公开(公告)号：US08790843B2

公开(公告)日：2014-07-29

申请号：US12019012

申请日：2008-01-24

申请人： Young-Seung Na ,  Jun-Won Suh ,  In-Seob Song ,  Keun-Yong Lee ,  Sung-Won Jeong ,  Chan-Gyun Shin

发明人： Young-Seung Na ,  Jun-Won Suh ,  In-Seob Song ,  Keun-Yong Lee ,  Sung-Won Jeong ,  Chan-Gyun Shin

IPC分类号： H01M8/02 ,  H01M8/10

CPC分类号： H01M8/0206 ,  H01M8/0254 ,  H01M8/0263 ,  H01M8/0273 ,  H01M8/0284 ,  H01M8/1007

摘要： A fuel cell stack includes a plurality of membrane electrode assemblies (MEAs) and a stamped metal separator. The metal separator is positioned between the membrane electrode assemblies. The separator includes at least one channel on both surfaces of the separator formed by a stamping process. The separator comprises a plurality of holes, each of which form a manifold communicating with each the channels.

摘要翻译： 燃料电池堆包括多个膜电极组件（MEA）和冲压金属分离器。 金属隔板位于膜电极组件之间。 分离器包括通过冲压工艺形成的隔板的两个表面上的至少一个通道。 分离器包括多个孔，每个孔形成与每个通道连通的歧管。

公开(公告)号：US20120234917A1

公开(公告)日：2012-09-20

申请号：US13422744

申请日：2012-03-16

申请人： Sung Won JEONG ,  Jong-Deok CHOI

发明人： Sung Won JEONG ,  Jong-Deok CHOI

IPC分类号： G06K7/06

CPC分类号： G06K13/0806 ,  G06K13/085

摘要： A memory card socket is provided. The memory card socket includes an outer case, an inner case which is movable within the outer case and includes a slot into which a memory card is insertable. The memory card socket also includes a locking portion which locks the inner case to the outer case upon a withdrawal of the memory card.

摘要翻译： 提供存储卡插座。 存储卡插座包括外壳，内壳，其可在外壳内移动并且包括可插入存储卡的槽。 存储卡插座还包括锁定部分，该锁定部分在取出存储卡时将内壳锁定到外壳。

公开(公告)号：US20100095159A1

公开(公告)日：2010-04-15

申请号：US12467652

申请日：2009-05-18

申请人： Sung-won JEONG ,  Hyung-hun Cho ,  Meong-chul Song ,  Yun-gun Park ,  Sung-hoon Kim ,  In-Pyo Iiong

发明人： Sung-won JEONG ,  Hyung-hun Cho ,  Meong-chul Song ,  Yun-gun Park ,  Sung-hoon Kim ,  In-Pyo Iiong

IPC分类号： G06F11/36 ,  G06F11/22

CPC分类号： G06F11/263 ,  G06F11/3688

摘要： An apparatus and method for testing a digital device or software installed in the digital device are provided. According to one aspect, the apparatus for testing the digital device or software installed in the digital device includes a test agent for providing a test execution environment, and the test agent performs a test for each test case in response to a command from a test director. The test agent may report an execution state of the test to the test director, and the test director may generate a test result report based on the report or resumes the test upon generation of error.

摘要翻译： 提供了一种用于测试安装在数字设备中的数字设备或软件的设备和方法。 根据一方面，用于测试安装在数字设备中的数字设备或软件的设备包括用于提供测试执行环境的测试代理，并且测试代理响应于来自测试主管的命令对每个测试用例执行测试 。 测试人员可以将测试的执行状态报告给测试主管，测试主管可以根据报告生成测试结果报告，或在生成错误时恢复测试。

公开(公告)号：US20080116843A1

公开(公告)日：2008-05-22

申请号：US11874819

申请日：2007-10-18

申请人： Dong-rak Kim ,  Sung-won Jeong

发明人： Dong-rak Kim ,  Sung-won Jeong

IPC分类号： H02J7/00 ,  H01M10/44 ,  H01M8/02

CPC分类号： H02J7/34 ,  H01M8/04559 ,  H01M8/04567 ,  H01M8/0488 ,  H01M8/04888 ,  H01M8/1011 ,  H01M10/48 ,  H01M16/006 ,  H02J2001/004 ,  Y02E60/523 ,  Y02P70/56

摘要： Fuel cell systems and methods for controlling fuel cell systems. In one embodiment, the method includes supplying power produced by operating the fuel cell stack in a maximum output mode to the load while concurrently charging the secondary cell with the produced power when an amount of charge of the secondary cell is smaller than a first standard value, supplying both power produced by operating the fuel cell stack in a stable output mode and the power discharged by the secondary cell to the load when the amount of charge of the secondary cell is larger than a second standard value, and maintaining an existing output mode among the output modes when the amount of charge of the secondary cell is larger than the first standard value and smaller than the second standard value.

