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    Mobile communication device
    2.
    发明授权
    Mobile communication device 有权
    移动通信设备

    公开(公告)号：US08494596B2

    公开(公告)日：2013-07-23

    申请号：US12774833

    申请日：2010-05-06

    申请人： Kun-Tsan Wu ,  Wei-Shan Hu

    发明人： Kun-Tsan Wu ,  Wei-Shan Hu

    IPC分类号： H04M1/00

    CPC分类号： H04M1/0208 ,  H04M1/0216 ,  H04M1/0237

    摘要： A device having a first side and a second side, comprising a lower housing, an upper housing tacked on the lower housing comprising a first edge located at the first side and a second edge located at the second side, a bracket and a biasing assembly. The bracket is configured to tilt the first edge of the upper housing away from the lower housing. The biasing assembly is configured to rotate the bracket to tilt the first edge of the upper housing away from the lower housing. The biasing assembly comprises a slider board and a resilient member, one end of the slider board is pivotably connected to the upper housing adjacent to the second side of the device, the resilient member has a first end connected to the first housing, and a second end connected to the other end of the slider board.

    摘要翻译： 一种具有第一侧和第二侧的装置，包括下壳体，上壳体，其被固定在所述下壳体上，所述上壳体包括位于所述第一侧的第一边缘和位于所述第二侧的第二边缘，支架和偏置组件。 支架被配置为使上壳体的第一边缘远离下壳体倾斜。 偏置组件被配置为旋转支架以使上壳体的第一边缘远离下壳体倾斜。 偏置组件包括滑动板和弹性构件，滑块的一端可枢转地连接到邻近装置的第二侧的上壳体，弹性构件具有连接到第一壳体的第一端和第二端 端部连接到滑板的另一端。

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME 有权
    半导体封装结构及其制造方法

    公开(公告)号：US20120273930A1

    公开(公告)日：2012-11-01

    申请号：US13456660

    申请日：2012-04-26

    申请人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

    发明人： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Yu-Shan Hu

    IPC分类号： H01L23/495 ,  H01L21/78

    CPC分类号： H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76885 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00015 ,  H01L2924/00

    摘要： A semiconductor package structure is provided, including: a semiconductor chip having electrode pads disposed thereon and metal bumps disposed on the electrode pads; an encapsulant encapsulating the semiconductor chip; a dielectric layer formed on the encapsulant and having a plurality of patterned intaglios formed therein for exposing the metal bumps; a wiring layer formed in the patterned intaglios of the dielectric layer and electrically connected to the metal bumps; and a metal foil having a plurality of metal posts disposed on a surface thereof such that the metal foil is disposed on the encapsulant with the metal posts penetrating the encapsulant so as to extend to the inactive surface of the semiconductor chip. Compared with the prior art, the present invention reduces the overall thickness of the package structure, increases the electrical transmission efficiency and improves the heat dissipating effect.

    摘要翻译： 提供一种半导体封装结构，包括：具有设置在其上的电极焊盘的半导体芯片和设置在电极焊盘上的金属凸块; 封装半导体芯片的密封剂; 介电层，其形成在所述密封剂上并且具有形成在其中的多个图案化的凹凸，用于暴露所述金属凸块; 形成在电介质层的图案化凹凸中并与金属凸块电连接的布线层; 以及具有设置在其表面上的多个金属柱的金属箔，使得金属箔设置在密封剂上，金属柱穿透密封剂，以延伸到半导体芯片的非活性表面。 与现有技术相比，本发明减小了封装结构的整体厚度，提高了电传输效率并提高了散热效果。

    Tilting portable electronic device
    5.
    发明授权
    Tilting portable electronic device 有权
    倾斜便携式电子设备

    公开(公告)号：US08213163B2

    公开(公告)日：2012-07-03

    申请号：US12825462

    申请日：2010-06-29

    申请人： Kun-Tsan Wu ,  Wei-Shan Hu

    发明人： Kun-Tsan Wu ,  Wei-Shan Hu

    IPC分类号： G06F1/16

    CPC分类号： H04M1/0208

    摘要： A tilting portable electronic device includes a housing, a cover, at least one supporting rod and at least one telescoping bar. The at least one supporting rod rotatably connects to the housing and the cover; the at least one telescoping bar rotatably connects to the housing and the cover. The telescoping bar includes at least two bushing sections, the two bushing sections retractably connect each other. When the cover is opened relative to the housing, the telescoping bar expands and rotates and the supporting rod rotates until the telescoping bar and the supporting rod cooperatively support one end of the cover.

