CMOS dual metal gate semiconductor device
    2.
    发明授权
    CMOS dual metal gate semiconductor device 有权
    CMOS双金属栅极半导体器件

    公开(公告)号:US08836038B2

    公开(公告)日:2014-09-16

    申请号:US12883241

    申请日:2010-09-16

    Abstract: A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a first MOS device of a first conductivity type and a second MOS device of a second conductivity type opposite the first conductivity type. The first MOS device includes a first gate dielectric on a semiconductor substrate; a first metal-containing gate electrode layer over the first gate dielectric; and a silicide layer over the first metal-containing gate electrode layer. The second MOS device includes a second gate dielectric on the semiconductor substrate; a second metal-containing gate electrode layer over the second gate dielectric; and a contact etch stop layer having a portion over the second metal-containing gate electrode layer, wherein a region between the portion of the contact etch stop layer and the second metal-containing gate electrode layer is substantially free from silicon.

    Abstract translation: 提供半导体结构及其形成方法。 半导体结构包括第一导电类型的第一MOS器件和与第一导电类型相反的第二导电类型的第二MOS器件。 第一MOS器件包括在半导体衬底上的第一栅极电介质; 在所述第一栅极电介质上的第一含金属的栅电极层; 以及位于第一含金属栅电极层上的硅化物层。 第二MOS器件包括半导体衬底上的第二栅极电介质; 在所述第二栅极电介质上方的第二含金属的栅电极层; 以及具有位于所述第二含金属栅电极层上的部分的接触蚀刻停止层,其中所述接触蚀刻停止层的所述部分和所述第二含金属栅电极层之间的区域基本上不含硅。

    Method for forming semiconductor structure having protection layer for preventing laser damage
    3.
    发明授权
    Method for forming semiconductor structure having protection layer for preventing laser damage 有权
    用于形成具有用于防止激光损伤的保护层的半导体结构的方法

    公开(公告)号:US08541264B2

    公开(公告)日:2013-09-24

    申请号:US13548039

    申请日:2012-07-12

    CPC classification number: H01L23/5258 H01L2924/0002 H01L2924/00

    Abstract: A method for forming a semiconductor structure is provided to prevent energy that is used to blow at least one fuse formed on a metal layer above a semiconductor substrate from causing damage on the structure. The semiconductor structure includes a device, guard ring, protection ring, and at least one protection layer. The device is constructed on the semiconductor substrate underneath the fuse. A seal ring, which surrounds the fuse, is constructed on at least one metal layer between the device and the fuse for confining the energy therein. The protection layer is formed within the seal ring, on at least one metal layer between the device and the fuse for shielding the device from being directly exposed to the energy.

    Abstract translation: 提供一种用于形成半导体结构的方法,以防止用于吹送形成在半导体衬底上的金属层上的至少一个熔丝的能量引起对结构的损坏。 半导体结构包括器件,保护环,保护环和至少一个保护层。 该器件构造在保险丝下方的半导体衬底上。 围绕熔丝的密封环构造在设备和保险丝之间的至少一个金属层上,以将能量限制在其中。 保护层形成在密封环内,在设备和保险丝之间的至少一个金属层上,用于屏蔽器件不会直接暴露于能量。

    PROTECTION LAYER FOR PREVENTING LASER DAMAGE ON SEMICONDUCTOR DEVICES
    5.
    发明申请
    PROTECTION LAYER FOR PREVENTING LASER DAMAGE ON SEMICONDUCTOR DEVICES 有权
    用于防止半导体器件激光损伤的保护层

    公开(公告)号:US20120276732A1

    公开(公告)日:2012-11-01

    申请号:US13548039

    申请日:2012-07-12

    CPC classification number: H01L23/5258 H01L2924/0002 H01L2924/00

    Abstract: A method for forming a semiconductor structure is provided to prevent energy that is used to blow at least one fuse formed on a metal layer above a semiconductor substrate from causing damage on the structure. The semiconductor structure includes a device, guard ring, protection ring, and at least one protection layer. The device is constructed on the semiconductor substrate underneath the fuse. A seal ring, which surrounds the fuse, is constructed on at least one metal layer between the device and the fuse for confining the energy therein. The protection layer is formed within the seal ring, on at least one metal layer between the device and the fuse for shielding the device from being directly exposed to the energy.

    Abstract translation: 提供一种用于形成半导体结构的方法,以防止用于吹送形成在半导体衬底上的金属层上的至少一个熔丝的能量引起对结构的损坏。 半导体结构包括器件,保护环,保护环和至少一个保护层。 该器件构造在保险丝下方的半导体衬底上。 围绕熔丝的密封环构造在设备和保险丝之间的至少一个金属层上,以将能量限制在其中。 保护层形成在密封环内,在设备和保险丝之间的至少一个金属层上,用于屏蔽器件不会直接暴露于能量。

    ALTERNATING CURRENT LIGHT-EMITTING DEVICE
    6.
    发明申请
    ALTERNATING CURRENT LIGHT-EMITTING DEVICE 审中-公开
    替代电流发光器件

    公开(公告)号:US20120049216A1

    公开(公告)日:2012-03-01

    申请号:US12898945

    申请日:2010-10-06

    Abstract: The present invention provides an alternating current light-emitting diode (AC LED), which uses a light compensation layer disposed on the light-emitting surface of the AC LED. The materials of the light compensation layer can be phosphorescent or fluorescent materials. The light-emitting mechanism is mainly the light-emitting mechanism of electron-hole pairs in a triplet state. By absorbing light of the AC LED, the flashes occurred when the power of the AC LED alters from a positive half-cycle to a negative one can be compensated. Thereby, the AC LED can emit light full-timely.

