公开(公告)号：US5433631A

公开(公告)日：1995-07-18

申请号：US268907

申请日：1994-06-29

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

IPC分类号： H01R12/71 ,  H01R12/79 ,  H01R24/00 ,  H01R9/09

CPC分类号： H01R12/714 ,  H01R12/79

摘要： A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

公开(公告)号：US5386344A

公开(公告)日：1995-01-31

申请号：US9498

申请日：1993-01-26

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

IPC分类号： H01R12/71 ,  H01R12/79 ,  H01R24/00 ,  H01R23/68 ,  H01R4/58

CPC分类号： H01R12/714 ,  H01R12/79

摘要： A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

摘要翻译： 提供具有弹性体电缆连接器组件的柔性电路卡，用于在高性能计算机系统中的两个或多个印刷电路板之间传输高速信号。 柔性电路卡将电缆组件连接到印刷电路板。 柔性电路卡中的导体迹线延伸到弹性体端部并且终止于球形接触件，其成角度以擦拭印刷电路卡上的配合焊盘以进行电接触。 电缆组件使用连接到多个弹性体连接器的多根线。 至少一个弹性体连接器附接到电缆组件的每个端部，并且每个弹性体连接器具有多个触点，其用于与印刷电路板的表面上的多个焊盘配合。 本发明中描述的弹性体连接器提供垂直于印刷电路板表面的高密度电缆对板互连。

公开(公告)号：US5371654A

公开(公告)日：1994-12-06

申请号：US963346

申请日：1992-10-19

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01L23/52 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K7/00

CPC分类号： G01R1/07371 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07378 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174

摘要： The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection between adjacent assemblies. Methods for fabricating the electrical interconnection as a stand alone elastomeric sheet are described.

摘要翻译： 本发明涉及用于将三维结构中的诸如半导体芯片的电子器件封装在一起的结构，其允许电信号水平和垂直地传播。 该结构由多个组件形成。 每个组件由在多个电子装置的至少一个表面上设置的基板形成。 每个组件设置在相邻组件的堆叠中。 在相邻组件之间存在电互连，每个组件电连接。 由具有延伸穿过其中的多个孔的弹性体插入件形成的电互连。 孔阵列对应于基片上的电子器件阵列。 孔和电互连布置在电子器件阵列上，使得相邻电子器件之间的电互连。 组合堆叠被压缩，从而压缩相邻组件之间的电互连。 描述了用于制造作为独立弹性片的电互连的方法。

公开(公告)号：US5531022A

公开(公告)日：1996-07-02

申请号：US300620

申请日：1994-09-02

申请人： Brain S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

发明人： Brain S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01L23/52 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K3/40 ,  H01R9/09

CPC分类号： G01R1/07371 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07378 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174

摘要： The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection means electrically interconnecting each assembly. The electrical interconnection means is formed from an elastomeric interposer. The elastomeric interposer is formed from an elastomeric material having a plurality of electrical conductors extending therethrough, either in a clustered or un-clustered arrangement. The electrical interconnection means is fabricated having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection means is disposed over the array of electronic devices so that the electrical interconnection means is between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection means between adjacent assemblies. The substrate or each assembly is formed from a thermally conductive material such as diamond. A heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure. Methods for fabricating the electrical interconnection means as a stand alone elastomeric sheet are described. The ends of the plurality of conductors in the electrical interconnection means are fabricated so that upon compression between adjacent assemblies there is a wiping action between the conductor ends and contact locations on the adjacent assemblies to form a good electrical contact therewith.

