摘要:
Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar ratios of the initial materials. The resulting resins can be used in the field of electronics, both as molding compounds and as circuit board materials and adhesives.
摘要:
An apparatus for manufacturing an otoplastic. An otoplastic is manufactured directly in the ear of a hearing-impaired person in that a deformable envelope is pulled over a die or over a shell or over an overlayed over-shell. This apparatus is then supplied with flowing otoplastic material between the die and the envelope, being supplied therewith in the ear. The envelope expands and assumes the shape of the auditory canal. After hardening or curing of the otoplastic material in the ear of the hearing-impaired person, the envelope and the die are removed and a module of either an in-the-ear or of a behind-the-ear hearing aid is integrated therewith.
摘要:
A method and apparatus for manufacturing an otoplastic. An otoplastic is manufactured directly in the ear of a hearing-impaired person in that a deformable envelope is pulled over a die or over a shell or over an overlayed over-shell. This apparatus is then supplied with flowing otoplastic material between the die and the envelope, being supplied therewith in the ear. The envelope expands and assumes the shape of the auditory canal. After hardening or curing of the otoplastic material in the ear of the hearing-impaired person, the envelope and the die are removed and a module of either an in-the-ear or of a behind-the-ear hearing aid is integrated therewith.
摘要:
A rapid and precise cementing of components to a surface is achieved using a specially modified cement on an epoxy base in that the parts to be cemented are precisely aligned at the cemented location, are fixed with UV light and are subsequently thermally hardened.
摘要:
A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.
摘要:
A one-component reactive resin system which is stable in storage but nevertheless can readily be cured completely comprises a mixture of commercially available epoxy resins and phosphorus-containing glycidyl esters, in particular phosphonic acid diglycidyl esters, as well as cationic photoinitiators. The low-viscosity reactive resin systems cannot be cured purely by means of heat and can be processed at high temperatures and in particular can have a high filler content. The reactive resin systems, which are stable to storage even after UV activation, can be cured to flame-resistant molded materials under moderate conditions.
摘要:
Epoxysilanes having epoxide groups bonded via SiC are obtained by reaction of epoxyalkoxysilanes with silanols. The transparent siloxane mixtures containing epoxide can be employed directly as resin components for mixing with epoxy resins for casting resin applications.
摘要:
The invention relates to the use of momodisperse, non-porous, spherical particles based on SiO.sub.2, TiO.sub.2, ZrO.sub.2, Al.sub.2 O.sub.3, V.sub.2 O.sub.5, Nb.sub.2 O.sub.5 or mixed systems thereof, which are optionally modified on the surface by covalently bonded organic groups, as fillers in organic matrix materials, the refractive index of the particles being adapted to the refractive index of the organic matrix according to the use.Polymeric or polymerizable systems which comprise these particles can be used, for example, as embedding compositions for optical, electro-optical and optoelectronic components. Such embedding compositions show an improved optical homogeneity. Light-emitting diodes produced with them are distinguished, inter alia, by an improved light yield.
摘要:
The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and/or intensity of UV activation and which is therefore particularly suitable for automatable manufacturing processes, since the workpieces after initial fixing require no additional mounts even during thermal aftercuring. This adhesive is preferentially suitable for the extensive adhesive bonding of permanent magnets, such as in the assembly of a permasyn motor, for example.
摘要:
A halogen free casting resin suitable for covering electron devices with a fire retardant material contains an acidic ester of an hydroxy-functional phosphor compound and an organic anhydride. A stable mixture can be generated from the acidic ester and the hardener component of the casting resin, and further used for the hardening of epoxides resins. The acidic ester is chemically integrated in the epoxide resin matrix in a stable mixture, thereby improving the long term fire-retardancy of the casting resin molding compound without increasing the volatility of the mixture.