公开(公告)号：US06516129B2

公开(公告)日：2003-02-04

申请号：US09893812

申请日：2001-06-28

申请人： Benson Chan ,  Paul F. Fortier ,  Francois Guindon ,  Gerald Daniel Malagrino, Jr. ,  James Robert Moon ,  James Earl Olson ,  John Henry Sherman

发明人： Benson Chan ,  Paul F. Fortier ,  Francois Guindon ,  Gerald Daniel Malagrino, Jr. ,  James Robert Moon ,  James Earl Olson ,  John Henry Sherman

IPC分类号： G02B600

CPC分类号： G02B6/42 ,  G02B6/3807 ,  G02B6/4251 ,  G02B6/4255 ,  G02B6/4261 ,  G02B2006/4297

摘要： A plug which has a plugging portion and a stem extending therefrom is formed of an elastomeric material in order to deform to create a wiping engagement and a seal with the walls of a receiving cavity. The stem and plugging portion include both cavities for receiving alignment pins in the device being plugged and a manually engageable portion on a distal end of the stem for removing the plug from the sealed cavity, such as within an optical subassembly module. The side edges of the plugging member conform to the cavity cross-section to enhance the sealing yet do not unduly deform the member. The sealing member is formed with one or more standoffs to engage an end face of the cavity, assuring no contact between the optical elements and the plug. The edges of the plug deform upon insertion to create the seal and form a wiping engagement with the cavity interior.

摘要翻译： 具有堵塞部分和从其延伸的杆的塞子由弹性体材料形成，以便变形以产生与接收腔壁的擦拭接合和密封。 杆和堵塞部分包括用于接收被堵塞的装置中的对准销的两个空腔和用于从密封空腔（例如在光学子组件模块内）移除插头的杆的远端上的可手动接合部分。 堵塞构件的侧边缘符合空腔横截面以增强密封，但不要使构件过度变形。 密封构件形成有一个或多个支座以接合空腔的端面，确保光学元件和插头之间没有接触。 插头的边缘在插入时变形以产生密封并与腔体内部形成擦拭接合。

公开(公告)号：US06652159B2

公开(公告)日：2003-11-25

申请号：US09894934

申请日：2001-06-28

申请人： Benson Chan ,  Paul F. Fortier ,  Francois Guindon ,  Glen Walden Johnson ,  Joseph Kuczynski ,  Gerald Daniel Malagrino, Jr. ,  James Robert Moon ,  David Roy Motschman ,  John Henry Sherman

发明人： Benson Chan ,  Paul F. Fortier ,  Francois Guindon ,  Glen Walden Johnson ,  Joseph Kuczynski ,  Gerald Daniel Malagrino, Jr. ,  James Robert Moon ,  David Roy Motschman ,  John Henry Sherman

IPC分类号： G02B642

CPC分类号： G02B6/4277 ,  G02B6/3849 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4292

摘要： An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

摘要翻译： 光收发器装置包括保持器组件。 保持器组件包括适于联接到光纤电缆的至少一个壳体，以及具有载体的至少一个载体组件和附接到载体的芯片芯片。 芯片芯片具有至少一个有源区域。 光收发器装置还包括设置在壳体内的至少一个光耦合器，用于将至少一个有源区域光耦合到光纤电缆。 光收发器装置还包括其上设置有保持器组件的层压组件。 芯片芯片电耦合到层叠组件。

公开(公告)号：US06676301B2

公开(公告)日：2004-01-13

申请号：US09894714

申请日：2001-06-28

申请人： Benson Chan ,  Glen Walden Johnson ,  Joseph Kuczynski ,  Gerald Daniel Malagrino, Jr. ,  James Robert Moon ,  John Henry Sherman

发明人： Benson Chan ,  Glen Walden Johnson ,  Joseph Kuczynski ,  Gerald Daniel Malagrino, Jr. ,  James Robert Moon ,  John Henry Sherman

IPC分类号： G02B636

CPC分类号： G02B6/4249 ,  G02B6/421 ,  G02B6/4231 ,  G02B6/4292

摘要： An optical coupler includes a first plate and a second plate superposed over the first plate. At least the second plate has at least one groove formed therein. The at least one groove extends continuously from one edge of the second plate to another edge of the second plate. An optical fiber is disposed in the at least one groove.