公开(公告)号：US5635846A

公开(公告)日：1997-06-03

申请号：US55485

申请日：1993-04-30

申请人： Brian S. Beaman ,  Keith E. Fogel ,  Paul A. Lauro ,  Maurice H. Norcott ,  Da-Yuan Shih ,  George F. Walker

发明人： Brian S. Beaman ,  Keith E. Fogel ,  Paul A. Lauro ,  Maurice H. Norcott ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01L23/52 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  G01R31/02

CPC分类号： G01R1/07371 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07378 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174

摘要： A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

摘要翻译： 高密度测试探头用于测试晶圆形式的高密度和高性能集成电路或分立芯片。 测试探针由嵌入柔性或高模量弹性体材料的细长电导体的密集阵列形成。 使用陶瓷集成电路芯片封装基板等标准封装基板来提供空间变压器。 电线被连接到空间变压器表面上的接触焊盘阵列。 空间变压器由多层集成电路芯片封装基板形成。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并且与空间变压器电接触的线阵列。空间变压器可以具有一组引脚，这些引脚位于空间变压器的相反表面上， 其中细长导体被接合。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。

公开(公告)号：US5441690A

公开(公告)日：1995-08-15

申请号：US88016

申请日：1993-07-06

申请人： Juan Ayala-Esquilin ,  Brian S. Beaman ,  Rudolf A. Haring ,  James L. Hedrick ,  Da-Yuan Shih ,  George F. Walker

发明人： Juan Ayala-Esquilin ,  Brian S. Beaman ,  Rudolf A. Haring ,  James L. Hedrick ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01R11/01 ,  H01B3/46 ,  H01B5/16 ,  H01L23/14 ,  H01L23/538 ,  H01R43/00 ,  B29C33/42 ,  B32B15/02

CPC分类号： H01B3/46 ,  H01L23/145 ,  H01L23/5384 ,  H01L2924/0002 ,  Y10T428/31663

摘要： The present invention relates to an improved pinless connector for use in microelectronics comprising an improved elastomer resin of polysiloxane and filler.

摘要翻译： 本发明涉及用于微电子学的改进的无针连接器，其包括改进的聚硅氧烷和填料的弹性体树脂。

公开(公告)号：US4975079A

公开(公告)日：1990-12-04

申请号：US485016

申请日：1990-02-23

申请人： Brian S. Beaman ,  Keith E. Fogel ,  Jungihl Kim ,  Wolfgang Mayr ,  Jane M. Shaw ,  George F. Walker

发明人： Brian S. Beaman ,  Keith E. Fogel ,  Jungihl Kim ,  Wolfgang Mayr ,  Jane M. Shaw ,  George F. Walker

IPC分类号： G01R1/067 ,  G01R1/04 ,  G01R1/073 ,  G01R31/26 ,  H01R4/26 ,  H01R13/24

CPC分类号： G01R1/0483 ,  G01R1/07314 ,  H01R12/714 ,  H01R13/2485 ,  H01L2224/13021 ,  H01R2201/20

摘要： An electrical connector is described for making contact with a plurality of convex and deformable contacts on an electronic device. The electrical connector comprises a substrate having a plurality of conductors which extend above its surface. A polymeric material is disposed on the surface of the substrate and has openings which expose the conductors, each opening sized to receive one of the convex, deformable contacts, and to enable electrical connection between the exposed conductors and the deformable contacts. A mechanism is provided for urging the deformable contacts on the electronic device against the exposed conductors. The mechanism exerts sufficient force between the device and the conductors to cause some deformation of the convex contact areas by the conductors.

公开(公告)号：US20120286236A1

公开(公告)日：2012-11-15

申请号：US13555383

申请日：2012-07-23

申请人： Harold J. HOVEL ,  Qiang Huang ,  Xiaoyan Shao ,  James Vichiconti ,  George F. Walker

发明人： Harold J. HOVEL ,  Qiang Huang ,  Xiaoyan Shao ,  James Vichiconti ,  George F. Walker

IPC分类号： H01L29/06 ,  B82Y99/00

CPC分类号： H01L31/18 ,  B82Y10/00 ,  B82Y30/00 ,  C30B29/02 ,  C30B29/06 ,  C30B29/40 ,  C30B29/52 ,  C30B29/60 ,  C30B29/605 ,  C30B33/10 ,  H01L21/30604 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/125 ,  H01L31/0352 ,  H01L33/20

摘要： Segmented semiconductor nanowires are manufactured by removal of material from a layered structure of two or more semiconductor materials in the absence of a template. The removal takes place at some locations on the surface of the layered structure and continues preferentially along the direction of a crystallographic axis, such that nanowires with a segmented structure remain at locations where little or no removal occurs. The interface between different segments can be perpendicular to or at angle with the longitudinal direction of the nanowire.

