摘要:
The invention provides a semiconductor device exhibiting a stable and high breakdown voltage, which is manufactured at a low manufacturing cost. The semiconductor device of the invention includes an n-type silicon substrate; a p-type base region in the surface portion of substrate; an n-type drain region in the surface portion of n-type substrate; a p-type offset region in the surface portion of n-type substrate; an n-type source region in the surface portion of p-type base region; a p-type contact region in the surface portion of p-type base region; a gate electrode above the extended portion of p-type base region extending between n-type source region and n-type substrate (or p-type offset region), with a gate insulation film interposed therebetween; an insulation film on gate electrode and p-type offset region; a source electrode on n-type source region; and a drain electrode on n-type drain region. The p-type offset region is formed of a first p-type sub-region, a second p-type sub-region, and a third p-type sub-region.
摘要:
The invention provides a semiconductor device exhibiting a stable and high breakdown voltage, which is manufactured at a low manufacturing cost. The semiconductor device of the invention includes an n-type silicon substrate; a p-type base region in the surface portion of substrate; an n-type drain region in the surface portion of n-type substrate; a p-type offset region in the surface portion of n-type substrate; an n-type source region in the surface portion of p-type base region; a p-type contact region in the surface portion of p-type base region; a gate electrode above the extended portion of p-type base region extending between n-type source region and n-type substrate (or p-type offset region), with a gate insulation film interposed therebetween; an insulation film on gate electrode and p-type offset region; a source electrode on n-type source region; and a drain electrode on n-type drain region. The p-type offset region is formed of a first p-type sub-region, a second p-type sub-region, and a third p-type sub-region.
摘要:
In a comb-like or wedge-like electron emitting device, an emitter or both an emitter and an anode electrode are processed from a single-crystal silicon thin film of an SOI wafer. The single-crystal silicon thin film in portions other than the processed portion is removed so that the silicon oxide layer is dug down further slightly. A gate electrode for applying an electric field in order to draw electrons out of the emitter is provided in the dug-down portion. When the end and side faces of the emitter are formed as (111) faces by anisotropic etching in the condition that the single-crystal silicon thin film is oriented to a (100) face, the emitter has a sharp edge at about 55.degree. with respect to the substrate. In a conical electron emitting device, the gate electrode is constituted by a single-crystal silicon thin film of an SOI wafer so that a pyramid surrounded by the (111) faces is formed on the single-crystal silicon substrate.
摘要:
A lateral semiconductor device with enhanced breakdown characteristics includes a semiconductor substrate composite of first and second semiconductor substrates bonded to one another via an oxide film. An insulation film is buried in a separation trench which extends from a major surface of the first semiconductor substrate to the oxide film. An element region of greater than 10 .mu.m in thickness is isolated by the separation trench from other element regions. First and second diffusion regions of opposite conductivity type are formed on the element region. The potential of the second substrate is fixed at one-third of the designed maximum breakdown voltage of the lateral semiconductor device. Alternatively, if the element region is 10 .mu.m or less in thickness, the potential of the second substrate is fixed at one-half of the designed maximum breakdown voltage of the lateral semiconductor device.
摘要:
A lateral semiconductor device with enhanced breakdown characteristics includes a semiconductor substrate composite of first and second semiconductor substrates bonded to one another via an oxide film. An insulation film is buried in a separation trench which extends from a major surface of the first semiconductor substrate to the oxide film. An element region of 10 .mu.m or more in thickness is isolated by the separation trench from other element regions. First and second diffusion regions of opposite conductivity type are formed on the element region. The potential of the second substrate is fixed at one-third of the designed maximum breakdown voltage of the lateral semiconductor device. Alternatively, if the element region is 10 .mu.m or less in thickness, the potential of the second substrate is fixed at one-half of the designed maximum breakdown voltage of the lateral semiconductor device.
摘要:
A stabilized power supply device includes a substrate and a passive part laminate layered on the substrate. The passive part laminate, shaped as a single flat board, includes a thin charge storage film element. A thin magnetic inductive film element is laminated on the thin charge storage film element. The device also includes an active part incorporated in a flip chip. The flip chip, including semiconductors and bump electrodes, is mounted on an upper surface of the passive part laminate. The upper surface of the passive part laminate includes terminals for connecting the passive part laminate to the bump electrodes. This connection also fixes the active part to the passive part laminate.
摘要:
A miniaturized electromagnetic wave detecting apparatus is provided that detects wavelengths from the microwave to the infrared regions in any environment. Electrons are field-emitted from an electron emitting means comprising a cold cathode and a gate electrode 2. Spiral motion and elongation of traveling length of the emitted electrons are enhanced by orthogonal magnetic field applied by a magnetic field application means while the electrons are attracted to the anode. The electrons are accelerated by the cyclotron resonance enhanced when the angular cyclotron resonance frequency .omega..sub.c, determined by the magnetic flux density of the orthogonal magnetic field, and the angular frequency .omega..sub.f of the electromagnetic wave to be measured coincide with each other. The accelerated electrons collide with and dissociate the dilute gas molecules to produce multiplied ion-pairs, which are then captured by the cathode and anode. The wavelength of the electromagnetic wave is measured from the angular frequency .omega..sub.c of the cyclotron resonance by detecting the anode current peak observed when the cyclotron resonance is enhanced.
摘要:
A device for limiting the number of printing columns in a printer in which a group of printing data codes transferred from a data source are successively compared with a group of type codes which are determined in correspondence to the instantaneous positions of type on a type carrier, so that a type in a place where a printing data code coincides with a type code is printed. The device comprises a reversible counter adapted to subject a coincidence signal relating to said printing data code and type code and a printing completion signal for each place to addition and subtraction, respectively, so that when the count value of the reversible counter reaches a predetermined value, printing for further places is inhibited.
摘要:
A semiconductor device includes a semiconductor substrate; a metal electrode wiring laminate on the semiconductor substrate, the metal electrode wiring laminate being patterned with a predetermined wiring pattern; the metal electrode wiring laminate including an undercoating barrier metal laminate and aluminum or aluminum alloy film on the undercoating barrier metal laminate; and organic passivation film covering the metal electrode wiring laminate, wherein the barrier metal laminate is a three-layered laminate including titanium films sandwiching a titanium nitride film. The semiconductor device according to the invention facilitates improving the moisture resistance of the portion of the barrier metal laminate exposed temporarily in the manufacturing process, facilitates employing only one passivation film, facilitates preventing the failures caused by cracks from occurring and the failures caused by Si nodules remaining in the aluminum alloy from increasing.
摘要:
On top of a silicon substrate, a polyimide film with a thickness of 10 μm is formed. On top of this, a magnetic thin film that is a polyimide film containing Fe fine particles and that has a thickness of 20 μm is formed. On top of this magnetic thin film, a patterned Ti/Au film and a Ti/Au connection conductor are formed. On top of this, a polyimide film with a thickness of 10 μm, and a Cu coil with a height 35 μm, width 90 μm, space 25 μm, and a polyimide layer that fills the spaces in the Cu coil are formed. On top of this, via a polyimide film with a thickness of 10 μm, a magnetic thin film that is a polyimide film containing Fe particles and that has a thickness of 20 μm is formed. This thin film inductor has a small alternating current resistance. The present invention provides a magnetic thin film that is well suited for mass production, can be manufactured easily, can be made into a thick film, has soft magnetic qualities, and is inexpensive. The present invention also provides a magnetic component that uses this magnetic thin film, manufacturing methods for these, and a power conversion device.