公开(公告)号：US06621949B2

公开(公告)日：2003-09-16

申请号：US09808638

申请日：2001-03-14

申请人： Howard P. Wilson ,  Gary F. Nault

发明人： Howard P. Wilson ,  Gary F. Nault

IPC分类号： G02B626

CPC分类号： G02B6/3582 ,  G02B6/3514 ,  G02B6/3546 ,  G02B6/3897

摘要： A fiber optic switch package and method of assembling the same with improved protection of the fibers and simple assembly. A fiber support device has passages that receive optic fibers and help align those fibers with respect to an optic switch component. In addition, the fibers that extend into the interior of the fiber support device are isolated from strains that may occur on the fibers that extend external to the fiber support device.

公开(公告)号：US5285352A

公开(公告)日：1994-02-08

申请号：US913312

申请日：1992-07-15

申请人： John R. Pastore ,  Victor K. Nomi ,  Howard P. Wilson

发明人： John R. Pastore ,  Victor K. Nomi ,  Howard P. Wilson

IPC分类号： H01L23/12 ,  H01L23/36 ,  H01L23/367 ,  H05K7/20

CPC分类号： H01L23/36 ,  H01L23/3677 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107

摘要： A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die. The thermal conductor may also be covered or surrounded by a metallized area (37, 39), which together may serve as a ground plane in the device. Preferably one or more terminals (26) are attached to the thermal conductor for improved thermal and electrical performance. One method of integrating the thermal conductor in the substrate is to position a metal plug into an opening 30 of the substrate. The plug is then compressed or otherwise plastically deformed to fill the opening and create a substantially planar substrate surface.

摘要翻译： 焊盘阵列半导体器件（35）包括集成到电路化衬底（14）中的热导体（28）。 半导体管芯（12）安装在覆盖导热体的衬底上，以建立远离管芯的热路径。 热导体也可以被金属化区域（37,39）覆盖或围绕，金属化区域可一起用作设备中的接地平面。 优选地，一个或多个端子（26）附接到热导体以改善热和电性能。 将热导体集成在基板中的一种方法是将金属塞定位到基板的开口30中。 然后塞子被压缩或以其他方式塑性变形以填充开口并产生基本平坦的基板表面。

公开(公告)号：US06544898B2

公开(公告)日：2003-04-08

申请号：US09891105

申请日：2001-06-25

申请人： Bruce Polson ,  Nan Zhang ,  Howard P. Wilson

发明人： Bruce Polson ,  Nan Zhang ,  Howard P. Wilson

IPC分类号： H01L2100

CPC分类号： B81C1/00873 ,  B81C2201/014

摘要： A microelectromechanical (MEMS) device and a method of fabricating a MEMS device are provided. The method of fabricating the MEMS device includes the steps of: etching a die release trench in a primary handle layer of a wafer having the handle layer, an etch-stop layer disposed on the primary handle layer, and a device layer disposed on the etch-stop layer; patterning a release trench in the device layer that is aligned with the release trench in the primary handle layer; temporarily attaching an additional handle layer to the primary handle layer; etching the device layer to define a structure in the device layer; removing the etch-stop layer; and removing the additional handle layer to release the die.

摘要翻译： 提供了一种微机电（MEMS）器件和MEMS器件的制造方法。 制造MEMS器件的方法包括以下步骤：蚀刻具有手柄层的晶片的主手柄层中的裸片释放沟槽，设置在主手柄层上的蚀刻停止层以及设置在蚀刻上的器件层 停留层 图案化在与主手柄层中的释放沟槽对准的器件层中的释放沟槽; 临时附加手柄层到主手柄层; 蚀刻器件层以限定器件层中的结构; 去除蚀刻停止层; 并移除附加手柄层以释放模具。

公开(公告)号：US06470111B2

公开(公告)日：2002-10-22

申请号：US09768926

申请日：2001-01-24

申请人： Douglas P. Mortenson ,  Howard P. Wilson

发明人： Douglas P. Mortenson ,  Howard P. Wilson

IPC分类号： G02B626

CPC分类号： G02B6/3582 ,  G02B6/3514 ,  G02B6/3546

摘要： A fiber optic switch package and method of assembling the same with improved protection of the fibers and simple assembly. A fiber support device has passages that receive optic fibers and help align those fibers with respect to an optic switch component. In addition, the fibers that extend into the interior of the fiber support device are isolated from strains that may occur on the fibers that extend external to the fiber support device.

