公开(公告)号：US09165869B1

公开(公告)日：2015-10-20

申请号：US14328713

申请日：2014-07-11

申请人： Soo Choong Chee ,  Meng Kong Lye ,  Wai Keong Wong

发明人： Soo Choong Chee ,  Meng Kong Lye ,  Wai Keong Wong

IPC分类号： H01L23/495

CPC分类号： H01L23/49551 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame for a semiconductor device has a die flag and leads that surround the die flag. In order to decrease the distance or spacing between inner lead ends and the die flag, which allows for short bond wires for connecting the inner lead ends to a die mounted on the die flag, at least some of the leads are twisted along their lengths to be angled with respect to a die-flag plane. The pitch between such twisted leads can be reduced without resulting in physical contact between adjacent leads, enabling the leads to extend further towards the die flag.

摘要翻译： 用于半导体器件的引线框具有裸片标记和包围裸片标记的引线。 为了减小内引线端和芯片标记之间的距离或间距，这允许用于将内引线端连接到安装在管芯标记上的管芯的短接合线，至少一些引线沿着它们的长度被扭曲到 相对于模具标志平面成角度。 可以减小这种扭绞引线之间的间距，而不会导致相邻引线之间的物理接触，使得引线能够进一步向着模具标记延伸。

公开(公告)号：US20150270195A1

公开(公告)日：2015-09-24

申请号：US14220118

申请日：2014-03-19

申请人： Wai Keong Wong ,  Soo Choong Chee ,  Stanley Job Doraisamy

发明人： Wai Keong Wong ,  Soo Choong Chee ,  Stanley Job Doraisamy

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8585 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05599

摘要： A lead frame for a semiconductor device includes a die paddle and leads situated on a perimeter of the lead frame. The die paddle has a metal frame and a number of substantially linear metal connecting bars within the frame. The connecting bars interconnect different locations of the frame to form a multiple triangles, where a triangular-shaped cavity is formed within each triangle. An overall area of the cavities is greater than an overall area of the connecting bars.

摘要翻译： 用于半导体器件的引线框架包括管芯焊盘和位于引线框架的周边上的引线。 模具板具有金属框架和框架内的多个基本上线性的金属连接杆。 连接杆将框架的不同位置互连以形成多个三角形，其中在每个三角形内形成三角形空腔。 空腔的总面积大于连接条的总面积。

公开(公告)号：US09006874B2

公开(公告)日：2015-04-14

申请号：US14147599

申请日：2014-01-06

申请人： Wai Keong Wong ,  Kok Leong Chan ,  Wei Kee Chan

发明人： Wai Keong Wong ,  Kok Leong Chan ,  Wei Kee Chan

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/81 ,  H01L21/4828 ,  H01L21/4842 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48458 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.

摘要翻译： 引线框的引线指在其顶表面的一部分中具有多个通道或凹槽，其提供用于将接合线固定到引线指的锁定机构。 接合线可以通过缝合接合附接到引线指。

公开(公告)号：US20140120664A1

公开(公告)日：2014-05-01

申请号：US14147599

申请日：2014-01-06

申请人： Wai Keong Wong ,  Kok Leong Chan ,  Wei Kee Chan

发明人： Wai Keong Wong ,  Kok Leong Chan ,  Wei Kee Chan

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L21/4828 ,  H01L21/4842 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48458 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.

摘要翻译： 引线框的引线指在其顶表面的一部分中具有多个通道或凹槽，其提供用于将接合线固定到引线指的锁定机构。 接合线可以通过缝合接合附接到引线指。

公开(公告)号：US20110244637A1

公开(公告)日：2011-10-06

申请号：US13097066

申请日：2011-04-29

申请人： Poh Leng EU ,  Boon Yew Low ,  Wai Keong Wong

发明人： Poh Leng EU ,  Boon Yew Low ,  Wai Keong Wong

IPC分类号： H01L21/56 ,  B29C33/10

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/34 ,  H01L2924/14 ,  H01L2924/1433

摘要： A mold (10) including a first mold part (12) and a second mold part (14) define a mold cavity (16) therebetween. A gate (18) is formed in at least one of the first and second mold parts (12) and (14) such that the gate (18) communicates with the mold cavity (16). A vent (20) having a constricted portion (22) is arranged to communicate with the mold cavity (16). A substrate (28) including a base substrate (30) and an electrically conductive pattern (32) and (34) formed on the base substrate (30) may be received in the mold (10). A solder resist layer (36) is formed on the base substrate (30) and a portion of the electrically conductive pattern (32). A plurality of grooves (38) and (40) is formed in a staggered arrangement around a periphery of a molding area (42) on the substrate (28).