    摘要翻译： 倾斜便携式电子设备包括壳体，盖子，至少一个支撑杆和至少一个伸缩杆。 所述至少一个支撑杆可旋转地连接到所述壳体和所述盖; 所述至少一个伸缩杆可旋转地连接到所述壳体和所述盖。 伸缩杆包括至少两个衬套部分，两个衬套部分可伸缩地彼此连接。 当盖相对于壳体打开时，伸缩杆膨胀并旋转，并且支撑杆旋转直到伸缩杆和支撑杆协同地支撑盖的一端。

    Tilting portable electronic device
    6.
    发明授权
    Tilting portable electronic device 有权
    倾斜便携式电子设备

    公开(公告)号：US08208244B2

    公开(公告)日：2012-06-26

    申请号：US12825474

    申请日：2010-06-29

    申请人： Kun-Tsan Wu ,  Wei-Shan Hu

    发明人： Kun-Tsan Wu ,  Wei-Shan Hu

    IPC分类号： G06F1/16

    CPC分类号： H04M1/0208 ,  H04M1/0216 ,  H04M1/0237

    摘要： A tilting portable electronic device includes a main body, a cover having a sliding plate, a sliding mechanism connecting to the main body and the cover respectively. The sliding mechanism includes a first plate secured to the main body, a second plate slidably engaging with the first plate, two connecting bars and two swing arms. The connecting bars rotatably connect with the second plate and the sliding plate, the swing arms rotatably connect with the main body and the connecting bar. When the sliding plate is pushed and slides relative to the main body, the connecting bars slides, the first plate correspondingly slides relative to the second plate, and the swing arms rotates to support an end of the cover.

    摘要翻译： 倾斜便携式电子设备包括主体，具有滑板的盖，分别连接到主体和盖的滑动机构。 滑动机构包括固定到主体的第一板，与第一板可滑动地接合的第二板，两个连接杆和两个摆臂。 连接杆与第二板和滑板可旋转地连接，摆臂与主体和连接杆可旋转地连接。 当滑板相对于主体被推动并滑动时，连接杆滑动，第一板相对于第二板相应地滑动，并且摆臂旋转以支撑盖的一端。

    Package structure and manufacturing method thereof
    8.
    发明授权
    Package structure and manufacturing method thereof 有权
    包装结构及其制造方法

    公开(公告)号：US08058102B2

    公开(公告)日：2011-11-15

    申请号：US12615682

    申请日：2009-11-10

    申请人： Diann-Fang Lin ,  Yu-Shan Hu

    发明人： Diann-Fang Lin ,  Yu-Shan Hu

    IPC分类号： H01L21/48

    CPC分类号： H01L23/3107 ,  H01L23/3185 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/2518 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30107

    摘要： The present invention discloses a semiconductor device package structure with redistribution layer (RDL) and through silicon via (TSV) techniques. The package structure comprises an electronic element which includes a dielectric layer on a backside surface of the electronic element, a plurality of first conductive through vias across through the electronic element and the dielectric layer, and a plurality of conductive pads accompanying the first conductive through vias on an active surface of the electronic element; a filler material disposed adjacent to the electronic element; a first redistribution layer disposed over the dielectric layer and the filler material, and connected to the first conductive through vias; a first protective layer disposed over the active surface of the electronic element, the conductive pads, and the filler material; and a second protective layer disposed over the redistribution layer, the dielectric layer, and the filler material.

    摘要翻译： 本发明公开了一种具有再分配层（RDL）和硅通孔（TSV）技术的半导体器件封装结构。 封装结构包括电子元件，该电子元件包括在电子元件的背面上的电介质层，穿过电子元件和电介质层的多个第一导电通孔以及伴随第一导电通孔的多个导电垫 在电子元件的有效表面上; 设置在电子元件附近的填充材料; 设置在电介质层和填充材料之上并连接到第一导电通孔的第一再分配层; 设置在电子元件的有源表面上的第一保护层，导电焊盘和填充材料; 以及设置在再分布层，电介质层和填充材料之上的第二保护层。

    TILTING PORTABLE ELECTRONIC DEVICE
    9.
    发明申请
    TILTING PORTABLE ELECTRONIC DEVICE 有权
    倾斜便携式电子设备

    公开(公告)号：US20110228452A1

    公开(公告)日：2011-09-22

    申请号：US12825484

    申请日：2010-06-29

    申请人： KUN-TSAN WU ,  WEI-SHAN HU

    发明人： KUN-TSAN WU ,  WEI-SHAN HU

    IPC分类号： H05K7/00

    CPC分类号： H04M1/0237 ,  H04M1/0216 ,  H04M1/72544

    摘要： A tilting portable electronic device includes a housing, a cover, a sliding mechanism and a rotating member. The sliding mechanism includes a connecting plate and at least one elastic member, the connecting plate rotatably connects with the cover, the elastic member connects to the connecting plate and the housing, the rotating member rotatably connects to the cover and the housing. When the cover is pushed by a force, one end of the cover slides along the surface of the housing with the connecting plate; the rotating member rotates to support the other end of the cover, after the sliding plate sliding over a predetermined distance, the elastic member releases energy to drive the connecting plate sliding further automatically, and the cover opens tilted relative to the housing.

    摘要翻译： 倾斜便携式电子设备包括壳体，盖子，滑动机构和旋转构件。 滑动机构包括连接板和至少一个弹性构件，连接板与盖可旋转地连接，弹性构件连接到连接板和壳体，旋转构件可旋转地连接到盖和壳体。 当盖被推动时，盖的一端通过连接板沿壳体的表面滑动; 旋转构件旋转以支撑盖的另一端，在滑板滑动预定距离之后，弹性构件释放能量以驱动连接板进一步自动滑动，并且盖相对于壳体开口倾斜。