公开(公告)号：US20100218982A1

公开(公告)日：2010-09-02

申请号：US12675856

申请日：2008-06-30

申请人： Hiroaki Fujiwara ,  Masao Imai ,  Yuki Kitai

发明人： Hiroaki Fujiwara ,  Masao Imai ,  Yuki Kitai

IPC分类号： H05K1/09 ,  C08L63/00 ,  C08K5/02 ,  C08K5/3417 ,  C08K5/06 ,  C08K5/13 ,  C08K3/36 ,  C08K3/22 ,  B32B27/04 ,  B32B15/092

CPC分类号： H05K1/0373 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/03 ,  C08K5/06 ,  C08K5/315 ,  C08K5/3417 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  C09D163/00 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31529 ,  C08L2666/14 ,  C08L2666/22

摘要： It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this object, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, wherein all of the components (A) to (C) are dissolved in the resin varnish, while the component (E) is dispersed without being dissolved in the resin varnish.

摘要翻译： 本发明的目的是提供一种含有环氧化合物，低分子量苯酚改性聚苯醚和氰酸酯化合物作为必要组分的环氧树脂组合物，该环氧树脂组合物具有优异的介电特性并表现出高热 阻力同时保持阻燃性。 为了达到这个目的，本发明的环氧树脂组合物是一种热固性树脂组合物，其由含有（A）数均分子量为1000以下并且含有至少两个环氧基的环氧化合物的树脂清漆组成 分子，不含有任何卤素原子，（B）数均分子量为5000以下的聚苯醚，（C）氰酸酯化合物，（D）固化催化剂和（E）卤素阻燃剂，其中全部 的组分（A）至（C）溶解在树脂清漆中，而组分（E）分散而不溶解在树脂清漆中。

公开(公告)号：US09528026B2

公开(公告)日：2016-12-27

申请号：US14232862

申请日：2012-07-13

申请人： Takashi Sagara ,  Hidetaka Kakiuchi ,  Keiko Kashihara ,  Yuki Kitai ,  Hirosuke Saito ,  Daisuke Yokoyama ,  Hiroaki Fujiwara

发明人： Takashi Sagara ,  Hidetaka Kakiuchi ,  Keiko Kashihara ,  Yuki Kitai ,  Hirosuke Saito ,  Daisuke Yokoyama ,  Hiroaki Fujiwara

IPC分类号： C09D171/00 ,  B32B15/08 ,  C08J5/24 ,  C08L71/12 ,  C08G59/38 ,  C08L71/00 ,  C08G59/32 ,  C08G59/42 ,  C08G59/50 ,  C08K5/18 ,  C08K5/3445 ,  C08K5/5399 ,  H05K1/03

CPC分类号： C09D171/00 ,  B32B15/08 ,  B32B2457/08 ,  C08G59/3218 ,  C08G59/38 ,  C08G59/42 ,  C08G59/5073 ,  C08J5/24 ,  C08J2371/12 ,  C08J2463/00 ,  C08K5/18 ,  C08K5/3445 ,  C08K5/5399 ,  C08L71/00 ,  C08L71/12 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  Y10T428/31529 ,  C08L63/00

摘要： An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

摘要翻译： 本发明的目的是提供一种具有优异的介电性能的树脂组合物，其产生高耐热固化产物，其在制成清漆时提供低粘度，并且在不含卤素的情况下具有高Tg和高阻燃性。 树脂组合物含有在二氯甲烷中在25℃下测定的特性粘度为0.03〜0.12dL / g的聚亚芳基醚共聚物（A），在分子末端位置具有平均1.5〜3个酚羟基 软化点为50〜70℃的三苯甲烷型环氧树脂（B）和固化促进剂（C），聚亚芳基醚共聚物（A）的含量为60〜85质量份 其中聚芳醚醚共聚物（A）和环氧树脂（B）的总量为100质量份。

公开(公告)号：US08409704B2

公开(公告)日：2013-04-02

申请号：US12523775

申请日：2007-01-25

申请人： Yasuo Fukuhara ,  Tomoaki Watanabe ,  Mao Yamaguchi ,  Yuki Kitai ,  Hiroaki Fujiwara

发明人： Yasuo Fukuhara ,  Tomoaki Watanabe ,  Mao Yamaguchi ,  Yuki Kitai ,  Hiroaki Fujiwara

