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公开(公告)号：US08680668B2
公开(公告)日：2014-03-25
申请号：US13407157
申请日：2012-02-28
申请人： Georg Meyer-Berg , Andreas Schloegl
发明人： Georg Meyer-Berg , Andreas Schloegl
IPC分类号： H01L23/495
CPC分类号： H01L24/27 , H01L21/568 , H01L23/3107 , H01L23/492 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/41 , H01L24/83 , H01L24/84 , H01L24/97 , H01L25/072 , H01L2224/29111 , H01L2224/32014 , H01L2224/37011 , H01L2224/40225 , H01L2224/73219 , H01L2224/73265 , H01L2224/83801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/01028 , H01L2924/01083 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first face and a second electrode on a second face opposite to the first face. A first metal foil is attached to the first electrode of the semiconductor chip in an electrically conductive manner. A second metal foil is attached to the second electrode of the semiconductor chip in an electrically conductive manner.
摘要翻译： 一种包括半导体芯片和金属箔的器件。 一个实施例提供了一种包括半导体芯片的器件，该半导体芯片在第一面上具有第一电极，而在第二面上与第一面相反。 第一金属箔以导电方式连接到半导体芯片的第一电极。 第二金属箔以导电的方式连接到半导体芯片的第二电极。
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公开(公告)号：US20100133666A1
公开(公告)日：2010-06-03
申请号：US12326529
申请日：2008-12-02
申请人： Georg Meyer-Berg , Andreas Schloegl
发明人： Georg Meyer-Berg , Andreas Schloegl
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L24/27 , H01L21/568 , H01L23/3107 , H01L23/492 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/41 , H01L24/83 , H01L24/84 , H01L24/97 , H01L25/072 , H01L2224/29111 , H01L2224/32014 , H01L2224/37011 , H01L2224/40225 , H01L2224/73219 , H01L2224/73265 , H01L2224/83801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/01028 , H01L2924/01083 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first face and a second electrode on a second face opposite to the first face. A first metal foil is attached to the first electrode of the semiconductor chip in an electrically conductive manner. A second metal foil is attached to the second electrode of the semiconductor chip in an electrically conductive manner.
摘要翻译： 一种包括半导体芯片和金属箔的器件。 一个实施例提供了一种包括半导体芯片的器件，该半导体芯片在第一面上具有第一电极，而在第二面上与第一面相反。 第一金属箔以导电方式连接到半导体芯片的第一电极。 第二金属箔以导电的方式连接到半导体芯片的第二电极。
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公开(公告)号：US20130069211A1
公开(公告)日：2013-03-21
申请号：US13407157
申请日：2012-02-28
申请人： Georg Meyer-Berg , Andreas Schloegl
发明人： Georg Meyer-Berg , Andreas Schloegl
IPC分类号： H01L23/495
CPC分类号： H01L24/27 , H01L21/568 , H01L23/3107 , H01L23/492 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/41 , H01L24/83 , H01L24/84 , H01L24/97 , H01L25/072 , H01L2224/29111 , H01L2224/32014 , H01L2224/37011 , H01L2224/40225 , H01L2224/73219 , H01L2224/73265 , H01L2224/83801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/01028 , H01L2924/01083 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first face and a second electrode on a second face opposite to the first face. A first metal foil is attached to the first electrode of the semiconductor chip in an electrically conductive manner. A second metal foil is attached to the second electrode of the semiconductor chip in an electrically conductive manner.
摘要翻译： 一种包括半导体芯片和金属箔的器件。 一个实施例提供了一种包括半导体芯片的器件，该半导体芯片在第一面上具有第一电极，而在第二面上与第一面相反。 第一金属箔以导电方式连接到半导体芯片的第一电极。 第二金属箔以导电的方式连接到半导体芯片的第二电极。
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公开(公告)号：US08124449B2
公开(公告)日：2012-02-28
申请号：US12326529
申请日：2008-12-02
申请人： Georg Meyer-Berg , Andreas Schloegl
发明人： Georg Meyer-Berg , Andreas Schloegl
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L24/27 , H01L21/568 , H01L23/3107 , H01L23/492 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/38 , H01L24/40 , H01L24/41 , H01L24/83 , H01L24/84 , H01L24/97 , H01L25/072 , H01L2224/29111 , H01L2224/32014 , H01L2224/37011 , H01L2224/40225 , H01L2224/73219 , H01L2224/73265 , H01L2224/83801 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/01028 , H01L2924/01083 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first face and a second electrode on a second face opposite to the first face. A first metal foil is attached to the first electrode of the semiconductor chip in an electrically conductive manner. A second metal foil is attached to the second electrode of the semiconductor chip in an electrically conductive manner.