摘要翻译： 光耦合器包括叠置在第一板上的第一板和第二板。 至少第二板具有形成在其中的至少一个凹槽。 所述至少一个凹槽从所述第二板的一个边缘连续地延伸到所述第二板的另一个边缘。 在所述至少一个凹槽中设置光纤。

公开(公告)号：US06712527B1

公开(公告)日：2004-03-30

申请号：US09481903

申请日：2000-01-12

申请人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

发明人： Benson Chan ,  Mitchell S. Cohen ,  Paul F. Fortier ,  Ladd W. Freitag ,  Richard R. Hall ,  Glen W. Johnson ,  How Tzu Lin ,  John H. Sherman

IPC分类号： G02B636

CPC分类号： G02B6/4201 ,  G02B6/3885 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4268 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H05K1/189

摘要： A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

摘要翻译： 描述了将十二通道宽光纤电缆耦合到十二通道垂直腔面发射激光器（VCSEL）发射器和多通道垂直对准集成管芯（PAID）接收器的封装。 该封装允许通过垂直定向平行于光纤电缆的某些管芯并水平地定向某些其他管芯来降低组件封装的高度。 组件允许垂直定向的光电管芯通过柔性电路垂直地附接到水平取向的层压板。

公开(公告)号：US06547452B1

公开(公告)日：2003-04-15

申请号：US09568978

申请日：2000-05-11

申请人： Benson Chan ,  Paul F. Fortier ,  Francois M. Guindon ,  Glen W. Johnson ,  Martial A. Letourneau ,  John H. Sherman ,  Real Tetreault

发明人： Benson Chan ,  Paul F. Fortier ,  Francois M. Guindon ,  Glen W. Johnson ,  Martial A. Letourneau ,  John H. Sherman ,  Real Tetreault

IPC分类号： G02B636

CPC分类号： B29C45/14655 ,  B29C45/14065 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4255 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

摘要： Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

摘要翻译： 用于具有包覆成型芯片载体的光电子模块的对准系统包括用于接合定位销的钻孔或铣削基板拐角，以将基板精确地对准模具中用于模制基板上的二次模制框架。 包覆模制框架包括用于接收保持器柱的狭槽和三叶孔，以将保持器组件精确对准在包覆模制框架上。 包覆模制框架和保持器组件上的合作支座稳定了这些组件的组装，并提供了一个精确的间隙，用于接收粘合剂以永久地附接这两个部件。 保持器组件携载包括柔性电路的光电子部件，并且该柔性电路的远端部分和包覆模制框架中的接收腔的壁具有用于将柔性电路的远端电引线与电极焊盘阵列精确对准的配合特征 在基板上。 柔性电路的近端部分上的永久性护罩保护并有助于使邻近的电引线与光学管芯及其载体上的电焊盘对准。

公开(公告)号：US06822875B2

公开(公告)日：2004-11-23

申请号：US10281036

申请日：2002-10-24

申请人： Benson Chan ,  Paul Francis Fortier ,  Ladd William Freitag ,  Gary T. Galli ,  Francois Guindon ,  Glen Walden Johnson ,  Martial Letourneau ,  John H. Sherman ,  Real Tetreault

发明人： Benson Chan ,  Paul Francis Fortier ,  Ladd William Freitag ,  Gary T. Galli ,  Francois Guindon ,  Glen Walden Johnson ,  Martial Letourneau ,  John H. Sherman ,  Real Tetreault

IPC分类号： H05K710

CPC分类号： H01L23/3737 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4269 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H01L23/3733 ,  H01L2224/32057 ,  H01L2224/45144 ,  H01L2224/83385 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

摘要翻译： 一种用于收发机光电模块的散热器，包括双重直接热路径以及封闭多个芯片的结构，该芯片具有将发射机和接收机芯片彼此电隔离的中心腹板。 一种用于具有端口的光耦合器的保持器，其中注入有环氧树脂。 一种用于光电子模块的包覆成型基座，其具有在其上构建的环氧流量控制器构件。 光电子模块的装配方法包括间隙设置和TAB粘结工艺的变化。

公开(公告)号：US06508595B1

公开(公告)日：2003-01-21

申请号：US09569029

申请日：2000-05-11

申请人： Benson Chan ,  Paul Francis Fortier ,  Ladd William Freitag ,  Gary T. Galli ,  Francois Guindon ,  Glen Walden Johnson ,  Martial Letourneau ,  John H. Sherman ,  Real Tetreault

发明人： Benson Chan ,  Paul Francis Fortier ,  Ladd William Freitag ,  Gary T. Galli ,  Francois Guindon ,  Glen Walden Johnson ,  Martial Letourneau ,  John H. Sherman ,  Real Tetreault

