Contact etching and metallization for improved LED device performance and reliability

    公开(公告)号:US10529894B2

    公开(公告)日:2020-01-07

    申请号:US15777255

    申请日:2016-11-14

    摘要: A light emitting device includes a vertical via through the P-type semiconductor layer and the active layer. Using a vertical via reduces quantum well damage, allows shortening of P-N spacing, and allows increased reflective area. A dielectric structure is formed in the via to provide a sloped wall that extends to an upper surface of the device. Another dielectric layer covers the upper surface and the sloped wall, and provides select contacts to the semiconductor layers. A metal layer is subsequently applied. Because the dielectric layers provide a continuous slope from the surface of the device, the metal layer does not include a vertical drop. Because the active layer does not extend into the via, the contact to the N-type semiconductor layer may be situated closer to the wall of the via, increasing the area available for a reflective layer.

    Personal development system
    4.
    发明授权
    Personal development system 失效
    个人发展系统

    公开(公告)号:US4621319A

    公开(公告)日:1986-11-04

    申请号:US424729

    申请日:1982-09-27

    IPC分类号: G06F3/153 G06F9/46 G06F15/16

    CPC分类号: G06F9/52 G06F15/161 G06F3/153

    摘要: A microcomputer development system in which two jobs, such as a source program and an assembler program, can be run and monitored simultaneously. A CRT screen (10) is split so as to display information from both processor A (16) and processor B (18). A keyboard (12) is provided with a switch that toggles one of the processors so that the keyboard is assigned to that one processor to the exclusion of the other processor. In this case, the processor to which the keyboard is attached is designated the foreground processor, and its output is displayed highlighted on the CRT. The other processor is designated the background processor, and its information is displayed in reverse video to distinguish it from the foreground processor. At power-on reset time, processor A is designated the foreground processor and is assigned the keyboard. A printer (24) is always assigned to processor A. A disk controller (20) is shared by processor A and processor B, regardless of which processor is assigned to the keyboard. Information (flags) are passed back and forth between each processor and a CRT/keyboard controller (14) in order to provide information to control access to files on the floppy disk (22).

    摘要翻译: 一种微处理器开发系统,其中可以同时运行和监视诸如源程序和汇编程序的两个作业。 CRT屏幕(10)被分割以显示来自处理器A(16)和处理器B(18)的信息。 键盘(12)设置有开关,其切换处理器中的一个,使得键盘被分配给该一个处理器以排除另一个处理器。 在这种情况下,附加键盘的处理器被指定为前景处理器,并且其输出在CRT上突出显示。 其他处理器被指定为后台处理器,其信息以反向视频显示,以将其与前台处理器区分开。 在上电复位时间,处理器A被指定为前台处理器,并分配键盘。 打印机(24)总是被分配给处理器A.磁盘控制器(20)由处理器A和处理器B共享,而不管哪个处理器被分配给键盘。 信息(标志)在每个处理器和CRT /键盘控制器(14)之间来回传递,以提供信息来控制对软盘(22)上的文件的访问。

    Conductive chip disposed on lead semiconductor package
    5.
    发明授权
    Conductive chip disposed on lead semiconductor package 失效
    导电芯片设置在引线半导体封装上

    公开(公告)号:US08525321B2

    公开(公告)日:2013-09-03

    申请号:US13177060

    申请日:2011-07-06

    IPC分类号: H01L23/24

    摘要: In one implementation, an apparatus includes a semiconductor die, a lead, a non-conductive epoxy, and a conductive epoxy. The semiconductor die includes an upper surface and a lower surface opposite the upper surface. The lead is electrically coupled to the upper surface of the semiconductor die. The non-conductive epoxy is disposed on a first portion of the lower surface of the semiconductor die. The conductive epoxy is disposed on a second portion of the lower surface of the semiconductor die. In some implementations, a conductive wire extends from the lead to the upper surface of the semiconductor die to electrically couple the lead to the upper surface of the semiconductor die.

