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公开(公告)号:US20240028531A1
公开(公告)日:2024-01-25
申请号:US18375472
申请日:2023-09-30
Applicant: Intel Corporation
Inventor: John R. DREW , James A. McCALL , Tongyan ZHAI , Jun LIAO , Min Suet LIM , Shigeki TOMISHIMA
CPC classification number: G06F13/1694 , G06F13/1689 , G06F13/4022
Abstract: A memory subsystem triggers dynamic switching for memory devices to provide access to active memory devices and prevent access to inactive memory devices. Dynamic switching enables a single bus to switch between multiple memory devices whose capacity otherwise exceeds the capacity of the single bus. A switch can be mounted in a memory module or directly on a motherboard alongside the memory devices. A memory controller can toggle a chip select signal as a single control signal to drive the switch. Each switch includes pairs of field effect transistors (FETs), including any of CMOS, NMOS and PMOS FETs. The switch electrically isolates inactive memory devices to prevent access without the need to electrically short the devices.
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公开(公告)号:US20170345477A1
公开(公告)日:2017-11-30
申请号:US15648413
申请日:2017-07-12
Applicant: INTEL CORPORATION
Inventor: Shigeki TOMISHIMA
IPC: G11C11/16
CPC classification number: G11C11/1673 , G11C11/1657 , G11C11/1659 , G11C11/1675
Abstract: In one embodiment, a bit state in a supply-switched dual cell memory bitcell in accordance with the present description, may be read by coupling a supply line to a common node of the bitcell to drive complementary currents through complementary resistance state storage cells for a pair of complementary bit line signal lines of the bitcell. The bit state of the bitcell may be read by sensing complementary bit state signals on the pair of first and second complementary bit line signal lines. In one embodiment, each resistance state storage cell has a resistance state ferromagnetic device such as a magnetic-tunneling junction (MTJ). In one embodiment, a supply-switched dual cell memory bitcell in accordance with the present description may lack a source or select line (SL) signal line. Other aspects are described herein.
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3.
公开(公告)号:US20210335414A1
公开(公告)日:2021-10-28
申请号:US17368732
申请日:2021-07-06
Applicant: Intel Corporation
Inventor: Chong J. ZHAO , James A. McCALL , Shigeki TOMISHIMA , George VERGIS , Kuljit S. BAINS
IPC: G11C11/4093 , G11C11/4096 , G11C11/408 , H01L27/108
Abstract: Techniques to couple a high bandwidth memory device on a silicon substrate and a package substrate are disclosed. Examples include selectively activating input/out (I/O) or command and address (CA) contacts on a bottom side of a logic layer for the high bandwidth device based on a mode of operation. The I/O and CA contacts are for accessing one or more memory devices include in the high bandwidth memory device via one or more data channels.
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公开(公告)号:US20210335393A1
公开(公告)日:2021-10-28
申请号:US17372298
申请日:2021-07-09
Applicant: Intel Corporation
Inventor: Chong J. ZHAO , Shigeki TOMISHIMA , Kuljit S. BAINS , James A. McCALL , Dimitrios ZIAKAS
IPC: G11C5/06
Abstract: An apparatus is described. The apparatus includes a logic chip upon which a stack of memory chips is to be placed. The stack of memory chips and the logic chip to be placed within a same package, wherein, multiple memory chips of the stack of memory chips are divided into fractions, and, multiple internal channels within the package that emanate from the logic chip are to be coupled to respective ones of the fractions. The logic chip has a multiplexer. The multiplexer is to multiplex a single input/output (I/O) channel of the package to the multiple internal channels.
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公开(公告)号:US20180136861A1
公开(公告)日:2018-05-17
申请号:US15788679
申请日:2017-10-19
Applicant: Intel Corporation
Inventor: Shigeki TOMISHIMA , Kuljit S. BAINS
CPC classification number: G06F3/0619 , G06F3/0659 , G06F3/068 , G11C7/10 , G11C7/20 , G11C11/4072 , G11C16/20
Abstract: Examples include techniques for a write zero operation. Example techniques include forwarding a write 0 command to a memory device to cause internal activations of column select lines of one or more blocks of memory to cause bit values or contents of the one or more blocks to have or store a value of 0.
