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公开(公告)号：US06429531B1
公开(公告)日：2002-08-06
申请号：US09551312
申请日：2000-04-18
申请人： Addi B. Mistry , Rina Chowdhury , Scott K. Pozder , Deborah A. Hagen , Rebecca G. Cole , Kartik Ananthanarayanan , George F. Carney
发明人： Addi B. Mistry , Rina Chowdhury , Scott K. Pozder , Deborah A. Hagen , Rebecca G. Cole , Kartik Ananthanarayanan , George F. Carney
IPC分类号： H01L2348
CPC分类号： H01L24/11 , H01L23/3171 , H01L24/13 , H01L2224/0401 , H01L2224/05155 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05567 , H01L2224/05647 , H01L2224/05655 , H01L2224/1145 , H01L2224/11462 , H01L2224/1147 , H01L2224/11472 , H01L2224/119 , H01L2224/11912 , H01L2224/13022 , H01L2224/13076 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/83101 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/00014 , H01L2924/01083 , H01L2924/00012 , H01L2924/013
摘要： An interconnect structure, such as a flip-chip structure, including a base pad and a stud formed on the base pad and extending from the base pad is disclosed. The stud and base pad are formed to be continuous and of substantially the same electrically conductive base material. Typically, a solder structure is formed on the stud wherein the solder structure is exposed for subsequent reflow attachment to another structure. The present invention relates to packaging integrated circuits, more particularly to the structure and processing of a stud and bump without the standard under bump metallurgy.
摘要翻译： 公开了一种互连结构，例如倒装芯片结构，包括形成在基座上并从基座延伸的基座和螺柱。 螺柱和基垫形成为连续的和基本上相同的导电基材。 通常，焊料结构形成在螺柱上，其中焊料结构被暴露以用于随后的回流附接到另一结构。 本发明涉及封装集成电路，更具体地涉及没有标准凸块下冶金的螺柱和凸块的结构和加工。
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公开(公告)号：US5776798A
公开(公告)日：1998-07-07
申请号：US708296
申请日：1996-09-04
CPC分类号： H01L23/24 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L24/97 , H01L2223/54486 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/12042 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043
摘要： A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).
摘要翻译： 半导体封装基板（10）具有基本相同的封装位置阵列（13,14,16,21,22和23）。 封装位置（13,14,16,21,22和23）的整个阵列由密封剂（19）覆盖。 单个包装位置（13,14,16,21,22和23）通过锯切通过密封剂（19）和下面的半导体封装衬底（10）而被分割。
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公开(公告)号：US07927927B2
公开(公告)日：2011-04-19
申请号：US09928737
申请日：2001-08-13
IPC分类号： H01L21/332
CPC分类号： H01L23/24 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L24/97 , H01L2223/54486 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/12042 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2224/81 , H01L2924/00
摘要： A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and 21) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (11).
摘要翻译： 半导体封装衬底（11）具有基本相同的封装位置阵列（13,14,16和21）。 封装位置（13,14,16和21）的整个阵列由密封剂（19）覆盖。 单个包装部位（13,14,16和21）通过锯切通过密封剂（19）和下面的半导体封装衬底（11）而被分割。
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公开(公告)号：US07088009B2
公开(公告)日：2006-08-08
申请号：US10644163
申请日：2003-08-20
申请人： Deborah A. Hagen
发明人： Deborah A. Hagen
IPC分类号： H01L23/12
CPC分类号： H01L24/06 , H01L23/3677 , H01L23/552 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/4917 , H01L2224/49175 , H01L2224/4943 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2224/48744 , H01L2924/00012
摘要： A system (10) is disclosed having a circuit portion (18,26,36) containing more than electrical conductors and a wirebonded assemblage (12,14,16) overlying the circuit portion (18,26,36). The wirebonded assemblage (12,14,16) comprises a plurality of wirebonded wires ((50,52),(60,64),(66,68)), each of the plurality of wirebonded wires being electrically coupled. The wirebonded assemblage (12,14,16) provides electrical shielding for the circuit portion (18,26,36). In one embodiment, the wirebonded assemblage provides for heat spreading.
摘要翻译： 公开了一种具有包含多于电导体的电路部分（18,26,36）和覆盖电路部分（18,26,36）的引线键合组合（12,14,16）的系统（10）。 引线键合组合（12,14,16）包括多个引线键合线（（50,52），（60,64），（66,68）），所述多个引线键合线中的每一个电耦合。 引线键合组合（12,14,16）为电路部分（18,26,36）提供电屏蔽。 在一个实施例中，引线键合组合提供热扩散。
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