公开(公告)号：US5371654A

公开(公告)日：1994-12-06

申请号：US963346

申请日：1992-10-19

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01L23/52 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K7/00

CPC分类号： G01R1/07371 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07378 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174

摘要： The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection between adjacent assemblies. Methods for fabricating the electrical interconnection as a stand alone elastomeric sheet are described.

摘要翻译： 本发明涉及用于将三维结构中的诸如半导体芯片的电子器件封装在一起的结构，其允许电信号水平和垂直地传播。 该结构由多个组件形成。 每个组件由在多个电子装置的至少一个表面上设置的基板形成。 每个组件设置在相邻组件的堆叠中。 在相邻组件之间存在电互连，每个组件电连接。 由具有延伸穿过其中的多个孔的弹性体插入件形成的电互连。 孔阵列对应于基片上的电子器件阵列。 孔和电互连布置在电子器件阵列上，使得相邻电子器件之间的电互连。 组合堆叠被压缩，从而压缩相邻组件之间的电互连。 描述了用于制造作为独立弹性片的电互连的方法。

公开(公告)号：US5635846A

公开(公告)日：1997-06-03

申请号：US55485

申请日：1993-04-30

申请人： Brian S. Beaman ,  Keith E. Fogel ,  Paul A. Lauro ,  Maurice H. Norcott ,  Da-Yuan Shih ,  George F. Walker

发明人： Brian S. Beaman ,  Keith E. Fogel ,  Paul A. Lauro ,  Maurice H. Norcott ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01L23/52 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  G01R31/02

CPC分类号： G01R1/07371 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07378 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174

摘要： A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

摘要翻译： 高密度测试探头用于测试晶圆形式的高密度和高性能集成电路或分立芯片。 测试探针由嵌入柔性或高模量弹性体材料的细长电导体的密集阵列形成。 使用陶瓷集成电路芯片封装基板等标准封装基板来提供空间变压器。 电线被连接到空间变压器表面上的接触焊盘阵列。 空间变压器由多层集成电路芯片封装基板形成。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并且与空间变压器电接触的线阵列。空间变压器可以具有一组引脚，这些引脚位于空间变压器的相反表面上， 其中细长导体被接合。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。

公开(公告)号：US5386344A

公开(公告)日：1995-01-31

申请号：US9498

申请日：1993-01-26

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

IPC分类号： H01R12/71 ,  H01R12/79 ,  H01R24/00 ,  H01R23/68 ,  H01R4/58

CPC分类号： H01R12/714 ,  H01R12/79

摘要： A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

摘要翻译： 提供具有弹性体电缆连接器组件的柔性电路卡，用于在高性能计算机系统中的两个或多个印刷电路板之间传输高速信号。 柔性电路卡将电缆组件连接到印刷电路板。 柔性电路卡中的导体迹线延伸到弹性体端部并且终止于球形接触件，其成角度以擦拭印刷电路卡上的配合焊盘以进行电接触。 电缆组件使用连接到多个弹性体连接器的多根线。 至少一个弹性体连接器附接到电缆组件的每个端部，并且每个弹性体连接器具有多个触点，其用于与印刷电路板的表面上的多个焊盘配合。 本发明中描述的弹性体连接器提供垂直于印刷电路板表面的高密度电缆对板互连。

公开(公告)号：US5441690A

公开(公告)日：1995-08-15

申请号：US88016

申请日：1993-07-06

申请人： Juan Ayala-Esquilin ,  Brian S. Beaman ,  Rudolf A. Haring ,  James L. Hedrick ,  Da-Yuan Shih ,  George F. Walker

发明人： Juan Ayala-Esquilin ,  Brian S. Beaman ,  Rudolf A. Haring ,  James L. Hedrick ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01R11/01 ,  H01B3/46 ,  H01B5/16 ,  H01L23/14 ,  H01L23/538 ,  H01R43/00 ,  B29C33/42 ,  B32B15/02

CPC分类号： H01B3/46 ,  H01L23/145 ,  H01L23/5384 ,  H01L2924/0002 ,  Y10T428/31663

摘要： The present invention relates to an improved pinless connector for use in microelectronics comprising an improved elastomer resin of polysiloxane and filler.

摘要翻译： 本发明涉及用于微电子学的改进的无针连接器，其包括改进的聚硅氧烷和填料的弹性体树脂。

公开(公告)号：US5433631A

公开(公告)日：1995-07-18

申请号：US268907

申请日：1994-06-29

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

IPC分类号： H01R12/71 ,  H01R12/79 ,  H01R24/00 ,  H01R9/09

CPC分类号： H01R12/714 ,  H01R12/79

摘要： A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

公开(公告)号：US4975079A

公开(公告)日：1990-12-04

申请号：US485016

申请日：1990-02-23

申请人： Brian S. Beaman ,  Keith E. Fogel ,  Jungihl Kim ,  Wolfgang Mayr ,  Jane M. Shaw ,  George F. Walker

发明人： Brian S. Beaman ,  Keith E. Fogel ,  Jungihl Kim ,  Wolfgang Mayr ,  Jane M. Shaw ,  George F. Walker

IPC分类号： G01R1/067 ,  G01R1/04 ,  G01R1/073 ,  G01R31/26 ,  H01R4/26 ,  H01R13/24

CPC分类号： G01R1/0483 ,  G01R1/07314 ,  H01R12/714 ,  H01R13/2485 ,  H01L2224/13021 ,  H01R2201/20

摘要： An electrical connector is described for making contact with a plurality of convex and deformable contacts on an electronic device. The electrical connector comprises a substrate having a plurality of conductors which extend above its surface. A polymeric material is disposed on the surface of the substrate and has openings which expose the conductors, each opening sized to receive one of the convex, deformable contacts, and to enable electrical connection between the exposed conductors and the deformable contacts. A mechanism is provided for urging the deformable contacts on the electronic device against the exposed conductors. The mechanism exerts sufficient force between the device and the conductors to cause some deformation of the convex contact areas by the conductors.

