摘要:
A circuit assembly that includes a circuitized substrate having a dielectric interior layer with a first surface and at least one hole therein. A filler material substantially fills the hole within the dielectric interior layer. A first wiring layer is positioned on the first surface of the dielectric interior layer, wherein the first wiring layer substantially covers the hole and assists in retaining the filler material within the hole in the dielectric interior layer. A first dielectric photoresist layer is positioned on the first wiring layer and on the first surface of the dielectric interior layer. The first dielectric photoresist layer also includes at least one hole therein. The filler material also substantially fills the hole within the first dielectric photoresist layer. A second wiring layer is positioned on the first dielectric photoresist layer and includes a plurality of conductive pads as part thereof. At least one external component can be electrically coupled to the conductive pads of the second wiring layer.
摘要:
A process for manufacturing circuit boards comprising providing a circuitized substrate having a dielectric surface, providing a peel apart structure including a metal layer and a peelable film, laminating the peel apart structure to the circuitized substrate with the metal layer positioned adjacent said dielectric surface, forming holes in the circuitized substrate through the peel apart structure, applying a filler material including an organic base to the peel apart structure, applying a sacrificial film onto the filler material, and applying sufficient heat and pressure to the sacrificial film to force the filler material into the holes to substantially fill the holes is provided.
摘要:
An information handling system is provided which comprises: a metal enclosure; at least one circuit assembly positioned within said metal enclosure, said circuit assembly including a circuitized substrate having at least one dielectric interior layer including a first surface and at least one hole therein; means for providing electrical power to said circuitized substrate within said metal enclosure; a filler material, wherein said filler material substantially fills said at least one hole within said at least one dielectric interior layer; a first wiring layer positioned on said first surface of said at least one dielectric interior layer, wherein said first wiring layer substantially covers said at least one hole having said filler material therein, said first wiring layer assisting in retaining said filler material within said at least one hole in said at least one dielectric interior layer; a first dielectric photoresist layer positioned on said first wiring layer and on said first surface of said at least one dielectric interior layer, wherein said first dielectric photoresist layer also includes at least one hole therein, said filler material also substantially filling said at least one hole within said first dielectric photoresist layer; a second wiring layer positioned on said first dielectric photoresist layer; wherein said second wiring layer includes a plurality of conductive pads as part thereof; and at least one external component electrically coupled to said conductive pads of said second wiring layer.
摘要:
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil and a peelable film to the substrate, and forming holes in the substrate through the peelable film and foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is deposited onto a sacrificial carrier and the filler material is heated to at least partially cure it. The filler material is laminated onto the peelable film with sufficient heat and pressure to force the filler material to fill the holes. For thermoconductive filler the holes are filled sufficient for electrical connection through the holes. The peelable layer, sacrificial carrier and filler material remaining therebetween are peeled off the copper foil. The filler material is abraded to the level of the foil and is then copper plated. The copper is patterned to form a wiring layer. A permanent dielectric photoresist layer is formed over the wiring layer and via holes are formed through the photoimagable dielectric over pads and conductors of the wiring layer. Holes are formed through the substrate and the photoimagable dielectric, walls of the via holes, and walls of the through holes are copper plated. The copper plating on the photoimagable dielectric is patterned to form an exterior wiring layer which is covered by solder resist with windows over lands around the through holes and surface mount connection pads of the exterior wiring layer to form a high density circuitized substrate. Surface mount components and/or pin in hole components are attached to the circuitized substrate with solder joints between terminals of the components and the lands and/or connection pads to form a high density circuit board assembly. One or more of the circuit board assemblies are mounted in an enclosure with a power supply, CPU, RAM, and I/O means to form an improved information handling system with increased performance due to shorter signal flight times due to the high component density.
摘要:
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil to the substrate, and forming holes in the substrate through the foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is deposited into the holes and is heated to at least partially cure it. The surface of the filler material is seeded and electrolessly plated to form a conductive coating on the metal foil and the filler material. The coating is then patterned to form a wiring layer. A second set of holes may be formed in the circuitized substrate after the hole filling step, which are also electrolessly plated.
摘要:
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil and a peelable film to the substrate, and forming holes in the substrate through the peelable film and foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is laminated onto the peelable film with sufficient heat and pressure to force the filler material to fill the holes. For thermoconductive filler the holes are filled sufficient for electrical connection through the holes. The filler material is abraded to the level of the foil and is then copper plated. The copper is patterned to form a wiring layer. A permanent dielectric photoresist layer is formed over the wiring layer and via holes are formed through the photoimageable dielectric over pads and conductors of the wiring layer. Holes are formed through the substrate and the photoimageable dielectric, walls of the via holes, and walls of the through holes are copper plated. The copper plating on the photoimageable dielectric is patterned of form an exterior wiring layer. Components and/or pins are attached to the surface of the circuitized substrate with solder joints to form a high density circuit board assembly.
摘要:
A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.
摘要:
A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.
摘要:
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.
摘要:
Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A permanent photoimagable dielectric layer is formed over the wiring layer and via holes are formed through the dielectric layer over pads and conductors of the wiring layer. Holes are formed through the substrate and substrate surfaces including the photoimagable dielectric, walls of the via holes, and walls of the through holes subjected to an electroless copper plating process. The process includes seeding the surface, coating the surface with a first solution containing surfactant and electroplating in a second solution in which the level of surfactant is regulated by determining the surface tension and metering surfactant addition to the second solution depending on the determination of surface tension. The copper plating on the photoimagable dielectric is patterned to form an exterior wiring layer which is covered by solder resist with windows over lands around the through holes and surface mount connection pads of the exterior wiring layer to form a high density circuitized substrate. Surface mount components and/or pin in hole components are attached to the circuitized substrate with solder joints between terminals of the components and the lands and/or connection pads to form a high density circuit board assembly. One or more of the circuit board assemblies are mounted in an enclosure with a power supply, CPU, RAM, and I/O means to form an information handling system with increased performance due to shorter signal flight times due to the higher device density.