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    Pressure sensitive adhesive composition for touch panel
    6.
    发明授权
    Pressure sensitive adhesive composition for touch panel 有权
    触摸屏压敏胶组合物

    公开(公告)号：US09556364B2

    公开(公告)日：2017-01-31

    申请号：US13880611

    申请日：2011-10-20

    申请人： Min Soo Park ,  Se Woo Yang ,  Suk Ky Chang ,  Woo Ha Kim ,  Yoon Tae Hwang

    发明人： Min Soo Park ,  Se Woo Yang ,  Suk Ky Chang ,  Woo Ha Kim ,  Yoon Tae Hwang

    IPC分类号： B32B7/12 ,  C09J7/02 ,  C09J133/06 ,  C09J133/14

    CPC分类号： C09J7/0217 ,  C08L2203/206 ,  C09J7/29 ,  C09J7/38 ,  C09J7/385 ,  C09J133/066 ,  C09J133/14 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2203/318 ,  C09J2433/00 ,  Y10T428/2891

    摘要： Provided are a pressure-sensitive adhesive composition for a touch panel, a conductive film, a touch panel and a pressure-sensitive adhesive film. The exemplary pressure-sensitive adhesive composition for a touch panel, the conductive film or the pressure-sensitive adhesive film has excellent durability and optical properties such as transparency. In addition, such physical properties are stably maintained under severe conditions. Particularly, a pressure-sensitive adhesive layer is attached to a conductor thin film, and thus resistance change of the conductor thin film is effectively inhibited even when the conductor thin film is exposed to the severe conditions. Therefore, the pressure-sensitive adhesive composition may be effectively used to manufacture a touch panel.

    摘要翻译： 提供一种用于触摸面板，导电膜，触摸面板和压敏粘合剂膜的压敏粘合剂组合物。 用于触摸面板的示例性压敏粘合剂组合物，导电膜或压敏粘合剂膜具有优异的耐久性和诸如透明度的光学性质。 此外，这种物理性能在恶劣条件下稳定地保持。 特别是，在导体薄膜上附着有粘合剂层，因此即使在导体薄膜暴露于恶劣条件下也能够有效地抑制导体薄膜的电阻变化。 因此，可以有效地使用压敏粘合剂组合物来制造触摸面板。

    METHODS OF CURING A DIELECTRIC LAYER FOR MANUFACTURE OF A SEMICONDUCTOR DEVICE
    10.
    发明申请
    METHODS OF CURING A DIELECTRIC LAYER FOR MANUFACTURE OF A SEMICONDUCTOR DEVICE 有权
    用于制造半导体器件的电介质层的方法

    公开(公告)号：US20160307762A1

    公开(公告)日：2016-10-20

    申请号：US15093896

    申请日：2016-04-08

    申请人： Yoon-tae Hwang ,  Ki-joong Yoon ,  Moon-kyu Park ,  Sang-jin Hyun ,  Hoon-joo Na

    发明人： Yoon-tae Hwang ,  Ki-joong Yoon ,  Moon-kyu Park ,  Sang-jin Hyun ,  Hoon-joo Na

    IPC分类号： H01L21/28 ,  H01L29/40 ,  H01L29/423 ,  H01L21/02

    CPC分类号： H01L29/513 ,  H01L21/28176 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/78

    摘要： A method of curing a dielectric layer, such as a dielectric layer that has a relatively small thickness and/or a narrow width or a complicated shape, is provided. The method of curing a dielectric layer for the manufacture of a semiconductor device includes providing the dielectric layer, wherein the dielectric layer is on a semiconductor layer; forming a first metal-containing layer on the dielectric layer; forming a curing atom screening region in an upper portion of the first metal-containing layer by injecting screening atoms onto an upper surface of the first metal-containing layer; injecting curing atoms into the first metal-containing layer through the upper surface of the first metal-containing layer; and flowing the curing atoms into the dielectric layer in an atmosphere at a first temperature.

    摘要翻译： 提供固化电介质层的方法，例如具有相对较小厚度和/或窄宽度或复杂形状的电介质层。 固化用于制造半导体器件的电介质层的方法包括提供介电层，其中介电层在半导体层上; 在介电层上形成第一含金属层; 通过将筛选原子注入第一含金属层的上表面，在第一含金属层的上部形成固化原子筛选区; 通过第一含金属层的上表面将固化原子注入第一含金属层; 并在第一温度的气氛中将固化原子流入电介质层。