    Abstract translation: 本发明提供了一种交流发光二极管(AC LED),其使用设置在AC LED的发光表面上的光补偿层。 光补偿层的材料可以是磷光或荧光材料。 发光机构主要是三重态的电子 - 空穴对的发光机构。 通过吸收交流LED的光,当AC LED的功率从正半周期变化到负的周期时,会发生闪烁。 因此,交流LED可以全面发光。

    Light-emitting device with reflection layer and structure of the reflection layer
    7.
    发明授权
    Light-emitting device with reflection layer and structure of the reflection layer 有权
    具有反射层和反射层结构的发光装置

    公开(公告)号:US08053797B2

    公开(公告)日:2011-11-08

    申请号:US12234652

    申请日:2008-09-20

    CPC classification number: H01L33/46 H01L33/64

    Abstract: The present invention provides a light-emitting device with a reflection layer and the structure of the reflection layer. The reflection layer comprises a variety of dielectric materials. The reflection layer includes a plurality of dielectric layers. The materials of the plurality of dielectric layers have two or more types with two or more thicknesses, except for the combination of two material types and two thicknesses, for forming the reflection layer with a variety of structures. The reflection layer according to the present invention can be applied to light-emitting diodes of various types to form new light-emitting devices. Owing to its excellent reflectivity, the reflection layer can improve light-emitting efficiency of the light-emitting devices.

    Abstract translation: 本发明提供一种具有反射层的发光装置和反射层的结构。 反射层包括各种介电材料。 反射层包括多个电介质层。 除了两种材料类型和两种厚度的组合之外,多个电介质层的材料具有两种或更多种类型,具有两种或更多种厚度,用于形成具有各种结构的反射层。 根据本发明的反射层可以应用于各种类型的发光二极管,以形成新的发光器件。 由于反射率优异,因此能够提高发光元件的发光效率。

    SILICON SOLAR CELL
    8.
    发明申请
    SILICON SOLAR CELL 审中-公开
    硅太阳能电池

    公开(公告)号:US20110232741A1

    公开(公告)日:2011-09-29

    申请号:US13028503

    申请日:2011-02-16

    CPC classification number: H01L31/02245 H01L31/068 Y02E10/547

    Abstract: The present invention discloses a silicon solar cell including a silicon crystal, an emitter, a conductive layer, and a first metal electrode. The silicon crystal has at least one through hole formed thereon. The emitter covers at least the silicon crystal and an inner surface of the through hole on the silicon crystal; the conductive layer covers at least a portion of the emitter that is located on the inner surface of the through hole; and the first metal electrode is located in the through hole on the silicon crystal and is electrically connected at least to the conductive layer.

    Abstract translation: 本发明公开了一种包括硅晶体,发射极,导电层和第一金属电极的硅太阳能电池。 硅晶体具有形成在其上的至少一个通孔。 发射极至少覆盖硅晶体和硅晶体上的通孔的内表面; 导电层覆盖位于通孔内表面上的发射体的至少一部分; 并且第一金属电极位于硅晶体的通孔中,并且至少与导电层电连接。

    LIGHT EMITTING DEVICE WITH SELECTIVE REFLECTION FUNCTION
    9.
    发明申请
    LIGHT EMITTING DEVICE WITH SELECTIVE REFLECTION FUNCTION 审中-公开
    具有选择性反射功能的发光装置

    公开(公告)号:US20100270566A1

    公开(公告)日:2010-10-28

    申请号:US12543681

    申请日:2009-08-19

    Abstract: A light emitting device with selective reflection function being applied to general light emitting device and AC-type light emitting device is revealed. The light emitting device includes at least one vertical light emitting unit, at least one selective reflection layer and a phosphor layer. The selective reflection layer is disposed over the vertical light emitting unit and the phosphor layer is arranged over the selective reflection layer. Thus first colored light from the vertical light emitting unit passes the selective reflection layer and then to be converted into second colored light by the phosphor layer. The selective reflection layer reflects the second colored light while the first colored light is mixed with the second colored light to form mixing colored light. By the selective reflection layer that prevents the second colored light emitting into the light emitting unit, the lighting efficiency of the light emitting device is enhanced.

    Abstract translation: 具有选择反射功能的发光装置被应用于一般的发光装置和AC型发光装置。 发光器件包括至少一个垂直发光单元,至少一个选择反射层和荧光体层。 选择反射层设置在垂直发光单元上方,荧光层设置在选择反射层上。 因此,来自垂直发光单元的第一着色光通过选择反射层,然后被荧光体层转换成第二色光。 选择反射层反射第二有色光,同时第一着色光与第二有色光混合,形成混色色光。 通过防止第二有色光发射到发光单元中的选择性反射层,提高了发光装置的发光效率。

    METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE
    10.
    发明申请
    METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE 有权
    制造发光二极管的方法

    公开(公告)号:US20100081220A1

    公开(公告)日:2010-04-01

    申请号:US12552368

    申请日:2009-09-02

    Abstract: The present invention relates to a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.

    Abstract translation: 本发明涉及发光二极管(LED)及其制造方法。 LED包括LED管芯,一个或多个金属焊盘和荧光层。 本发明的特征包括为了方便后续的布线和包装过程,将金属垫留下来露出。 此外,本发明提供的LED是单一的混合芯片,其可以直接包装而不需要在包装胶上涂布荧光粉。 由于荧光层和包装胶不是同时处理并且具有不同的材料,所以可以有效地降低封装LED中的应力问题。

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