IPC分类号： B32B7/12

CPC分类号： H05K3/4661 ,  B32B3/266 ,  B32B3/30 ,  B32B5/24 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0373 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31515 ,  Y10T428/31522

摘要： The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin (A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

摘要翻译： 本发明涉及一种通过用环氧树脂（A），固化剂（B），促进剂（C），苯氧基树脂（D）和无机填料（A））的环氧树脂组合物浸渍基材而获得的预浸料 （E）和半硬化浸渍材料，其中无机填料（E）的平均粒径为3μm以下。 当通过使用通过电镀处理形成电路的方法在由这种预浸料组成的绝缘体基板的表面上形成具有窄线距离的电路时，在电路轮廓周边的绝缘体基板表面上残留的电镀量 可以减少 结果，导致印刷电路板的制造期间的电路间绝缘电阻的稳定性和产率的提高。

公开(公告)号：US20100044087A1

公开(公告)日：2010-02-25

申请号：US12523775

申请日：2007-01-25

申请人： Yasuo Fukuhara ,  Tomoaki Watanabe ,  Mao Yamaguchi ,  Yuki Kitai ,  Hiroaki Fujiwara

发明人： Yasuo Fukuhara ,  Tomoaki Watanabe ,  Mao Yamaguchi ,  Yuki Kitai ,  Hiroaki Fujiwara

IPC分类号： H05K1/03 ,  B32B5/16 ,  B32B9/00 ,  B05D5/12 ,  B32B38/00

CPC分类号： H05K3/4661 ,  B32B3/266 ,  B32B3/30 ,  B32B5/24 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0373 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31515 ,  Y10T428/31522

摘要： The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin(A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

摘要翻译： 本发明涉及一种通过用环氧树脂（A），固化剂（B），促进剂（C），苯氧基树脂（D）和无机填料（A））的环氧树脂组合物浸渍基材而获得的预浸料 （E）和半硬化浸渍材料，其中无机填料（E）的平均粒径为3μm以下。 当通过使用通过电镀处理形成电路的方法在由这种预浸料组成的绝缘体基板的表面上形成具有窄线距离的电路时，在电路轮廓周边的绝缘体基板表面上残留的电镀量 可以减少 结果，导致印刷电路板的制造期间的电路间绝缘电阻的稳定性和产率的提高。

公开(公告)号：US08929092B2

公开(公告)日：2015-01-06

申请号：US13504281

申请日：2010-10-28

申请人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

发明人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC分类号： H05K7/00 ,  H05K3/10 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H05K3/38 ,  H05K3/18

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/107 ,  H05K3/184 ,  H05K3/38 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0307 ,  H05K2203/0565 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

摘要： A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.

摘要翻译： 电路板包括在绝缘基底的表面上具有布线部分和焊盘部分的电路。 电路被配置为使得导体嵌入形成在基底绝缘体的表面中的电路凹槽中，并且导体的表面粗糙度在电路的布线部分和焊盘部分中是不同的。 在这种情况下，优选的是，焊盘部中的导体的表面粗糙度大于布线部中的导体的表面粗糙度。

公开(公告)号：US08516145B2

公开(公告)日：2013-08-20

申请号：US12838210

申请日：2010-07-16

申请人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

发明人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

IPC分类号： G06F15/16

CPC分类号： G03F7/70525 ,  G03F7/70508 ,  G03F7/70991

摘要： An apparatus which transmits data generated by a device manufacturing apparatus to at least one terminal, comprises a communication unit, a transmission request processor configured to accept or reject a transmission request which the communication unit has received from the terminal, and a transmission controller configured to control the communication unit to transmit, in response to a transmission request accepted by the transmission request processor, data corresponding to the transmission request to a terminal, of the at least one terminal, which has transmitted the transmission request, wherein the transmission request processor accepts a new transmission request if a sum of transmission rates of the respective data concurrently transmitted from the communication unit in response to transmission requests which the transmission request processor has already accepted and a transmission rate at which data is transmitted in response to the new transmission request does not exceed a preset allowable transmission rate.