摘要翻译： 包括第一模具部件（12）和第二模具部件（14）的模具（10）在它们之间限定模具腔（16）。 在第一和第二模具部件（12）和（14）中的至少一个模具部件（14）中形成有浇口（18），使得浇口（18）与模腔（16）连通。 具有收缩部分（22）的排气口（20）被布置成与模腔（16）连通。 可以在模具（10）中容纳包括基底（30）和形成在基底（30）上的导电图案（32）和（34）的基底（28）。 在基底基板（30）和导电图案（32）的一部分上形成阻焊层（36）。 多个凹槽（38）和（40）以围绕衬底（28）上的模制区域（42）的周边的交错布置形成。

公开(公告)号：US09595505B2

公开(公告)日：2017-03-14

申请号：US14552943

申请日：2014-11-25

申请人： Shouhui Chen ,  Guat Kew Teh ,  Wai Keong Wong

发明人： Shouhui Chen ,  Guat Kew Teh ,  Wai Keong Wong

IPC分类号： H01L23/10 ,  H01L23/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00 ,  H01L23/473

CPC分类号： H01L25/0652 ,  H01L23/367 ,  H01L23/473 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92225 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of three dimensional (3D) System-in-Package (SiPs) and methods for producing 3D SiPs having improved heat dissipation capabilities are provided. In one embodiment, the 3D SiP includes a heat-dissipating structure having a first principal surface and a second principal surface opposite the first principal surface. The backside of a first microelectronic device is disposed adjacent and thermally coupled to the first principal surface of the heat-dissipating structure, while the backside of a second microelectronic device is disposed adjacent and thermally coupled to the second principal surface of the heat-dissipating structure. During operation of the 3D SiP, heat generated by the microelectronic devices is conductively transferred to and dissipated through the heat-dissipating structure.

摘要翻译： 提供了具有改进的散热能力的三维（3D）系统级封装（SiP）和用于生产3D SiP的方法的实施例。 在一个实施例中，3D SiP包括具有第一主表面和与第一主表面相对的第二主表面的散热结构。 第一微电子器件的背面被布置为与散热结构的第一主表面相邻并热耦合，而第二微电子器件的背面设置成与散热结构的第二主表面相邻并热耦合 。 在3D SiP的操作期间，由微电子器件产生的热量通过散热结构导电地传递并消散。

公开(公告)号：US09293395B2

公开(公告)日：2016-03-22

申请号：US14220118

申请日：2014-03-19

申请人： Wai Keong Wong ,  Soo Choong Chee ,  Stanley Job Doraisamy

发明人： Wai Keong Wong ,  Soo Choong Chee ,  Stanley Job Doraisamy

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8585 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05599

摘要： A lead frame for a semiconductor device includes a die paddle and leads situated on a perimeter of the lead frame. The die paddle has a metal frame and a number of substantially linear metal connecting bars within the frame. The connecting bars interconnect different locations of the frame to form a multiple triangles, where a triangular-shaped cavity is formed within each triangle. An overall area of the cavities is greater than an overall area of the connecting bars.

