公开(公告)号：US20170312841A1

公开(公告)日：2017-11-02

申请号：US15654130

申请日：2017-07-19

Applicant: GlobalFoundries Inc.

Inventor： Stephen P. Ayotte ,  Glen E. Richard ,  Timothy D. Sullivan ,  Timothy M. Sullivan

IPC: B23K1/002 ,  B23K1/00 ,  H05K3/34

CPC classification number: B23K1/002 ,  B23K1/0016 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/101 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

公开(公告)号：US09776270B2

公开(公告)日：2017-10-03

申请号：US14043047

申请日：2013-10-01

Applicant: GLOBALFOUNDRIES INC.

Inventor： Stephen P. Ayotte ,  Glen E. Richard ,  Timothy D. Sullivan ,  Timothy M. Sullivan

IPC: H05K3/34 ,  B23K1/002 ,  B23K1/00

CPC classification number: B23K1/002 ,  B23K1/0016 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/101 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

公开(公告)号：US09508680B1

公开(公告)日：2016-11-29

申请号：US14741757

申请日：2015-06-17

Applicant: GLOBALFOUNDRIES INC.

Inventor： Stephen P. Ayotte ,  Glen E. Richard ,  Timothy M. Sullivan

IPC: H01L23/00 ,  C09K5/06 ,  H01L21/56

CPC classification number: H01L24/98 ,  C09K5/06 ,  H01L21/56 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81466 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01074 ,  H01L2924/069 ,  H01L2924/05381 ,  H01L2924/0549 ,  H01L2924/054 ,  H01L2924/01028 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/0537 ,  H01L2924/01025 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05442

Abstract: Underfill materials and methods for removing an underfill material from beneath a chip in relation to removal of the chip from a substrate. The underfill material may a plurality of particles dispersed in a bulk matrix. The material constituting the particles may be capable of generating heat energy when exposed to a time-varying magnetic field. The bulk matrix of the underfill material between the chip and a substrate may be heated with heat energy transferred from the particles. While heated, the underfill material is removed. The heating of the underfill material may also be used to heat solder bumps connecting the chip with the substrate so that the solder bumps are liquefied.

Abstract translation: 用于从芯片下面去除底部填充材料的底部填充材料和方法相对于从衬底移除芯片。 底部填充材料可以分散在块状基质中的多个颗粒。 构成颗粒的材料可以在暴露于时变磁场时能够产生热能。 芯片和衬底之间的底部填充材料的主体矩阵可以用从颗粒转移的热能来加热。 加热时，去除底部填充材料。 底部填充材料的加热也可以用于加热将芯片与衬底连接的焊料凸块，使得焊料凸块液化。

公开(公告)号：US10245667B2

公开(公告)日：2019-04-02

申请号：US15654130

申请日：2017-07-19

Applicant: GlobalFoundries Inc.

Inventor： Stephen P. Ayotte ,  Glen E. Richard ,  Timothy D. Sullivan ,  Timothy M. Sullivan

IPC: H05K13/04 ,  B23K1/002 ,  B23K1/00 ,  H05K3/34

Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

公开(公告)号：US20180130733A1

公开(公告)日：2018-05-10

申请号：US15345608

申请日：2016-11-08

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Glen E. Richard ,  Stephen P. Ayotte ,  Hanyi Ding

IPC: H01L23/498 ,  H01L23/34 ,  H01L23/00 ,  H01L21/82

CPC classification number: H01L24/11 ,  H01L23/345 ,  H01L24/05 ,  H01L2224/0401

Abstract: Embodiments of the present disclosure relate to separating an integrated circuit (IC) structure from an adjacent chip. An IC structure according to embodiments of the disclosure may include: a semiconductor region including an interconnect pad positioned thereon, the interconnect pad electrically connected to a solder bump; and an ohmic heating wire positioned within the semiconductor region and in thermal communication with the interconnect pad, wherein the ohmic heating wire is configured to be heated above a melting temperature of the solder bump.

公开(公告)号：US09548275B2

公开(公告)日：2017-01-17

申请号：US13901108

申请日：2013-05-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： Stephen P. Ayotte ,  Benjamin J. Pierce ,  Timothy M. Sullivan ,  Heather M. Truax

IPC: H01L23/00 ,  H01L27/20 ,  G01P15/08 ,  G01P15/09

CPC classification number: H01L23/562 ,  G01P15/0891 ,  G01P15/09 ,  H01L27/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An approach for detecting sudden changes in acceleration in a semiconductor device or semiconductor package containing the semiconductor device is disclosed. In one embodiment, a piezoelectric sensor is embedded in a semiconductor die. The piezoelectric sensor is configured to sense a mechanical force applied to the semiconductor die. An excessive force indicator is coupled to the piezoelectric sensor. The excessive force indicator is configured to generate an excessive force indication in response to the piezoelectric sensor sensing that the mechanical force applied to the semiconductor die has exceeded a predetermined threshold indicative of an excessive mechanical force.

