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14 条记录 (耗时 0.016 秒)

    LED LAMP AND METHOD OF MAKING THE SAME
    1.
    发明申请
    LED LAMP AND METHOD OF MAKING THE SAME 有权
    LED灯及其制作方法

    公开(公告)号：US20120313518A1

    公开(公告)日：2012-12-13

    申请号：US13158962

    申请日：2011-06-13

    申请人： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    发明人： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    IPC分类号： H01K1/62 ,  H05K13/00 ,  H01J61/52

    CPC分类号： F21V29/74 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21Y2101/00 ,  F21Y2115/10 ,  Y10T29/49002

    摘要： A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

    摘要翻译： 照明装置包括具有朝向外侧的中心部分的小面的多面散热器。 小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。 照明装置还具有安装有半导体发射体的多个电路板。 每个电路板安装在散热器的相应面上。 所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件 模块。

    Method and apparatus for fabricating phosphor-coated LED dies
    3.
    发明授权
    Method and apparatus for fabricating phosphor-coated LED dies 有权
    制造磷光体涂层LED芯片的方法和装置

    公开(公告)号：US08765500B2

    公开(公告)日：2014-07-01

    申请号：US13594219

    申请日：2012-08-24

    申请人： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Ming Lin

    发明人： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Ming Lin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

    摘要： The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

    摘要翻译： 本公开涉及封装发光二极管（LED）的方法。 根据该方法，提供一组金属焊盘和一组LED。 该组LED例如通过粘合工艺连接到金属焊盘组上。 在LED连接到金属焊盘之后，每个LED与相邻的LED间隔开。 同样根据该方法，荧光膜被集体涂覆在LED组上。 荧光膜被涂覆在每个LED的顶表面和侧表面上以及相邻的LED之间。 然后进行切割处理以切割位于相邻LED之间的部分荧光膜。 切割工艺将LED组分成多个单独的磷光体涂覆的LED。

    Systems and Methods Providing Semiconductor Light Emitters
    4.
    发明申请
    Systems and Methods Providing Semiconductor Light Emitters 有权
    提供半导体发光器的系统和方法

    公开(公告)号：US20120299019A1

    公开(公告)日：2012-11-29

    申请号：US13117320

    申请日：2011-05-27

    申请人： Tien-Ming Lin ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    发明人： Tien-Ming Lin ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    IPC分类号： H01L33/52 ,  H01L21/52

    CPC分类号： H01L33/58 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

    摘要翻译： 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。

    LED lamp with improved light output
    7.
    发明授权
    LED lamp with improved light output 有权
    LED灯具有改善的光输出

    公开(公告)号：US08721097B2

    公开(公告)日：2014-05-13

    申请号：US13111222

    申请日：2011-05-19

    申请人： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

    发明人： Sheng-Shin Guo ,  Chih-Hsuan Sun ,  Tien-Ming Lin ,  Wei-Yu Yeh

    IPC分类号： F21V9/16 ,  F21V3/00

    CPC分类号： F21K9/64 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21V13/02 ,  F21V29/507 ,  F21V29/70 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  Y10T29/4913

    摘要： The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.

    摘要翻译： 本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管（LED）光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。 盖结构包含磷光体材料和漫射材料。 盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。

    LED lamp and method of making the same
    10.
    发明授权
    LED lamp and method of making the same 有权
    LED灯及其制作方法

    公开(公告)号：US08414160B2

    公开(公告)日：2013-04-09

    申请号：US13158962

    申请日：2011-06-13

    申请人： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    发明人： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    IPC分类号： F21V29/00

    CPC分类号： F21V29/74 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21Y2101/00 ,  F21Y2115/10 ,  Y10T29/49002

    摘要： A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

    摘要翻译： 照明装置包括具有朝向外侧的中心部分的小面的多面散热器。 小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。 照明装置还具有安装有半导体发射体的多个电路板。 每个电路板安装在散热器的相应面上。 所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件 模块。