摘要:
A light emitting device includes a vertical via through the P-type semiconductor layer and the active layer. Using a vertical via reduces quantum well damage, allows shortening of P-N spacing, and allows increased reflective area. A dielectric structure is formed in the via to provide a sloped wall that extends to an upper surface of the device. Another dielectric layer covers the upper surface and the sloped wall, and provides select contacts to the semiconductor layers. A metal layer is subsequently applied. Because the dielectric layers provide a continuous slope from the surface of the device, the metal layer does not include a vertical drop. Because the active layer does not extend into the via, the contact to the N-type semiconductor layer may be situated closer to the wall of the via, increasing the area available for a reflective layer.
摘要:
An integrated circuit assembly includes a lead frame having a plurality of leads with inner portions. A thermally-conductive clip member is bonded to the inner portions of the leads such that the clip member is electrically isolated from and yet thermally coupled to the lead frame. An integrated circuit die is bonded and thereby thermally coupled to the clip member. The die is electrically connected to the wire die by wire bonds. Encapsulant material is disposed over the inner portions of the leads and at least a portion of the clip member, and encapsulates the die and the wire bonds.
摘要:
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
摘要:
A microcomputer development system in which two jobs, such as a source program and an assembler program, can be run and monitored simultaneously. A CRT screen (10) is split so as to display information from both processor A (16) and processor B (18). A keyboard (12) is provided with a switch that toggles one of the processors so that the keyboard is assigned to that one processor to the exclusion of the other processor. In this case, the processor to which the keyboard is attached is designated the foreground processor, and its output is displayed highlighted on the CRT. The other processor is designated the background processor, and its information is displayed in reverse video to distinguish it from the foreground processor. At power-on reset time, processor A is designated the foreground processor and is assigned the keyboard. A printer (24) is always assigned to processor A. A disk controller (20) is shared by processor A and processor B, regardless of which processor is assigned to the keyboard. Information (flags) are passed back and forth between each processor and a CRT/keyboard controller (14) in order to provide information to control access to files on the floppy disk (22).
摘要:
In one implementation, an apparatus includes a semiconductor die, a lead, a non-conductive epoxy, and a conductive epoxy. The semiconductor die includes an upper surface and a lower surface opposite the upper surface. The lead is electrically coupled to the upper surface of the semiconductor die. The non-conductive epoxy is disposed on a first portion of the lower surface of the semiconductor die. The conductive epoxy is disposed on a second portion of the lower surface of the semiconductor die. In some implementations, a conductive wire extends from the lead to the upper surface of the semiconductor die to electrically couple the lead to the upper surface of the semiconductor die.
摘要:
The present invention relates to an electronic equipment mode switching apparatus and method based on a skin contact made by a user using the electronic equipment, thereby being capable of minimizing the power consumption of electronic equipment and also of instantly operating electronic equipment as soon as skin contact is made. The electronic equipment mode switching apparatus includes skin contact detection means for detecting electricity generated when a user's skin is touched, logic circuit means for generating a mode switching signal to switch a power supply mode of an electronic device when skin contact is detected by the skin contact detection means, and mode switching means for switching the power supply mode of the electronic device in response to the mode switching signal generated by the logic circuit means.
摘要:
Semiconductor packages with a reduced-height die pad and associated methods for making and using these semiconductor packages are described. The semiconductor packages include a lead frame with die pad of reduced height so the die pad has a height that is less than that of the lead frame. The semiconductor packages may comprise an isolated and/or a fused lead finger with a portion of an upper surface of the isolated lead finger that is removed to form a concavity to which one or more bond wires may be bonded. The upper surface of the isolated lead finger may be removed so the isolated lead finger has a height that is less than the height of the lead frame. And a perimeter of a bottom surface of the fused lead finger may be removed. Other embodiments are described.
摘要:
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
摘要:
A lead frame with patterned conductive runs on the top surface to accept a wire bonded or flip-chip or COL configuration is disclosed. The top pattern is completed and the bottom is etched away creating cavities. The cavities are filled with a pre-mold material that lend structural support of the lead frame. The top is then etch through the lead frame to the pre-mold, except with the top conductive runs exist. In this manner the conductive runs are completed and isolated from each other so that the placement of the runs is flexible. The chips are mounted and the encapsulated and the lead frames are singulated. The pattern on the top and the bottom may be defined by first plated the patterns desired.
摘要:
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.