Abstract translation: 公开了一种用于检测包含半导体器件的半导体器件或半导体封装中的加速度突然变化的方法。 在一个实施例中，将压电传感器嵌入到半导体管芯中。 压电传感器被配置为感测施加到半导体管芯的机械力。 过大的力指示器耦合到压电传感器。 过度的力指示器构造成响应于压电传感器产生过大的力指示，感测到施加到半导体管芯的机械力超过了表示过大机械力的预定阈值。

公开(公告)号：US20160372444A1

公开(公告)日：2016-12-22

申请号：US14741757

申请日：2015-06-17

Applicant: GLOBALFOUNDRIES INC.

Inventor： Stephen P. Ayotte ,  Glen E. Richard ,  Timothy M. Sullivan

IPC: H01L23/00 ,  C09K5/06

CPC classification number: H01L24/98 ,  C09K5/06 ,  H01L21/56 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81466 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01074 ,  H01L2924/069 ,  H01L2924/05381 ,  H01L2924/0549 ,  H01L2924/054 ,  H01L2924/01028 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/0537 ,  H01L2924/01025 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05442

Abstract: Underfill materials and methods for removing an underfill material from beneath a chip in relation to removal of the chip from a substrate. The underfill material may a plurality of particles dispersed in a bulk matrix. The material constituting the particles may be capable of generating heat energy when exposed to a time-varying magnetic field. The bulk matrix of the underfill material between the chip and a substrate may be heated with heat energy transferred from the particles. While heated, the underfill material is removed. The heating of the underfill material may also be used to heat solder bumps connecting the chip with the substrate so that the solder bumps are liquefied.

Abstract translation: 用于从芯片下面去除底部填充材料的底部填充材料和方法相对于从衬底移除芯片。 底部填充材料可以分散在块状基质中的多个颗粒。 构成颗粒的材料可以在暴露于时变磁场时能够产生热能。 芯片和衬底之间的底部填充材料的主体矩阵可以用从颗粒转移的热能来加热。 加热时，去除底部填充材料。 底部填充材料的加热也可以用于加热将芯片与衬底连接的焊料凸块，使得焊料凸块液化。

公开(公告)号：US09472490B1

公开(公告)日：2016-10-18

申请号：US14824409

申请日：2015-08-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Timothy M. Sullivan ,  Glen E. Richard ,  Stephen P. Ayotte ,  Timothy D. Sullivan

IPC: H01L23/00 ,  H01L23/48 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05017 ,  H01L2224/05026 ,  H01L2224/05547 ,  H01L2224/05558 ,  H01L2224/0557 ,  H01L2224/05576 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/14104 ,  H01L2224/16225 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/014

Abstract: Embodiments of the present disclosure provide an integrated circuit (IC) structure with a recessed solder bump area, and methods of forming the same. An IC structure according to embodiments of the present disclosure can include: a semiconductor material, wherein an upper surface of the semiconductor material includes a non-recessed area and a recessed area laterally separated from each other, the recessed area of the upper surface being shaped to receive a solder bump therein; at least one first through-semiconductor via (TSV) positioned within the semiconductor material and including an upper surface protruding from the recessed area of the semiconductor material; and a metal layer formed over the recessed area and electrically connected to the at least one first TSV.

Abstract translation: 本公开的实施例提供具有凹陷焊料凸块区域的集成电路（IC）结构及其形成方法。 根据本公开实施例的IC结构可以包括：半导体材料，其中半导体材料的上表面包括彼此横向分离的非凹陷区域和凹陷区域，上表面的凹陷区域成形 在其中接收焊料凸块; 至少一个位于所述半导体材料内的第一贯穿半导体通孔（TSV），并且包括从所述半导体材料的凹陷区域突出的上表面; 以及形成在所述凹陷区域上并电连接到所述至少一个第一TSV的金属层。

公开(公告)号：US10429414B2

公开(公告)日：2019-10-01

申请号：US15013106

申请日：2016-02-02

Applicant: GLOBALFOUNDRIES INC.

Inventor： Marvin G. L. Montaque ,  Stephen P. Ayotte ,  David L. Gardell

IPC: G01R1/073 ,  G01R3/00

Abstract: A system and method for disassembling a multiple contact probe head including a plurality of contact probes positioned by a first die at a first end of the plurality of probes and a second die at a second end of the plurality of probes, are provided. The system may include a manifold configured to sealingly receive an opposing side of the first die from the second die; and a vacuum source operatively coupled to the manifold to apply a vacuum to an interior of the manifold applying a force to the plurality of contact probes in position in the first die across. Where the probes include a paramagnetic material, a magnetic source may be employed to hold the probes during disassembly.

公开(公告)号：US20170219631A1

公开(公告)日：2017-08-03

申请号：US15013106

申请日：2016-02-02

Applicant: GLOBALFOUNDRIES INC.

Inventor： Marvin G. L. Montaque ,  Stephen P. Ayotte ,  David L. Gardell

IPC: G01R3/00 ,  G01R1/073

CPC classification number: G01R3/00 ,  G01R1/073 ,  G01R1/07357

Abstract: A system and method for disassembling a multiple contact probe head including a plurality of contact probes positioned by a first die at a first end of the plurality of probes and a second die at a second end of the plurality of probes, are provided. The system may include a manifold configured to sealingly receive an opposing side of the first die from the second die; and a vacuum source operatively coupled to the manifold to apply a vacuum to an interior of the manifold applying a force to the plurality of contact probes in position in the first die across. Where the probes include a paramagnetic material, a magnetic source may be employed to hold the probes during disassembly.