公开(公告)号：US20070075404A1

公开(公告)日：2007-04-05

申请号：US11163035

申请日：2005-10-03

申请人： Antonio Dimaano ,  Il Kwon Shim ,  Sheila Rima Magno ,  Dennis Guillermo

发明人： Antonio Dimaano ,  Il Kwon Shim ,  Sheila Rima Magno ,  Dennis Guillermo

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including an integrated circuit package system including an integrated circuit and a lead frame. The lead frame has a multi-surface die attach pad and the integrated circuit is mounted to the multi-surface die attach pad.

摘要翻译： 提供一种集成电路封装系统，其包括集成电路封装系统，其包括集成电路和引线框架。 引线框架具有多表面管芯连接焊盘，并且集成电路安装到多表面管芯附接焊盘。

公开(公告)号：US20070063354A1

公开(公告)日：2007-03-22

申请号：US11530802

申请日：2006-09-11

申请人： Sheila Rima Magno ,  Byung Tai Do ,  Dennis Guillermo ,  Antonio Dimaano

发明人： Sheila Rima Magno ,  Byung Tai Do ,  Dennis Guillermo ,  Antonio Dimaano

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied on the die at the conductive wires for preventing wire sweep and the sealant is free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are encapsulated in an encapsulant.

摘要翻译： 一种用于制造抗线扫描半导体封装件的方法提供附接到插入件的管芯。 管芯通过导线与插入器电连接。 在导线上的模具上施加密封剂以防止电线扫掠，并且密封剂与插入件不接触。 模具，插入件，导线和密封剂被封装在密封剂中。

公开(公告)号：US20060043564A1

公开(公告)日：2006-03-02

申请号：US11215090

申请日：2005-08-29

申请人： Antonio Dimaano ,  Byung Do ,  Dennis Guillermo ,  Sheila Rima Magno

发明人： Antonio Dimaano ,  Byung Do ,  Dennis Guillermo ,  Sheila Rima Magno

IPC分类号： H01L23/24

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/16151 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An encapsulant encapsulates the die, the substrate, at least a portion of the heat spreader, the first encapsulant guide, and the heat spreader air vent such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent, thus preventing the formation of air pockets under the heat spreader.

摘要翻译： 将模具附接到基底并且封闭在散热器中，散热器具有第一密封剂引导件和在其中延伸穿过的散热器中的散热器通风口。 密封剂封装模具，衬底，散热器的至少一部分，第一密封剂引导件和散热器通风口，使得密封剂通过第一密封剂引导件进入散热器，空气通过散热器通过 散热器通风口，从而防止在散热器下形成气泡。

公开(公告)号：US20060043612A1

公开(公告)日：2006-03-02

申请号：US10934835

申请日：2004-09-02

申请人： Sheila Magno ,  Byung Tai Do ,  Dennis Guillermo ,  Antonio Dimaano

发明人： Sheila Magno ,  Byung Tai Do ,  Dennis Guillermo ,  Antonio Dimaano

IPC分类号： H01L23/52

CPC分类号： H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied to the conductive wires and optionally the die to prevent wire sweep, the sealant being applied free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are enclosed in an encapsulant.

摘要翻译： 一种用于制造抗线扫描半导体封装件的方法提供附接到插入件的管芯。 管芯通过导线与插入器电连接。 将密封剂施加到导电线和任选的模具以防止电线扫掠，密封剂被施加而不与插入物接触。 芯片，插入件，导线和密封剂封装在密封剂中。

公开(公告)号：US20070262423A1

公开(公告)日：2007-11-15

申请号：US11383038

申请日：2006-05-12

申请人： Antonio Dimaano ,  Erick Dahilig ,  Sheila Marie Alvarez ,  Robinson Quiazon ,  Jose Caparas

发明人： Antonio Dimaano ,  Erick Dahilig ,  Sheila Marie Alvarez ,  Robinson Quiazon ,  Jose Caparas

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L21/565 ,  H01L23/49548 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.