摘要翻译： 在没有模板的情况下通过从两种或更多种半导体材料的层状结构中去除材料来制造分段半导体纳​​米线。 去除在层状结构的表面上的某些位置处发生，并且优选地沿着结晶轴的方向延伸，使得具有分段结构的纳米线保持在很少或不发生去除的位置。 不同片段之间的界面可以垂直于纳米线的纵向方向或与之相垂直。

公开(公告)号：US20120193231A1

公开(公告)日：2012-08-02

申请号：US13359750

申请日：2012-01-27

申请人： Ali Afzali-Ardakani ,  Stefan Harrer ,  Binquan Luan ,  Glenn J. Martyna ,  Hongbo Peng ,  Stephen M. Rossnagel ,  Gustavo A. Stolovitzky ,  Philip S. Waggoner ,  George F. Walker

发明人： Ali Afzali-Ardakani ,  Stefan Harrer ,  Binquan Luan ,  Glenn J. Martyna ,  Hongbo Peng ,  Stephen M. Rossnagel ,  Gustavo A. Stolovitzky ,  Philip S. Waggoner ,  George F. Walker

IPC分类号： G01N27/447 ,  G01N27/453

CPC分类号： G01N33/48721 ,  C12Q1/6869 ,  C12Q2563/116 ,  C12Q2563/157 ,  C12Q2565/607 ,  C12Q2565/631

摘要： A nanodevice is provided. A reservoir is filled with an ionic fluid. A membrane separates the reservoir, and the membrane includes electrode layers separated by insulating layers in which the electrode layers have an organic coating. A nanopore is formed through the membrane, and the organic coating on the electrode layers forms transient bonds to a base of a molecule in the nanopore. When a first voltage is applied to the electrode layers a tunneling current is generated by the base in the nanopore, and the tunneling current travels through the transient bonds formed to the base to be measured as a current signature for distinguishing the base.

摘要翻译： 提供了一个纳米设备。 储存器充满离子流体。 膜分离储存器，并且膜包括由绝缘层分离的电极层，其中电极层具有有机涂层。 通过膜形成纳米孔，并且电极层上的有机涂层与纳米孔中分子的碱基形成瞬态键。 当第一电压施加到电极层时，通过纳米孔中的基底产生隧道电流，并且隧道电流通过形成到待测量的基极的瞬态键作为用于区分基极的电流签名传播。

公开(公告)号：US06927472B2

公开(公告)日：2005-08-09

申请号：US09992344

申请日：2001-11-14

申请人： David K. Anderson ,  Tien-Jen Cheng ,  Timothy J. Dalton ,  Christopher V. Jahnes ,  Andrew Lu ,  Chandrasekhar Narayan ,  Kevin S. Petrarca ,  Richard P. Volant ,  George F. Walker

发明人： David K. Anderson ,  Tien-Jen Cheng ,  Timothy J. Dalton ,  Christopher V. Jahnes ,  Andrew Lu ,  Chandrasekhar Narayan ,  Kevin S. Petrarca ,  Richard P. Volant ,  George F. Walker

IPC分类号： H01L23/525 ,  H01L21/336

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method and structure for a fuse structure comprises an insulator layer, a plurality of fuse electrodes extending through the insulator layer to an underlying wiring layer, an electroplated fuse element connected to the electrodes, and an interface wall. The fuse element is positioned external to the insulator, with a gap juxtaposed between the insulator and the fuse element. The interface wall further comprises a first side wall, a second side wall, and an inner wall, wherein the inner wall is disposed within the gap. The fuse electrodes are diametrically opposed to one another, and the fuse element is perpendicularly disposed above the fuse electrodes. The fuse element is either electroplatted, electroless plated, or is an ultra thin fuse.