公开(公告)号：US07795712B2

公开(公告)日：2010-09-14

申请号：US12204493

申请日：2008-09-04

申请人： Alvin Wee Beng Tatt ,  Fuaida Harun ,  Soon Hock Tong ,  Robert-Christian Hagen ,  Yang Hong Heng ,  Kean Cheong Lee

发明人： Alvin Wee Beng Tatt ,  Fuaida Harun ,  Soon Hock Tong ,  Robert-Christian Hagen ,  Yang Hong Heng ,  Kean Cheong Lee

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L21/565 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.

摘要翻译： 电子部件包括引线框架，半导体芯片和封装体。 引线框架包括散热器区域，多个导电引线指，至少一个非导电连接条和金属接头。 金属接头将至少一个非导电连接杆连接到散热器区域。 半导体芯片设置在位于散热器区域上的芯片焊盘上。 封装体覆盖半导体芯片的至少一部分，至少一部分非导电连接条和引线框架的一部分。

公开(公告)号：US20090051017A1

公开(公告)日：2009-02-26

申请号：US12204493

申请日：2008-09-04

申请人： Beng Tatt Wee ,  Fuaida Harun ,  Soon Hock Tong ,  Robert-Christian Hagen ,  Yang Hong Heng ,  Kean Cheong Lee

发明人： Beng Tatt Wee ,  Fuaida Harun ,  Soon Hock Tong ,  Robert-Christian Hagen ,  Yang Hong Heng ,  Kean Cheong Lee

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.

摘要翻译： 电子部件包括引线框架，半导体芯片和封装体。 引线框架包括散热器区域，多个导电引线指，至少一个非导电连接条和金属接头。 金属接头将至少一个非导电连接杆连接到散热器区域。 半导体芯片设置在位于散热器区域上的芯片焊盘上。 封装体覆盖半导体芯片的至少一部分，至少一部分非导电连接条和引线框架的一部分。

公开(公告)号：US07575173B2

公开(公告)日：2009-08-18

申请号：US11341892

申请日：2006-01-30

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： G06K19/00

CPC分类号： H01L21/568 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07747 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

摘要翻译： 用于联系数据传输的智能卡包括安装在卡体内的卡体和智能卡模块。 智能卡模块包括具有有源上表面的半导体芯片，围绕半导体芯片的塑料壳体化合物，并且包括至少一个与半导体芯片的有源上表面共面的表面;第一介电层，其布置在 塑料外壳复合表面和半导体芯片的有源上表面上，一个或多个中介层金属化层，其通过另外的电介质层隔离并连接到半导体芯片的有源上表面和外部接触表面。 外部接触表面形成在最外侧的插入层上，便于接触数据传输。 智能卡模块不使用接合线，体积非常小。

公开(公告)号：US07517722B2

公开(公告)日：2009-04-14

申请号：US11491746

申请日：2006-07-24

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/00013 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099

摘要： An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.

摘要翻译： 电子部件和坯件具有第一和第二塑料层的塑料包埋化合物。 半导体芯片以这样的方式嵌入第一塑料层中，使得它们的边缘被珠子包围。 第二塑料层补偿第一塑料层的上边界的不均匀性。

公开(公告)号：US20060255478A1

公开(公告)日：2006-11-16

申请号：US10548854

申请日：2004-03-09

申请人： Robert-Christian Hagen ,  Simon Jerebic ,  Robert Hagen

发明人： Robert-Christian Hagen ,  Simon Jerebic ,  Robert Hagen

IPC分类号： H01L23/28 ,  H01L21/00

CPC分类号： H01L23/3142 ,  H01L21/56 ,  H01L23/3107 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/18301 ,  H01L2924/00

摘要： The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides are embedded in a plastic molding compound. The lateral sides and/or the rear side of the semiconductor chip have an anchoring region, by means of which the semiconductor chip is in positive engagement with the surrounding plastic molding compound. The invention also relates to a method for producing the component.

公开(公告)号：US06902951B2

公开(公告)日：2005-06-07

申请号：US10696369

申请日：2003-10-29

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Christian Stuempfl ,  Stefan Wein ,  Holger Woerner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Christian Stuempfl ,  Stefan Wein ,  Holger Woerner

IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L24/96 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semiconductor chip on a rewiring substrate.

摘要翻译： 作为多芯片模块，电子设备具有集成到引线框架中的两个或更多个半导体芯片，使得引线框架的放置侧和电路芯片的有源顶侧齐平并具有公共的精细布线平面。 引线框架被布置为在重新布线基板上的扩展半导体芯片。

公开(公告)号：US06683374B2

公开(公告)日：2004-01-27

申请号：US10232172

申请日：2002-08-30

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

摘要翻译： 电子部件具有至少第一半导体芯片模块，第二半导体芯片模块和用于容纳半导体芯片模块的基板。 在这种情况下，两个半导体芯片模块的有源芯片表面均具有中心接触区域，这些中心接触区域彼此相对配置。 形成在中心接触区域上并彼此对应的各个焊接区域彼此相对并且彼此对准并且导电连接。

公开(公告)号：US20080284043A1

公开(公告)日：2008-11-20

申请号：US10598483

申请日：2005-02-23

申请人： Robert-Christian Hagen ,  Jens Pohl

发明人： Robert-Christian Hagen ,  Jens Pohl

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.

摘要翻译： 公开了一种用于半导体部件堆叠的基底半导体部件。 在一个实施例中，基底半导体部件具有中央布置在刚性布线基板上的半导体芯片。 布线基板在其边缘区域中具有电连接到外部触点并且同时接触半导体芯片的区域并且还与堆叠接触区域的接触焊盘。 堆叠接触区域同时形成基底半导体部件的上侧，并且具有对应于待堆叠的半导体部件的外部触头的布置图案的布置图案。

公开(公告)号：US07327023B2

公开(公告)日：2008-02-05

申请号：US11246545

申请日：2005-10-11

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US20070278639A1

公开(公告)日：2007-12-06

申请号：US11572873

申请日：2005-07-21

申请人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/02 ,  H01L21/00 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

摘要翻译： 公开了一种具有布线基板和半导体器件堆叠的中间布线板的半导体堆叠和半导体基底器件。 在一个实施例中，半导体芯片布置在中间布线板和布线基板之间，该布线基板一方面通过布线基板与布线基板的下侧的外部触点电连接，另一方面与布线基板 布线基板的边缘区域的区域。 中间布线板具有成角度的外部扁平导体，其电连接在布线板的接触端子区域中。 此外，在中间布线板的上侧，布置在内部扁平导体的自由端上的是外部接触端子区域，其尺寸和布置对应于要堆叠的半导体器件的外部触点。