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    Apparatus and method for manufacturing printed circuit board
    2.
    发明申请
    Apparatus and method for manufacturing printed circuit board 失效
    印刷电路板制造装置及方法

    公开(公告)号：US20090049683A1

    公开(公告)日：2009-02-26

    申请号：US12076223

    申请日：2008-03-14

    申请人： Jee-Soo Mok ,  Je-Gwang Yoo ,  Yoong Oh ,  Jong-Seok Bae ,  Chang-Sup Ryu

    发明人： Jee-Soo Mok ,  Je-Gwang Yoo ,  Yoong Oh ,  Jong-Seok Bae ,  Chang-Sup Ryu

    IPC分类号： H05K3/00 ,  B29C43/34 ,  H01L21/67

    CPC分类号： H05K3/4647 ,  B29C43/28 ,  B29C43/46 ,  H05K3/4069 ,  H05K2203/0143 ,  H05K2203/1189 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/53126 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187

    摘要： An apparatus and a method for manufacturing a printed circuit board are disclosed. The apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.

    摘要翻译： 公开了一种用于制造印刷电路板的装置和方法。 用于制造使用导电凸块以互连层的印刷电路板的装置包括：输送单元，其被配置为输送在一侧形成有导电凸块的板; 上辊和下辊，将板和绝缘体压在一起; 形成在上辊的表面上的弹性涂层; 以及从弹性涂层的表面除去杂质的清洗装置。 该装置不需要用于执行缓冲功能和凸块和辊之间的分离功能的单独装置，并且可以使用清洁装置将辊保持清洁。

    Printed circuit board with embedded cavity capacitor
    6.
    发明授权
    Printed circuit board with embedded cavity capacitor 有权
    带嵌入式腔体电容器的印刷电路板

    公开(公告)号：US07983055B2

    公开(公告)日：2011-07-19

    申请号：US12010436

    申请日：2008-01-24

    申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

    发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

    IPC分类号： H05K1/18 ,  H01L27/108

    CPC分类号： H05K1/162 ,  H05K1/0218 ,  H05K1/0236 ,  H05K3/4069 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/09972

    摘要： A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.

    摘要翻译： 公开了一种具有嵌入式腔体电容器的印刷电路板。 根据本发明的实施例，具有嵌入式空腔电容器的印刷电路板，印刷电路板可以分别包括用作功率层和接地层的两个导电层; 以及放置在所述两个导电层之间的第一电介质层，其中至少一个空腔电容器被布置在放置在所述印刷电路板上的噪声源和被噪声阻止的目的地之间的可噪声转移路径中，形成所述空腔电容器 以允许第二电介质层具有比第一电介质层更低的台阶区域，第二电介质层分别使用两个导电层作为第一电极和第二电极，并且放置在第一电极和第二电极之间。

    Optical wiring board and manufacturing method thereof
    8.
    发明申请
    Optical wiring board and manufacturing method thereof 审中-公开
    光接线板及其制造方法

    公开(公告)号：US20090130390A1

    公开(公告)日：2009-05-21

    申请号：US12149952

    申请日：2008-05-09

    申请人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

    发明人： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Hoon Kim

    IPC分类号： B32B3/00 ,  B29D11/00

    CPC分类号： B29D11/00663 ,  B29D11/00807 ,  G02B6/136 ,  H05K1/0274 ,  Y10T428/24612

    摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.

    摘要翻译： 公开了一种光布线板及其制造方法。 制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。 本发明的实施例可用于容易地控制芯的厚度。

    Method of fabricating cavity capacitor embedded in printed circuit board
    9.
    发明申请
    Method of fabricating cavity capacitor embedded in printed circuit board 审中-公开
    埋入印刷电路板的空腔电容器的制造方法

    公开(公告)号：US20110197409A1

    公开(公告)日：2011-08-18

    申请号：US13064847

    申请日：2011-04-20

    申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

    发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

    IPC分类号： H01G7/00

    CPC分类号： H05K1/162 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor.

    摘要翻译： 一种嵌入在印刷电路板中的空腔电容器的方法，包括分别用作功率层和接地层的两个导电层和放置在两个导电层之间的第一介电层，所述方法包括： 上导电层和除了两个导电层的下导电层之外的第一电介质层，以允许在两个导电层之间形成腔，下导电层假定用作空腔电容器的任一电极; 在所述空腔上堆叠电介质材料以允许在所述空腔中形成具有比所述第一电介质层更低的台阶部分的第二电介质层; 并且在第二电介质层的上部和空腔的侧部上堆叠导电材料，以允许上部导电层用作空腔电容器的另一个电极。