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公开(公告)号:US20050150813A1
公开(公告)日:2005-07-14
申请号:US10969527
申请日:2004-10-20
申请人: Jesse Thompson , Jennifer Alfonso , Glenn Urbish , Philip Osborn , Ellis Chau
发明人: Jesse Thompson , Jennifer Alfonso , Glenn Urbish , Philip Osborn , Ellis Chau
IPC分类号: B65D85/30 , H01L23/498 , H01L25/10
CPC分类号: H01L23/4985 , H01L25/105 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/0002 , H01L2924/00
摘要: A microelectronic fold package is formed from an in-process unit including an internal unit such as a chip and a tape defining a bottom run extending beneath the internal unit, a top run extending above the internal unit and a fold connecting said top and bottom runs. The in-process unit is engaged between a pair of elements having flat surfaces so that these elements form the top and bottom runs to a substantially flat condition at least in regions between the internal unit and the fold and so that the engagement elements form the fold to a height equal to the height of the internal unit.
摘要翻译: 微电子折叠包装由包括诸如芯片的内部单元和限定在内部单元下方延伸的底部行程的带的内部单元形成,在内部单元上方延伸的顶部行程以及连接所述顶部和底部行程的折叠 。 在处理单元被接合在具有平坦表面的一对元件之间,使得这些元件至少在内部单元和折叠之间的区域中形成顶部和底部行程至基本上平坦的状态,并且使得接合元件形成折叠 高度等于内部单元的高度。
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公开(公告)号:US20050189622A1
公开(公告)日:2005-09-01
申请号:US11068830
申请日:2005-03-01
申请人: Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人: Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号: B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号: B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.
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公开(公告)号:US20050189635A1
公开(公告)日:2005-09-01
申请号:US11068831
申请日:2005-03-01
申请人: Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人: Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号: B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号: B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.
摘要翻译: 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面,与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件,该器件可操作为声能和电磁的至少一个的换能器 能量,并且所述芯片包括在前表面和后表面中的一个处暴露的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件,封装元件具有面向芯片的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点,触点导电地连接到接合焊盘。 金属层还包括第一开口,用于使声能和电磁能中的至少一个沿至少一个方向传递到所述装置和所述装置。
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公开(公告)号:US20070152310A1
公开(公告)日:2007-07-05
申请号:US11321856
申请日:2005-12-29
申请人: Philip Osborn , Teck-Gyu Kang , Ilyas Mohammed
发明人: Philip Osborn , Teck-Gyu Kang , Ilyas Mohammed
IPC分类号: H01L23/02
CPC分类号: H01L24/73 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/85 , H01L24/91 , H01L25/0657 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/49 , H01L2224/73215 , H01L2224/73259 , H01L2224/73277 , H01L2224/85 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/014 , H01L2924/15311 , H01L2924/15331 , H01L2924/3025 , H01L2224/78 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: A microelectronic package including a dielectric element with at least one conductive ground pad. The package may also include a microelectronic element with at least one ground contact exposed at a rear surface of the element. The ground pad and the ground contact are electrically connected to each other by an electrically conducting material.