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公开(公告)号:US20170337958A1
公开(公告)日:2017-11-23
申请号:US15495936
申请日:2017-04-24
Applicant: INTEL CORPORATION
Inventor: Charles AUGUSTINE , Shigeki TOMISHIMA , James W. TSCHANZ , Shih-Lien L. LU
IPC: G11C11/16
Abstract: In accordance with various embodiments of this disclosure, stray magnetic field mitigation in an MRAM memory such as a spin transfer torque (STT) random access memory (RAM), STTRAM is described. In one embodiment, retention of bitcell bit value storage states in an STTRAM may be facilitated by generating magnetic fields to compensate for stray magnetic fields which may cause bitcells of the memory to change state. In another embodiment, retention of bitcell bit value storage states in an STTRAM may be facilitated by selectively suspending access to a row of memory to temporarily terminate stray magnetic fields which may cause bitcells of the memory to change state. Other aspects are described herein.
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公开(公告)号:US20170177519A1
公开(公告)日:2017-06-22
申请号:US14975293
申请日:2015-12-18
Applicant: INTEL CORPORATION
Inventor: Wei WU , Shigeki TOMISHIMA , Shih-Lien L. LU
CPC classification number: G06F13/28 , G06F13/1668 , G06F13/4027
Abstract: Provided are a memory device and a memory bank comprising a split local data bus, and a segmented global data bus coupled to local data bus. Provided also is a method comprising, receiving a signal from a split local data bus, and transmitting the signal to a segmented global data bus coupled to local data bus. Provided also is a computational device that includes the memory device and the memory bank, and optionally one or more of a display, a network interface, and a battery.
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8.
公开(公告)号:US20170153933A1
公开(公告)日:2017-06-01
申请号:US15374922
申请日:2016-12-09
Applicant: Intel Corporation
Inventor: Shigeki TOMISHIMA , Charles AUGUSTINE , Wei WU , Shih Lien L. LU
CPC classification number: G06F11/073 , G06F3/0619 , G06F3/064 , G06F3/0679 , G06F11/0751 , G06F11/079 , G06F11/0793 , G06F11/1048 , G06F11/1076 , G11C11/1655 , G11C11/1659 , G11C11/1673 , G11C13/0004 , G11C13/0007 , G11C13/0011 , G11C13/004 , G11C29/42 , G11C29/52 , G11C2013/0042 , G11C2213/79 , G11C2213/82 , H03M13/1575 , H03M13/373 , H03M13/6502
Abstract: Described is an apparatus which comprises: a complementary resistive memory bit-cell; a first sense amplifier coupled to the complementary resistive memory bit-cell via access devices; a second sense amplifier coupled to the first sense amplifier and to the complementary resistive memory bit-cell via the access devices, wherein the second sense amplifier is operable to detect an error in the complementary resistive memory bit-cell.
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公开(公告)号:US20250031453A1
公开(公告)日:2025-01-23
申请号:US18906033
申请日:2024-10-03
Applicant: Intel Corporation
Inventor: Shigeki TOMISHIMA
IPC: H01L27/12 , H01L21/02 , H01L21/4763 , H01L29/24 , H01L29/66 , H01L29/786
Abstract: An example two transistor (2T) gain cell memory with indium-gallium-zinc-oxide (IGZO) transistors. Examples include IGZO transistors included in a dynamic random access memory (DRAM) cell. The IGZO transistors included in the DRAM cell are described as being formed or created in a back end (BE) metal process stack of an integrated circuit chip or die.
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公开(公告)号:US20240078051A1
公开(公告)日:2024-03-07
申请号:US18389525
申请日:2023-11-14
Applicant: Intel Corporation
Inventor: Nilesh N. SHAH , Chetan CHAUHAN , Shigeki TOMISHIMA , Nahid HASSAN , Andrew Chaang LING
CPC classification number: G06F3/0679 , G06F3/0613 , G06F3/0644 , G06N5/04 , G11C13/0004 , G11C13/0007
Abstract: Examples herein relate to a solid state drive that includes a media, first circuitry, and second circuitry. In some examples, the first circuitry is to execute one or more commands. In some examples, the second circuitry is to receive a configuration of at one type of command, where the configuration is to define an amount of media bandwidth allocated for the at one type of command; receive a command; and assign the received command to the first circuitry for execution.
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