring operation within the duct member, the maintenance and inspection after the wiring operation and the like can be carried out through the opened portion and the slit.

    Semiconductor device card system
    6.
    发明授权
    Semiconductor device card system 失效
    半导体器件卡系统

    公开(公告)号：US5581120A

    公开(公告)日：1996-12-03

    申请号：US382632

    申请日：1995-02-02

    申请人： Makoto Omori ,  Hajime Maeda

    发明人： Makoto Omori ,  Hajime Maeda

    IPC分类号： G06F1/16 ,  G06K7/00 ,  H01L23/02 ,  H01L23/34 ,  H01L23/58

    CPC分类号： G06K13/0875 ,  G06K13/0893 ,  G06K7/0013 ,  Y10S257/922

    摘要： A semiconductor device card system is capable of preventing foreign matter from entering from outside even when a semiconductor device is mounted and to prevent the semiconductor device card from being removed inadvertently. A mounting section of a semiconductor device card is disposed in a semiconductor device card system unit. The mounting section includes an openable mounting section door, and a window for a connector, disposed in the mounting section door, and through which a back-end connector is inserted.

    摘要翻译： 半导体器件卡系统即使在安装半导体器件时也能够防止异物进入，并且防止半导体器件卡被无意地移除。 半导体器件卡的安装部分设置在半导体器件卡系统单元中。 安装部分包括可打开的安装部分门和用于连接器的窗口，其设置在安装部分门中，并且后端连接器通过该窗口插入。

    IC card
    8.
    发明授权
    IC card 失效
    IC卡

    公开(公告)号：US5299940A

    公开(公告)日：1994-04-05

    申请号：US913042

    申请日：1992-07-14

    申请人： Takeshi Uenaka ,  Hajime Maeda ,  Yasumori Ikeda ,  Toru Tachikawa ,  Shigeo Onoda

    发明人： Takeshi Uenaka ,  Hajime Maeda ,  Yasumori Ikeda ,  Toru Tachikawa ,  Shigeo Onoda

    IPC分类号： G06K19/077 ,  H05K5/02 ,  H01R7/10

    CPC分类号： H05K5/0269 ,  G06K19/077

    摘要： An IC card is disclosed which would not be deformed, and hence, which maintains its quality reliability. A frame is provided to house a substrate which mounts ICs. Panels for protecting the ICs are fixed to the frame by first adhesive material layers. A connector is disposed, in contact with the substrate, between the panels. The connector is fixed to the frame by a second adhesive material layer. This prohibits that external force which acts on the connector at insertion and detachment of the IC card into and from external equipment from acting on the first adhesive material layers. Hence, insertion and detachment of the IC card do not cause deterioration in adhesion between the panels and the frame. Thus, deformation of the ICs due to the external force is prevented, thereby the quality reliability of the IC card being better maintained.

    摘要翻译： 公开了不会变形的IC卡，因此保持其质量可靠性。 提供了一个框架来容纳安装IC的基板。 用于保护IC的面板通过第一粘合材料层固定在框架上。 连接器设置在面板之间与基板接触。 连接器通过第二粘合材料层固定到框架。 这就禁止在将IC卡插入和从外部设备插入和拆卸时作用在连接器上的外力作用在第一粘合材料层上。 因此，IC卡的插入和拆卸不会导致面板和框架之间的粘附性降低。 因此，防止了由于外力引起的IC的变形，从而更好地保持了IC卡的质量可靠性。

    Substrate mounting an integrated circuit package with a deformed lead
    10.
    发明授权
    Substrate mounting an integrated circuit package with a deformed lead 失效
    基板安装具有变形引线的集成电路封装

    公开(公告)号：US06441477B2

    公开(公告)日：2002-08-27

    申请号：US09772891

    申请日：2001-01-31

    申请人： Hajime Maeda ,  Yasunori Ikeda

    发明人： Hajime Maeda ,  Yasunori Ikeda

    IPC分类号： H01L23495

    CPC分类号： H01L23/49555 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00

    摘要： In an integrated circuit package, a deformed IC lead is reliably connected with a land for mounting. Such reliable connection between the deformed IC lead and a land is realized by a method for mounting an integrated circuit package wherein a non deformed first lead and a deformed second lead in the integrated circuit package are connected to a first land and a second land on a substrate, respectively. comprising a step for supplying a conductive material on a land wherein a larger amount of the conductive material than that of the first land is supplied to the second land; and a step for melting the conductive material supplied to connect a lead with a land wherein the conductive material molten on the first land extends in the vertical direction with respect to the substrate with a first height thereby connecting the first lead with the first land, while the conductive material molten on the second land extends with a higher second height than the first height due to surface tension thereby connecting the second lead with the second land.

    摘要翻译： 在集成电路封装中，变形的IC引线与用于安装的焊盘可靠地连接。 通过用于安装集成电路封装的方法来实现变形的IC引线和焊盘之间的这种可靠的连接，其中集成电路封装中的未变形的第一引线和变形的第二引线连接到第一焊盘和第二焊盘上 底物。 包括在土地上提供导电材料的步骤，其中比第一焊盘更多的导电材料被供应到第二焊盘; 以及用于熔化供应以将引线与其中的引线连接的导电材料熔化的步骤，其中在第一焊盘上熔融的导电材料相对于基板在垂直方向上以第一高度延伸，从而将第一引线与第一焊盘连接，同时 由于表面张力，熔融在第二焊盘上的导电材料以比第一高度高的第二高度延伸，从而将第二引线与第二焊盘连接起来。