摘要翻译： 提供具有通气孔的集成电路封装系统，包括提供片材，在片材上形成引线框架阵列，在引线框阵列上形成引线框架通气孔，将集成电路连接到引线框架阵列，将引线框阵列安装在模具中 并封装集成电路和引线框阵列。

公开(公告)号：US20050205987A1

公开(公告)日：2005-09-22

申请号：US11128014

申请日：2005-05-12

申请人： Tan Hwee ,  Roman Perez ,  Kee Lau ,  Alex Chew ,  Antonio Dimaano

发明人： Tan Hwee ,  Roman Perez ,  Kee Lau ,  Alex Chew ,  Antonio Dimaano

IPC分类号： H01L23/31 ,  H01L23/36 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/36 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/96 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2924/18162 ,  H01L2224/05647 ,  H01L2924/00014

摘要： A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next level as is. An additional embodiment describes the addition of a thermal heat sink to the packaged chip.

公开(公告)号：US20070210443A1

公开(公告)日：2007-09-13

申请号：US11276646

申请日：2006-03-08

申请人： Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano ,  Heap Hoe Kuan ,  Tsz Yin Ho

发明人： Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano ,  Heap Hoe Kuan ,  Tsz Yin Ho

IPC分类号： H01L23/12

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.

摘要翻译： 一种集成电路封装在封装系统上，包括形成互连集成电路封装并将互连集成电路封装上的扩展引线集成电路封装，其中延伸引线集成电路封装的模帽面向互连集成电路的模具盖 包。

公开(公告)号：US20070210424A1

公开(公告)日：2007-09-13

申请号：US11276647

申请日：2006-03-08

申请人： Tsz Yin Ho ,  Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano ,  Heap Hoe Kuan

发明人： Tsz Yin Ho ,  Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano ,  Heap Hoe Kuan

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit package in package system including forming a base integrated circuit package with a base lead having a portion with a substantially planar base surface, forming an extended-lead integrated circuit package with an extended lead having a portion with a substantially planar lead-end surface, and stacking the extended-lead integrated circuit package over the base integrated circuit package with the substantially planar lead-end surface coplanar with the substantially planar base surface.

摘要翻译： 一种封装系统中的集成电路封装，包括形成具有基部引线的基极集成电路封装，所述基极引线具有基本平坦的基面的部分，形成具有延伸引线的延伸引线集成电路封装，所述延伸引线具有基本平坦的引线端部分 表面，并且在基本集成电路封装上堆叠延伸引线集成电路封装，其中基本平坦的引出端表面与基本平坦的基面共面。

公开(公告)号：US20070209834A1

公开(公告)日：2007-09-13

申请号：US11276645

申请日：2006-03-08

申请人： Heap Hoe Kuan ,  Tsz Yin Ho ,  Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano

发明人： Heap Hoe Kuan ,  Tsz Yin Ho ,  Dioscoro Merilo ,  Seng Guan Chow ,  Antonio Dimaano

IPC分类号： H01R13/46 ,  H05K5/00

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An integrated circuit leaded stacked package system including forming an no-lead integrated circuit package having a mold cap, and attaching a mold cap of an extended-lead integrated circuit package facing the mold cap of the no-lead integrated circuit package.

摘要翻译： 一种集成电路引线堆叠封装系统，包括形成具有模具帽的无引线集成电路封装，以及附接面向无引线集成电路封装的模具帽的延伸引线集成电路封装的模具盖。

公开(公告)号：US20070200230A1

公开(公告)日：2007-08-30

申请号：US11307906

申请日：2006-02-27

申请人： Seng Guan Chow ,  Heap Hoe Kuan ,  Dioscoro Merilo ,  Antonio Dimaano

发明人： Seng Guan Chow ,  Heap Hoe Kuan ,  Dioscoro Merilo ,  Antonio Dimaano

IPC分类号： H01L23/34

CPC分类号： H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00

摘要： A stackable integrated circuit package system is provided placing a first integrated circuit die having an interconnect provided thereon in a substrate having a cavity, encapsulating the first integrated circuit die, having the interconnect exposed, in the cavity and along a first side of the substrate, mounting a second integrated circuit die to the first integrated circuit die, and encapsulating the second integrated circuit die along a second side of the substrate.

摘要翻译： 提供了一种可堆叠的集成电路封装系统，其将具有设置在其上的互连的第一集成电路管芯放置在具有空腔的衬底中，所述衬底具有空腔，将具有互连的第一集成电路管芯在空腔中并沿着衬底的第一侧封装， 将第二集成电路管芯安装到第一集成电路管芯上，并沿着衬底的第二侧封装第二集成电路管芯。