公开(公告)号：US07172431B2

公开(公告)日：2007-02-06

申请号：US10928473

申请日：2004-08-27

申请人： Brian S. Beaman ,  George Liang-Tai Chiu ,  Keith Fogel ,  Paul A. Lauro ,  Daniel P. Morris ,  Da-Juan Shih

发明人： Brian S. Beaman ,  George Liang-Tai Chiu ,  Keith Fogel ,  Paul A. Lauro ,  Daniel P. Morris ,  Da-Juan Shih

IPC分类号： H01R12/00

CPC分类号： H01R13/2464 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/07314 ,  G01R1/07357 ,  H01R12/714

摘要： A probe or an electrical connector comprises a substrate with a surface having a plurality of electrical contact locations. A shaped elongated electrical conductor has a first end coupled to one of the electrical contact locations and a second end thereof which projects away from the electrical contact location and through an aperture in a sheet of material. The sheet is disposed to be spaced apart from the surface of the substrate. At the second end of the elongated electrical conductor there is a tip structure, which is larger than the aperture in the sheet of material. The tip structure has a pointed portion thereof. The tip structure is disposed against contact locations of a contact surface. The electronic structure is moved towards the contact surface permitting the tip structure to penetrate into the surface of the electrical contact location thereon and to move, wipe, or vibrate across the surface thereof as the shaped elongated electrical conductor flexes as a result of being compressed by the movement of the electronic structure toward the contact surface.

摘要翻译： 探针或电连接器包括具有多个电接触位置的表面的基底。 成形细长的电导体具有联接到电接触位置之一的第一端和其第二端，其突出远离电接触位置并穿过材料片中的孔。 片材被设置成与衬底的表面间隔开。 在细长电导体的第二端，有一个尖端结构，其大于该材料片中的孔。 尖端结构具有其尖端部分。 尖端结构设置成抵靠接触表面的接触位置。 电子结构朝向接触表面移动，允许尖端结构穿过其中的电接触位置的表面并且随着成形细长电导体由于被...的压缩而弯曲而在其表面上移动，擦拭或振动 电子结构向接触表面移动。

公开(公告)号：US08479388B2

公开(公告)日：2013-07-09

申请号：US12207713

申请日：2008-09-10

申请人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

发明人： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC分类号： H01K3/10

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

摘要翻译： 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机

公开(公告)号：US08118602B2

公开(公告)日：2012-02-21

申请号：US13005465

申请日：2011-01-12

申请人： Brian S. Beaman

发明人： Brian S. Beaman

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/585

摘要： A method is disclosed for providing electrical connections for an area array device. Each of a plurality of holes in a circuit board has a conductor within it and has an opening on a side of the circuit board. Electrically conductive contact posts extend from the openings of the holes. The contact posts are in a pattern corresponding to contact pads on an area array device. A compliant portion of each contact post is inserted within a hole. The conductor compresses the compliant portion to removably secure the contact post within the hole. The conductors form an electrical connection with the contact post. A spring portion of each contact post extends away from the circuit board. The spring portion is compressible toward the circuit board, and provides an electrical connection between a contact post and a contact pad in response to contact with the contact pad.

摘要翻译： 公开了一种用于为区域阵列装置提供电连接的方法。 电路板中的多个孔中的每一个在其内具有导体，并且在电路板的一侧具有开口。 导电接触柱从孔的开口延伸。 接触柱是对应于区域阵列装置上的接触焊盘的图案。 每个接触柱的柔顺部分插入孔内。 导体压缩柔顺部分以可拆卸地将接触柱固定在孔内。 导体与接触柱形成电气连接。 每个接触柱的弹簧部分远离电路板延伸。 弹簧部分可朝向电路板压缩，并且响应于与接触垫的接触而在接触柱和接触垫之间提供电连接。

公开(公告)号：US20110151681A1

公开(公告)日：2011-06-23

申请号：US13005465

申请日：2011-01-12

申请人： Brian S. Beaman

发明人： Brian S. Beaman

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/585

摘要： A method is disclosed for providing electrical connections for an area array device. Each of a plurality of holes in a circuit board has a conductor within it and has an opening on a side of the circuit board. Electrically conductive contact posts extend from the openings of the holes. The contact posts are in a pattern corresponding to contact pads on an area array device. A compliant portion of each contact post is inserted within a hole. The conductor compresses the compliant portion to removably secure the contact post within the hole. The conductors form an electrical connection with the contact post. A spring portion of each contact post extends away from the circuit board. The spring portion is compressible toward the circuit board, and provides an electrical connection between a contact post and a contact pad in response to contact with the contact pad.

摘要翻译： 公开了一种用于为区域阵列装置提供电连接的方法。 电路板中的多个孔中的每一个在其内具有导体，并且在电路板的一侧具有开口。 导电接触柱从孔的开口延伸。 接触柱是对应于区域阵列装置上的接触焊盘的图案。 每个接触柱的柔顺部分插入孔内。 导体压缩柔顺部分以可拆卸地将接触柱固定在孔内。 导体与接触柱形成电气连接。 每个接触柱的弹簧部分远离电路板延伸。 弹簧部分可朝向电路板压缩，并且响应于与接触垫的接触而在接触柱和接触垫之间提供电连接。