摘要翻译： 用于半导体器件的引线框架包括管芯焊盘和位于引线框架的周边上的引线。 模具板具有金属框架和框架内的多个基本上线性的金属连接杆。 连接杆将框架的不同位置互连以形成多个三角形，其中在每个三角形内形成三角形空腔。 空腔的总面积大于连接条的总面积。

公开(公告)号：US20150221572A1

公开(公告)日：2015-08-06

申请号：US14170653

申请日：2014-02-03

申请人： Soon Kang Chan ,  Voon Kwai Leong ,  Wai Keong Wong

发明人： Soon Kang Chan ,  Voon Kwai Leong ,  Wai Keong Wong

IPC分类号： H01L23/31 ,  G01L9/00 ,  B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L23/04

CPC分类号： H01L23/3107 ,  B81B7/0038 ,  B81B2201/0264 ,  B81C1/00285 ,  B81C1/00333 ,  G01L9/0098 ,  G01L19/0092 ,  G01L19/147 ,  H01L21/54 ,  H01L21/56 ,  H01L23/04 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for applying a pressure-sensitive gel material during assembly of an array of pre-singulated packaged semiconductor devices. In the method, pressure-sensitive gel material is dispensed onto a first semiconductor device of the array, where the first semiconductor device is disposed within a first cavity. A first curing process is performed to partially cure the pressure-sensitive gel material in the first cavity. Pressure-sensitive gel material is then dispensed onto another semiconductor device of the array, where the other semiconductor device is disposed within another cavity. The first curing process is initiated before the dispensing of the pressure-sensitive gel material inside of the other cavity is completed and initially cures pressure-sensitive gel material for fewer than all of the pre-singulated packaged semiconductor devices of the array.

摘要翻译： 一种在组装预分解封装半导体器件的阵列期间施加压敏凝胶材料的方法。 在该方法中，将压敏凝胶材料分配到阵列的第一半导体器件上，其中第一半导体器件设置在第一腔内。 执行第一固化过程以部分地固化第一腔中的压敏凝胶材料。 然后将压敏凝胶材料分配到阵列的另一半导体器件上，其中另一个半导体器件设置在另一个空腔内。 首先固化过程是在完成另一个空腔内的压敏凝胶材料的分配完成之前开始的，并且最初固化压敏凝胶材料用于少于阵列的所有预分解封装的半导体器件。

公开(公告)号：US20130264693A1

公开(公告)日：2013-10-10

申请号：US13441924

申请日：2012-04-09

申请人： Wai Keong WONG ,  Kok Leong CHAN ,  Wei Kee CHAN

发明人： Wai Keong WONG ,  Kok Leong CHAN ,  Wei Kee CHAN

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L21/4828 ,  H01L21/4842 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48458 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be attached to the lead finger by stitch bonding.

摘要翻译： 引线框的引线指在其顶表面的一部分中具有多个通道或凹槽，其提供用于将接合线固定到引线指的锁定机构。 接合线可以通过缝合接合附接到引线指。

公开(公告)号：US08016183B2

公开(公告)日：2011-09-13

申请号：US12612687

申请日：2009-11-05

申请人： Wai Keong Wong ,  Sik Pong Lee

发明人： Wai Keong Wong ,  Sik Pong Lee

IPC分类号： B23K31/00 ,  B23K11/16

CPC分类号： B23K20/004 ,  B23K37/0408 ,  B23K37/0426 ,  B23K2101/42 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/78 ,  Y10S228/904

摘要： A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity. In operation, after the lead frame is clamped between the base clamping surface and clamping members, the controller allows the drive to provide the relative movement until the position sensor detects that an underside of the lead frame has abutted the die assembly support.

摘要翻译： 一种用于在引线接合期间夹紧模具组件的方法和可调夹紧系统。 该系统包括至少一对相对的底壁，每个基壁具有底部夹紧表面。 存在至少一对夹紧构件，每个夹紧构件可朝向相应的底部夹紧表面移动，从而夹紧模具组件的引线框架。 模具组件支撑件设置在该对相对的底壁和模具组件支撑件之间，并且一对相对的底壁提供空腔。 存在耦合到控制器的位置传感器，并且还存在可由控制器控制的驱动器。 驱动器提供模具组件支撑件相对于每个基座夹紧表面的运动，从而调节空腔的深度。 在操作中，在引线框架夹紧在基座夹持表面和夹紧构件之后，控制器允许驱动器提供相对运动，直到位置传感器检测到引线框架的下侧已经抵靠模具组件支撑件。