摘要翻译： 一种光纤开关封装及其组装方法，具有改进的纤维保护和简单组装。 纤维支撑装置具有接收光纤的通道，并帮助光纤相对于光开关部件对准这些光纤。 此外，延伸到纤维支撑装置内部的纤维与在纤维支撑装置外部延伸的纤维上可能发生的应变隔离。

公开(公告)号：US5612576A

公开(公告)日：1997-03-18

申请号：US960337

申请日：1992-10-13

申请人： Howard P. Wilson ,  Fonzell D. J. Martin

发明人： Howard P. Wilson ,  Fonzell D. J. Martin

IPC分类号： H01L23/28 ,  H01L23/31 ,  H01L23/29

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181

摘要： A self-opening vent hole semiconductor device (10) can be manufactured to reduce the risk of popcorning during solder reflow. The device contains a semiconductor die (22) mounted on a die mounting area (15) of a substrate (12). A venting hole (16) is approximately centrally located in the die mounting area. A venting hole sealing cap (20) covers and seals the venting hole. A layer of patterned solder resist (18) adheres to a lower surface of the substrate. The venting hole sealing cap can be made from the layer of solder resist, and can be configured to be either physically isolated from the solder resist layer or physically partially connected to the solder resist layer. The venting hole sealing cap is designed to be a weakest interface within the device so that it self-opens upon an internal pressure less than a destructive pressure to the device. Solder balls (30) provide external electrical connections for the device.

摘要翻译： 可以制造自开通气孔半导体器件（10），以减少焊料回流期间爆裂的风险。 该装置包含安装在基板（12）的管芯安装区域（15）上的半导体管芯（22）。 排气孔（16）大致位于模具安装区域的中心。 通气孔密封盖（20）覆盖并密封排气孔。 图案化的阻焊剂层（18）粘附到基底的下表面。 通气孔密封盖可以由阻焊层形成，并且可以被配置为与阻焊层物理隔离或物理上部分地连接到阻焊层。 排气孔密封盖被设计为装置内最弱的界面，使得其在小于设备的破坏性压力的内部压力下自我打开。 焊球（30）为器件提供外部电气连接。

公开(公告)号：US5731709A

公开(公告)日：1998-03-24

申请号：US592256

申请日：1996-01-26

申请人： John R. Pastore ,  Victor K. Nomi ,  Howard P. Wilson

发明人： John R. Pastore ,  Victor K. Nomi ,  Howard P. Wilson

IPC分类号： G01R1/04 ,  G01R31/02

CPC分类号： G01R1/0483 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/01322 ,  H01L2924/15311

摘要： A ball grid array semiconductor device (30) includes a plurality of conductive balls (36) and a plurality of conductive castellations (18) around its periphery as redundant electrical connections to a semiconductor die (12). During testing of the device in a test socket (50), the conductive castellations are contacted by test contacts (54). The test contacts do not come in physical contact with the conductive balls. As a result, when testing is performed at elevated temperatures near the melting point of the conductive balls, the conductive balls are not deformed by the test contacts, thereby eliminating cosmetic-defects. Additionally, the absence of physical contact between the conductive balls and the test contacts during testing reduces the likelihood that conductive balls will inadvertently fuse to the test socket or create solder build-up on the test contacts.