摘要翻译： 将由装置制造装置生成的数据发送到至少一个终端的装置包括通信单元，被配置为接收或拒绝通信单元从终端接收到的发送请求的发送请求处理器，以及配置为 控制所述通信单元响应于所述传输请求处理器接受的传输请求，将已经发送了所述传输请求的所述至少一个终端的发送请求的数据发送到终端，其中，所述传输请求处理器接受 如果根据传输请求处理器已经接受的传输请求以及响应于新的传输请求发送数据的传输速率而从通信单元同时发送的各个数据的传输速率的总和，则发送新的传输请求 不超过 复位允许传输速率。

公开(公告)号：US20110029685A1

公开(公告)日：2011-02-03

申请号：US12838210

申请日：2010-07-16

申请人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

发明人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

IPC分类号： G06F15/16

CPC分类号： G03F7/70525 ,  G03F7/70508 ,  G03F7/70991

摘要： An apparatus which transmits data generated by a device manufacturing apparatus to at least one terminal, comprises a communication unit, a transmission request processor configured to accept or reject a transmission request which the communication unit has received from the terminal, and a transmission controller configured to control the communication unit to transmit, in response to a transmission request accepted by the transmission request processor, data corresponding to the transmission request to a terminal, of the at least one terminal, which has transmitted the transmission request, wherein the transmission request processor accepts a new transmission request if a sum of transmission rates of the respective data concurrently transmitted from the communication unit in response to transmission requests which the transmission request processor has already accepted and a transmission rate at which data is transmitted in response to the new transmission request does not exceed a preset allowable transmission rate.

摘要翻译： 将由装置制造装置生成的数据发送到至少一个终端的装置包括通信单元，被配置为接收或拒绝通信单元从终端接收到的发送请求的发送请求处理器，以及配置为 控制所述通信单元响应于所述传输请求处理器接受的传输请求，将已经发送了所述传输请求的所述至少一个终端的发送请求的数据发送到终端，其中，所述传输请求处理器接受 如果根据传输请求处理器已经接受的传输请求以及响应于新的传输请求发送数据的传输速率而从通信单元同时发送的各个数据的传输速率的总和，则新的传输请求 不超过 复位允许传输速率。

公开(公告)号：US20080168413A1

公开(公告)日：2008-07-10

申请号：US11885831

申请日：2006-01-20

申请人： Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

发明人： Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

IPC分类号： G06F17/50 ,  H05K3/32

CPC分类号： G06F17/5018 ,  G06F2217/40 ,  G06F2217/80 ,  H05K1/181 ,  H05K3/0005

摘要： A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.

摘要翻译： 一种用于分析组件安装板的方法，包括用于形成多层布线板的多层基板外壳模型的步骤（A），用于形成由元件划分线划分的多层部件壳模型的步骤（B） 多层布线基板的表面的成分，对多层基板外壳模型中的部件的安装位置进行再分割的工序（C），以及通过将基板的中性面粘合而形成分析模型的工序（D） 通过束元件和固体元件中的一个，即与元件的安装条件相当的结合元件，其中分析的精度被增强，同时通过在分析模型赋予边界条件的同时进行计算来降低计算成本。

公开(公告)号：US09206308B2

公开(公告)日：2015-12-08

申请号：US13637629

申请日：2011-03-22

申请人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

发明人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC分类号： H05K1/03 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/10 ,  C08K3/22 ,  C08L63/00 ,  C08G59/22 ,  C08G59/30 ,  C08G59/38 ,  C08G59/62 ,  C08G59/40 ,  C08J5/24 ,  C08K9/02 ,  C08K5/5313 ,  C08K5/5397

CPC分类号： C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

摘要翻译： 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US09082635B2

公开(公告)日：2015-07-14

申请号：US13698975

申请日：2011-05-11

申请人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Yuko Konno

发明人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Yuko Konno

IPC分类号： H05K1/11 ,  H01L25/065 ,  H01L21/48 ,  H01L21/683 ,  H01L23/495 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K3/18 ,  H01L25/00 ,  H05K1/18 ,  C23C18/16 ,  C23C18/18 ,  H01L23/31 ,  H05K3/28 ,  H05K3/46

CPC分类号： H05K3/184 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1893 ,  C25D7/0607 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32145 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K1/185 ,  H05K3/10 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0264 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/0769 ,  H05K2203/1407 ,  H05K2203/1469 ,  Y02P70/611 ,  H05K3/4661 ,  H01L2924/00

摘要： A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

摘要翻译： 提供一种布线方法，其中绝缘层形成在半导体器件1的暴露多个连接端子的表面上，树脂膜形成在绝缘层的表面上，深度等于 或超过树脂膜的厚度由树脂膜的表面侧形成，使得沟槽在要连接的连接端子附近通过，此外，连通孔将从该部分到达要连接的连接端子 形成沟槽附近的沟槽。