摘要翻译： 一种包括半导体芯片和金属箔的器件。 一个实施例提供了一种包括半导体芯片的器件，该半导体芯片在第一面上具有第一电极，而在第二面上与第一面相反。 第一金属箔以导电方式连接到半导体芯片的第一电极。 第二金属箔以导电的方式连接到半导体芯片的第二电极。
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公开(公告)号：US08618644B2
公开(公告)日：2013-12-31
申请号：US13594949
申请日：2012-08-27
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Veldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Veldvoss
IPC分类号： H01L23/02
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译： 电子设备及其制造。 一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片，在第二表面上提供第二负载电极。 第一引线电耦合到控制电极。 第二引线电耦合到第一负载电极。 第三引线电耦合到第一负载电极，第三引线与第二引线分离。 第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。
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6.发明授权Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof 有权该装置包括耦合到半导体芯片的半导体芯片和引线及其制造公开(公告)号：US08253225B2
公开(公告)日：2012-08-28
申请号：US12035598
申请日：2008-02-22
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
IPC分类号： H01L23/02
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译： 电子设备及其制造。 一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。 第一引线电耦合到控制电极。 第二引线电耦合到第一负载电极。 第三引线电耦合到第一负载电极，第三引线与第二引线分离。 第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。
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公开(公告)号：US20100276797A1
公开(公告)日：2010-11-04
申请号：US12433429
申请日：2009-04-30
申请人： Stefan Landau , Ralf Otremba , Uwe Kirchner , Andreas Schloegl , Christian Fachmann , Joachim Mahler
发明人： Stefan Landau , Ralf Otremba , Uwe Kirchner , Andreas Schloegl , Christian Fachmann , Joachim Mahler
IPC分类号： H01L23/495 , H01L21/60 , H01L23/367
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/32 , H01L24/40 , H01L2224/32245 , H01L2224/40095 , H01L2224/40247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0105 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19043 , H01L2924/30107 , H05K3/32 , H05K3/3442 , H05K3/3447 , H05K3/3468 , H05K3/3473 , H05K2201/09472 , H05K2201/10303 , H05K2201/1059 , H05K2201/10727 , H05K2201/10962 , H05K2201/10984 , H05K2203/0455 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a substrate having a chip island, a chip attached to the chip island, and encapsulation material deposited on the chip and part of the chip island. The chip island includes a first main face to which the chip is attached opposite a second main face, with the second main face of the chip island defining at least one cavity.
摘要翻译： 半导体器件包括具有芯片岛的衬底，附接到芯片岛的芯片以及沉积在芯片岛和芯片岛的一部分上的封装材料。 芯片岛包括第一主面，芯片与第二主面相对，芯片岛的第二主面限定至少一个空腔。
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公开(公告)号：US20120319109A1
公开(公告)日：2012-12-20
申请号：US13594949
申请日：2012-08-27
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
IPC分类号： H01L23/544
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译： 电子设备及其制造。 一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。 第一引线电耦合到控制电极。 第二引线电耦合到第一负载电极。 第三引线电耦合到第一负载电极，第三引线与第二引线分离。 第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。
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公开(公告)号：US08097944B2
公开(公告)日：2012-01-17
申请号：US12433429
申请日：2009-04-30
申请人： Stefan Landau , Ralf Otremba , Uwe Kirchner , Andreas Schloegl , Christian Fachmann , Joachim Mahler
发明人： Stefan Landau , Ralf Otremba , Uwe Kirchner , Andreas Schloegl , Christian Fachmann , Joachim Mahler
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/32 , H01L24/40 , H01L2224/32245 , H01L2224/40095 , H01L2224/40247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0105 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19043 , H01L2924/30107 , H05K3/32 , H05K3/3442 , H05K3/3447 , H05K3/3468 , H05K3/3473 , H05K2201/09472 , H05K2201/10303 , H05K2201/1059 , H05K2201/10727 , H05K2201/10962 , H05K2201/10984 , H05K2203/0455 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a substrate having a chip island, a chip attached to the chip island, and encapsulation material deposited on the chip and part of the chip island. The chip island includes a first main face to which the chip is attached opposite a second main face, with the second main face of the chip island defining at least one cavity.
摘要翻译： 半导体器件包括具有芯片岛的衬底，附接到芯片岛的芯片以及沉积在芯片岛和芯片岛的一部分上的封装材料。 芯片岛包括第一主面，芯片与第二主面相对，芯片岛的第二主面限定至少一个空腔。
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公开(公告)号：US20090212284A1
公开(公告)日：2009-08-27
申请号：US12035598
申请日：2008-02-22
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译： 电子设备及其制造。 一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。 第一引线电耦合到控制电极。 第二引线电耦合到第一负载电极。 第三引线电耦合到第一负载电极，第三引线与第二引线分离。 第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。
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