摘要翻译： 球栅阵列半导体器件（30）包括围绕其周边的多个导电球（36）和多个导电堰（18），作为到半导体管芯（12）的冗余电连接。 在测试插座（50）中测试设备期间，导电蓖耳体被测试触点（54）接触。 测试触点不会与导电球物理接触。 结果，当在导电球的熔点附近的高温下进行测试时，导电球不会被测试触点变形，从而消除了美观缺陷。 另外，在测试期间导电球和测试触点之间不存在物理接触会降低导电球将不经意地融合到测试插座或在测试触点上产生焊料积聚的可能性。

公开(公告)号：US5284287A

公开(公告)日：1994-02-08

申请号：US937267

申请日：1992-08-31

申请人： Howard P. Wilson ,  Fonzell D. J. Martin

发明人： Howard P. Wilson ,  Fonzell D. J. Martin

IPC分类号： H01L21/48 ,  H05K3/34 ,  H01L21/58

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H05K3/3489

摘要： Conductive balls (44), preferably solder balls, are attached to pads (32) on a substrate (30) using a vacuum pick-up tool (34). The pick-up tool lowers the conductive balls into a bath of flux (48) without allowing the balls to touch the bottom of a recess (47) in a flux plate (46), thereby reducing the likelihood of dislodging the solder balls from the pick-up tool. The pick-up tool withdraws the balls from the flux, and aligns the balls with the respective pads on the substrate. Once positioned, the balls are released from the pick-up tool. A reflow operation metallurgically bonds the balls to the pads.

摘要翻译： 使用真空拾取工具（34）将导电球（44）（优选焊球）附接到衬底（30）上的焊盘（32）。 拾取工具将导电球降低到通量（48）的浴中，而不允许球接触通量板（46）中的凹部（47）的底部，从而减少从焊球（46）移除焊球的可能性 拾取工具。 拾取工具从焊剂中取出球，并将球与衬底上的相应衬垫对准。 一旦定位，球从拾取工具释放。 回流焊接将球焊接到焊盘。

公开(公告)号：US5216278A

公开(公告)日：1993-06-01

申请号：US841765

申请日：1992-03-02

申请人： Paul T. Lin ,  Michael B. McShane ,  Howard P. Wilson

发明人： Paul T. Lin ,  Michael B. McShane ,  Howard P. Wilson

IPC分类号： H01L23/31 ,  H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L23/49827 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A semiconductor device (10) having first and second wiring layers (30, 33) on opposite surfaces of a carrier substrate (12) interconnected through vias (32) formed in the carrier substrate (12) electrically coupling an electronic component (18) to a mounting substrate through compliant solder balls (26) displaced away from vias (32), the semiconductor device (10) characterized by a standard size carrier substrate (12) having high performance electrical package interconnections (24) and good heat dissipation. Improved electrical performance is obtained by providing independent wiring layers (30, 33) each having a lead trace layout specifically designed for a particular electronic component (18) and a particular board connection requirement while using a standard size package outline. Assembly costs are reduced by providing a plastic package mold (36) over a standard size carrier substrate (12) capable of supporting a variety of different electronic components (18) themselves having varying dimensions.

摘要翻译： 一种半导体器件（10），其具有通过形成在所述载体衬底（12）中的通孔（32）互连的载体衬底（12）的相对表面上的第一和第二布线层（30,33），所述通孔（32）将电子部件（18）电耦合到 通过从通孔（32）移开的柔性焊球（26）的安装基板，所述半导体器件（10）的特征在于具有高性能电气封装互连（24）和良好散热的标准尺寸的载体衬底（12）。 通过提供独立的布线层（30,33）来获得改善的电性能，每个独立布线层具有专门为特定的电子部件（18）设计的引线迹线布局和特定的板连接要求，同时使用标准尺寸封装轮廓。 通过在能够支撑本身具有不同尺寸的各种不同的电子部件（18）的标准尺寸的载体基板（12）上提供塑料封装模具（36）来减少装配成本。

公开(公告)号：US5045921A

公开(公告)日：1991-09-03

申请号：US457002

申请日：1989-12-26

申请人： Paul T. Lin ,  Howard P. Wilson

发明人： Paul T. Lin ,  Howard P. Wilson

IPC分类号： H01L23/057 ,  H01L23/495 ,  H01L23/498 ,  H05K3/30 ,  H05K3/36

CPC分类号： H05K3/303 ,  H01L23/057 ,  H01L23/49572 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K3/363 ,  Y02P70/613