IPC分类号： G02B642

CPC分类号： H01L23/3737 ,  G02B6/4201 ,  G02B6/421 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4269 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H01L23/3733 ,  H01L2224/32057 ,  H01L2224/45144 ,  H01L2224/83385 ,  H01L2924/01079 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

摘要翻译： 一种用于收发器光电模块的散热器，包括双重直接热路径和结构，其包围具有将发射器和接收器芯片彼此电隔离的中心腹板的多个芯片。 一种用于具有端口的光耦合器的保持器，其中注入有环氧树脂。 一种用于光电子模块的包覆成型基座，其具有在其上构建的环氧流量控制器构件。 光电子模块的装配方法包括间隙设置和TAB粘结工艺的变化。

公开(公告)号：US5785535A

公开(公告)日：1998-07-28

申请号：US591206

申请日：1996-01-17

申请人： William Louis Brodsky ,  Benson Chan ,  Glenn Edward Myrto ,  John Henry Sherman

发明人： William Louis Brodsky ,  Benson Chan ,  Glenn Edward Myrto ,  John Henry Sherman

IPC分类号： G06F1/18 ,  H01L23/32 ,  H01R4/26 ,  H01R12/51 ,  H01R12/57 ,  H01R33/76 ,  H05K3/32 ,  H05K7/10 ,  H01R9/09

CPC分类号： H01R12/57 ,  H01R12/79 ,  H05K3/325 ,  H05K7/1061 ,  H01R4/26

摘要： A computer system having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate mounted in the computer system enclosure, along with a power supply, a bus system, and connectors for communicating with units external to the enclosure. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.

摘要翻译： 具有能够更换表面安装部件的能力的计算机系统。 组件通过弹簧朝向安装在计算机系统外壳中的基板上的区域阵列位置以及电源，总线系统和用于与外壳外部的单元通信的连接器而偏置。 部件和弹簧定位在邻近区域阵列部位的基座内并用联接器机械地保持下来。 提供了一种用于其的互连结构。

公开(公告)号：US6015301A

公开(公告)日：2000-01-18

申请号：US121452

申请日：1998-07-23

申请人： William Louis Brodsky ,  Benson Chan ,  Glenn Edward Myrto ,  John Henry Sherman

发明人： William Louis Brodsky ,  Benson Chan ,  Glenn Edward Myrto ,  John Henry Sherman

IPC分类号： G06F1/18 ,  H01L23/32 ,  H01R4/26 ,  H01R12/51 ,  H01R12/57 ,  H01R33/76 ,  H05K3/32 ,  H05K7/10 ,  H01R9/09

CPC分类号： H01R12/57 ,  H01R12/79 ,  H05K3/325 ,  H05K7/1061 ,  H01R4/26

摘要： A surface mount socket having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.

摘要翻译： 具有能够更换表面安装部件的能力的表面安装插座。 组件通过弹簧偏向衬底上的区域阵列位置。 部件和弹簧定位在邻近区域阵列部位的基座内并用联接器机械地保持下来。 提供了一种用于其的互连结构。

公开(公告)号：US20130033827A1

公开(公告)日：2013-02-07

申请号：US13198756

申请日：2011-08-05

申请人： Rabindra N. Das ,  Voya R. Markovich ,  John M. Lauffer ,  Roy H. Magnuson ,  Konstantinos I. Papathomas ,  Benson Chan

发明人： Rabindra N. Das ,  Voya R. Markovich ,  John M. Lauffer ,  Roy H. Magnuson ,  Konstantinos I. Papathomas ,  Benson Chan

IPC分类号： H05K5/00 ,  H05K1/09 ,  B23K31/02 ,  H05K1/00 ,  H01B1/00 ,  H01B1/02

CPC分类号： H05K1/0313 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/52 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/097 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0257 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

摘要： A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.

摘要翻译： 用于连接多级Z轴互连的多层导电粘合剂（ECA）混合物和形成连接多级Z轴互连的ECA的方法。 具有多层能力的ECA包含允许糊料适应特定要求的组成成分的混合物，其中制造电路化衬底组件的方法，其中具有潜在不同的热膨胀系数（CTE）的两个或更多个子组件对齐，并且Z- 在连接期间创建轴互连。 导体的冶金和多层导电浆料的冶金被有效地混合，并且在配合子组件之间使用的可流动的中间电介质流动以接合和围绕导体耦合。