    摘要翻译: 在一个实施方案中,装置包括半导体管芯,引线,非导电环氧树脂和导电环氧树脂。 半导体管芯包括与上表面相对的上表面和下表面。 引线电耦合到半导体管芯的上表面。 非导电性环氧树脂设置在半导体管芯的下表面的第一部分上。 导电环氧树脂设置在半导体管芯的下表面的第二部分上。 在一些实施方案中,导线从引线延伸到半导体管芯的上表面,以将引线电耦合到半导体管芯的上表面。

    ELECTRONIC EQUIPMENT MODE SWITCHING APPARATUS AND METHOD BASED ON SKIN CONTACT, MOBILE PHONE FOR SWITCHING CALL INCOMING ALARMING MODE ON THE BASIS OF SKIN CONTACT WHEN CALL IS RECEIVED, AND METHOD OF AUTOMATICALLY SWITCHING CALL INCOMING ALARMING MODE OF THE MOBILE PHONE
    6.
    发明申请
    ELECTRONIC EQUIPMENT MODE SWITCHING APPARATUS AND METHOD BASED ON SKIN CONTACT, MOBILE PHONE FOR SWITCHING CALL INCOMING ALARMING MODE ON THE BASIS OF SKIN CONTACT WHEN CALL IS RECEIVED, AND METHOD OF AUTOMATICALLY SWITCHING CALL INCOMING ALARMING MODE OF THE MOBILE PHONE 审中-公开
    电子设备模式切换设备和基于皮肤接触的手机,移动电话用于在接收到呼叫时根据皮肤接触进行呼叫呼叫报警模式,以及自动切换呼叫方式传送移动电话的报警模式

    公开(公告)号:US20110159864A1

    公开(公告)日:2011-06-30

    申请号:US12898173

    申请日:2010-10-05

    IPC分类号: H04M3/00 H03K17/60

    摘要: The present invention relates to an electronic equipment mode switching apparatus and method based on a skin contact made by a user using the electronic equipment, thereby being capable of minimizing the power consumption of electronic equipment and also of instantly operating electronic equipment as soon as skin contact is made. The electronic equipment mode switching apparatus includes skin contact detection means for detecting electricity generated when a user's skin is touched, logic circuit means for generating a mode switching signal to switch a power supply mode of an electronic device when skin contact is detected by the skin contact detection means, and mode switching means for switching the power supply mode of the electronic device in response to the mode switching signal generated by the logic circuit means.

    摘要翻译: 本发明涉及一种基于使用电子设备的用户进行的皮肤接触的电子设备模式切换装置和方法,从而能够使电子设备的功耗最小化,并且一旦皮肤接触就能立即操作电子设备 是做的 电子设备模式切换装置包括皮肤接触检测装置,用于检测当用户的皮肤被触摸时产生的电力;逻辑电路装置,用于当由皮肤接触检测到皮肤接触时产生切换电子装置的电源模式的模式切换信号 检测装置和模式切换装置,用于响应于由逻辑电路装置产生的模式切换信号切换电子装置的电源模式。

    METHOD OF MAKING AND DESIGNING LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
    9.
    发明申请
    METHOD OF MAKING AND DESIGNING LEAD FRAMES FOR SEMICONDUCTOR PACKAGES 有权
    制造和设计半导体封装的引线框架的方法

    公开(公告)号:US20090236711A1

    公开(公告)日:2009-09-24

    申请号:US12052871

    申请日:2008-03-21

    IPC分类号: H01L23/495 H01L21/00

    摘要: A lead frame with patterned conductive runs on the top surface to accept a wire bonded or flip-chip or COL configuration is disclosed. The top pattern is completed and the bottom is etched away creating cavities. The cavities are filled with a pre-mold material that lend structural support of the lead frame. The top is then etch through the lead frame to the pre-mold, except with the top conductive runs exist. In this manner the conductive runs are completed and isolated from each other so that the placement of the runs is flexible. The chips are mounted and the encapsulated and the lead frames are singulated. The pattern on the top and the bottom may be defined by first plated the patterns desired.

    摘要翻译: 公开了一种在顶表面上具有带图案导电的导线框架,以接受导线接合或倒装芯片或COL构造。 顶部图案完成,底部被蚀刻掉,形成空腔。 这些空腔填充有借助引线框架的结构支撑的预模具材料。 然后将顶部通过引线框架蚀刻到预模具,除了存在顶部导电性运行。 以这种方式,导电运行完成并彼此隔离,使得运行的放置是柔性的。 芯片被安装,封装和引线框架被分割。 顶部和底部的图案可以通过首先电镀所需的图案来定义。