摘要： An electronic pad array carrier IC device for mounting on a printed circuit board (PCB) or flex circuit substrate has a thin, flexible "tape" substrate having a plurality of traces. The substrate may be a polyimide or other material that can withstand relatively large lateral mechanical displacement. An integrated circuit die is mounted in proximity with or on the substrate and electrical connections between the integrated circuit chip and the traces are made by any conventional means. The substrate traces are provided at their outer ends with solder balls or pads for making connections to the PCB. A package body covers the die, which body may be optionally used to stand off the package a set distance from the PCB so that the solder balls will form the proper concave structure. Alternatively, a carrier structure may be provided around the periphery of the substrate to add rigidity during handling, testing and mounting, but which may also provide the stand-off function. The thin, flexible substrate can absorb a relatively large lateral or even vertical mechanical displacement over a rather large package area that may accommodate as few as 20 or as many 500 or more connections. The substrate may be optionally transparent or translucent to permit inspection of the bonds after mounting to the PCB. The PCB or flex circuit may also be transparent or translucent for bond inspection purposes. The solder pads or balls may be joined to a via through the substrate at least partially filled with electrically conductive material to permit back side testing of the carrier before or after mounting of the package to the PCB. Additionally, a heat sink structure may be directly bonded to the die in the pad array carrier IC device.

摘要翻译： 用于安装在印刷电路板（PCB）或柔性电路基板上的电子焊盘阵列载体IC器件具有具有多个迹线的薄的，柔性的“带”衬底。 衬底可以是聚酰亚胺或能承受相对大的横向机械位移的其他材料。 集成电路管芯安装在衬底附近或衬底上，并且集成电路芯片和迹线之间的电连接通过任何常规方式制成。 衬底迹线在其外端设置有用于连接到PCB的焊球或焊盘。 封装体覆盖模具，该主体可以可选地用于将封装与PCB隔开一定距离，使得焊球将形成适当的凹形结构。 或者，可以在基板的周边周围设置载体结构，以在处理，测试和安装期间增加刚性，但是也可以提供隔离功能。 薄的柔性基底可以在相当大的封装区域上吸收相对较大的侧向或甚至垂直的机械位移，其可以容纳少至20个或多于500个或更多个连接。 衬底可以是任选的透明或半透明的，以允许在安装到PCB之后检查焊接。 PCB或柔性电路也可以是透明或半透明的，用于粘合检查目的。 焊盘或球可以通过至少部分地填充有导电材料的基板连接到通孔，以允许在将封装安装到PCB之前或之后的载体的背侧测试。 此外，散热器结构可以直接接合到焊盘阵列载体IC器件中的管芯。

公开(公告)号：US06549693B2

公开(公告)日：2003-04-15

申请号：US09808637

申请日：2001-03-14

申请人： Howard P. Wilson ,  Souksamay Chounlamontry

发明人： Howard P. Wilson ,  Souksamay Chounlamontry

IPC分类号： G02B626

CPC分类号： G02B6/3582 ,  G02B6/3512 ,  G02B6/3546 ,  G02B6/355 ,  G02B6/3584

摘要： A fiber optic switch package and method of assembling the same with improved protection of the fibers and simple assembly. The package redirects or bends optical fibers of a 2×2 or 1×2 MEMS optical switch in the package so that instead of exiting the package from four ends, the fibers exit the package from two ends. By exiting the package from two ends, real estate on a printed circuit board is conserved and packages can be located closer to other packages on a printed circuit board.

摘要翻译： 一种光纤开关封装及其组装方法，具有改进的纤维保护和简单组装。 该封装将2x2或1x2 MEMS光开关的光纤重定向或弯曲在封装中，从而不是从四端离开封装，而是从两端退出封装。 通过从两端退出封装，印刷电路板上的空间被保存，并且封装可以更靠近印刷电路板上的其它封装。