摘要翻译： 燃料电池系统和控制燃料电池系统的方法。 在一个实施例中，所述方法包括：当所述二次电池的电荷量小于第一标准值时，以最大输出模式将所述燃料电池堆操作产生的功率供给所述负载，同时对所述二次电池进行充电， 当所述二次电池的电荷量大于第二标准值时，以稳定的输出模式供给由所述燃料电池堆操作而产生的电力和由所述二次电池放电至所述负载的电力，并维持现有的输出模式 在二次电池的电荷量大于第一标准值且小于第二标准值的输出模式中。

公开(公告)号：US20180067678A1

公开(公告)日：2018-03-08

申请号：US15440680

申请日：2017-02-23

申请人： Sung-Won JEONG ,  Hee-Woong KANG

发明人： Sung-Won JEONG ,  Hee-Woong KANG

IPC分类号： G06F3/06 ,  G06F12/02

CPC分类号： G06F3/0634 ,  G06F1/206 ,  G06F3/0616 ,  G06F3/064 ,  G06F3/0679 ,  G06F12/0246 ,  G06F12/0253 ,  G06F2212/7205 ,  G11C7/04 ,  G11C7/109 ,  G11C7/222 ,  G11C16/349

摘要： In a method of throttling temperature of a nonvolatile memory device including a memory cell array, a current temperature of the nonvolatile memory device may be detected periodically. The current temperature may be compared with a reference temperature. Whether an external input/output command, which is provided by a memory controller, exists may be determined when the current temperature is lower than the reference temperature. An input/output operation, which corresponds to the external input/output command, may be performed on the memory cell array when the external input/output command exists. A desired and/or alternatively predetermined internal input/output operation may be performed on the memory cell array regardless of a command from the memory controller when the external input/output command does not exist.

公开(公告)号：US08766450B2

公开(公告)日：2014-07-01

申请号：US12805559

申请日：2010-08-05

申请人： Ki Taek Lee ,  Hueng Jae Oh ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

发明人： Ki Taek Lee ,  Hueng Jae Oh ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

IPC分类号： H01L23/28

CPC分类号： H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

摘要翻译： 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。

公开(公告)号：US08608072B2

公开(公告)日：2013-12-17

申请号：US13422744

申请日：2012-03-16

申请人： Sung Won Jeong ,  Jong-Deok Choi

发明人： Sung Won Jeong ,  Jong-Deok Choi

IPC分类号： G06K7/00 ,  G06K7/06 ,  G06F1/20 ,  H05K7/10

CPC分类号： G06K13/0806 ,  G06K13/085

摘要： A memory card socket is provided. The memory card socket includes an outer case, an inner case which is movable within the outer case and includes a slot into which a memory card is insertable. The memory card socket also includes a locking portion which locks the inner case to the outer case upon a withdrawal of the memory card.

摘要翻译： 提供存储卡插座。 存储卡插座包括外壳，内壳，其可在外壳内移动并且包括可插入存储卡的槽。 存储卡插座还包括锁定部分，该锁定部分在取出存储卡时将内壳锁定到外壳。

公开(公告)号：US20120267285A1

公开(公告)日：2012-10-25

申请号：US13411168

申请日：2012-03-02

申请人： Dong Gyu LEE ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

发明人： Dong Gyu LEE ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

IPC分类号： B65D85/00 ,  B65B1/04

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2224/05552

摘要： Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

摘要翻译： 这里公开了一种封装基板及其制造方法。 封装衬底包括：衬底，其包括至少一个导电焊盘，形成在衬底上的绝缘层，并且包括导电焊盘暴露的开口，沿着通过开口暴露的导电焊盘的顶表面形成的防泡层， 绝缘层的侧壁，由至少一种合金材料制成并形成在防泡层上的金属柱以及形成在金属柱上的热扩散防止膜。

公开(公告)号：US08142240B2

公开(公告)日：2012-03-27

申请号：US12805214

申请日：2010-07-19

申请人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

发明人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

IPC分类号： H01R4/02

CPC分类号： H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

摘要： Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

摘要翻译： 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

公开(公告)号：US20110067901A1

公开(公告)日：2011-03-24

申请号：US12614411

申请日：2009-11-07

申请人： Jin Ho KIM ,  Seok Kyu LEE ,  Jae Joon LEE ,  Sung Won JEONG

发明人： Jin Ho KIM ,  Seok Kyu LEE ,  Jae Joon LEE ,  Sung Won JEONG

IPC分类号： H05K1/00

CPC分类号： H05K1/0271 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0224 ,  H05K1/141 ,  H05K3/4682 ,  H05K2201/049 ,  H05K2201/09136 ,  H05K2201/09681 ,  H01L2924/00

摘要： Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic part, and open portions are formed on the first plating layer, thus balancing the plating areas of the plating layers formed on the layers of the package substrate, thereby minimizing warpage of the package substrate due to differing coefficients of thermal expansion.

摘要翻译： 公开了一种封装基板，其中形成在要连接到母板的层上的第一镀层的电镀面积大于形成在要连接到母板的层上的第二镀层的镀覆面积 电子部分和开口部分形成在第一镀层上，从而平衡形成在封装衬底的层上的镀层的电镀区域，由此由于不同的热膨胀系数使封装衬底的翘曲最小化。