摘要翻译: 一种微电子封装,其包括具有至少一个导电接地焊盘的电介质元件。 封装还可以包括具有在元件的后表面处暴露的至少一个接地触头的微电子元件。 接地焊盘和接地触头通过导电材料彼此电连接。
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公开(公告)号:US07061122B2
公开(公告)日:2006-06-13
申请号:US10683097
申请日:2003-10-10
申请人: Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
发明人: Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
IPC分类号: H01L29/40
CPC分类号: H05K1/141 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/3511 , H05K3/3436 , H05K2201/10719 , H05K2203/1572 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647
摘要: An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
摘要翻译: 具有独立测试和修复功能的超薄系统级封装(SIP)包括:插入器,其布置在其顶表面和底表面上,多个封装的半导体芯片通过焊料凸块安装,根据Land Grid Array (LGA)格式,并且其中在SIP上不使用底部填充物。
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公开(公告)号:US20070166876A1
公开(公告)日:2007-07-19
申请号:US11324453
申请日:2006-01-03
申请人: Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
发明人: Young-Gon Kim , David Gibson , Michael Warner , Philip Damberg , Philip Osborn
IPC分类号: H01L21/00
CPC分类号: H05K1/141 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/3511 , H05K3/3436 , H05K2201/10719 , H05K2203/1572 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647
摘要: An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
摘要翻译: 具有独立测试和修复功能的超薄系统级封装(SIP)包括:插入器,其布置在其顶表面和底表面上,多个封装的半导体芯片通过焊料凸块安装,根据Land Grid Array (LGA)格式,并且其中在SIP上不使用底部填充物。
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公开(公告)号:US20050243529A1
公开(公告)日:2005-11-03
申请号:US11111145
申请日:2005-04-21
申请人: Masud Beroz , Jae Park , Belgacem Haba , Fion Tan , Philip Osborn
发明人: Masud Beroz , Jae Park , Belgacem Haba , Fion Tan , Philip Osborn
IPC分类号: H01L21/60 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01R9/00 , H01R12/04 , H05K1/11
CPC分类号: H01L23/13 , H01L23/3114 , H01L23/4951 , H01L23/4952 , H01L23/49811 , H01L23/49816 , H01L24/48 , H01L24/85 , H01L2224/05647 , H01L2224/48091 , H01L2224/48095 , H01L2224/4824 , H01L2224/48463 , H01L2224/48471 , H01L2224/85447 , H01L2924/00014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19107 , H01L2224/45099 , H01L2924/00
摘要: A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.
摘要翻译: 用于半导体芯片的连接部件包括具有间隙的基板,多个平行间隔开的引线延伸。 引线的端部通过结合到触点或嵌入基板中而粘附到基板上。 在一个实施例中,连接部件可以通过将导线穿过间隙缝合而形成。 在另一个实施例中,支撑间隔开的平行引线的预制引线组件并置并转移到衬底。 连接部件并置在半导体芯片上,由此在间隙上延伸的引线可以具有一端分离并结合到下面的芯片触点。
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公开(公告)号:US06214640B1
公开(公告)日:2001-04-10
申请号:US09366152
申请日:1999-08-03
申请人: Jennifer Fosberry , Masud Beroz , Mihalis Michael , Philip Osborn
发明人: Jennifer Fosberry , Masud Beroz , Mihalis Michael , Philip Osborn
IPC分类号: H01L2144
CPC分类号: H01L23/3121 , H01L21/56 , H01L21/561 , H01L23/16 , H01L23/24 , H01L23/49816 , H01L23/49827 , H01L24/40 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/16 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2224/86 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要: A method of manufacturing a plurality of semiconductor chips packages and the resulting chip package assemblies. The method includes providing a circuitized substrate having terminals and leads. A spacer layer is deposited or attached to the substrate and each chip is then attached to the spacer layer. Typically, the spacer layer is comprised of a compliant or resilient material. The terminals and leads are interconnected using leads, at least some of which are fan-out leads. A ring-like pattern of a curable composition is disposed around each chip and cured to form a support structure. The assembly is encapsulated by dispensing a composition which is curable to an encapsulant into the gaps between the support structures and the chips. The encapsulant material is then cured thereby defining a composite of chip assemblies which may be singulated into individual chip packages.
摘要翻译: 一种制造多个半导体芯片封装的方法和所得到的芯片封装组件。 该方法包括提供具有端子和引线的电路化基板。 将间隔层沉积或附着到基底上,然后将每个芯片附接到间隔层。 通常,间隔层由顺应性或弹性材料构成。 端子和引线使用引线互连,其中至少一些是扇出引线。 可固化组合物的环状图案设置在每个芯片周围并固化以形成支撑结构。 通过将可固化到密封剂的组合物分配到支撑结构和芯片之间的间隙中来封装组件。 密封剂材料然后被固化,从而限定了可以被分成单个芯片封装的芯片组件的复合材料。
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