Method of making a compound semiconductor having metallic inclusions
    1.
    发明授权
    Method of making a compound semiconductor having metallic inclusions 失效
    制造具有金属夹杂物的化合物半导体的方法

    公开(公告)号:US5471948A

    公开(公告)日:1995-12-05

    申请号:US240880

    申请日:1994-05-11

    CPC分类号: H01L31/0232 H01L31/105

    摘要: A doped or undoped photoresponsive material having metallic precipitates, and a PiN photodiode utilizing the material for detecting light having a wavelength of 1.3 micrometers. The PiN photodiode includes a substrate having a first compound semiconductor layer disposed thereon. The PiN photodiode further includes an optically responsive compound semiconductor layer disposed above the first compound semiconductor layer. The optically responsive layer includes a plurality of buried Schottky barriers, each of which is associated with an inclusion within a crystal lattice of a Group III-V material. The PiN device also includes a further compound semiconductor layer disposed above the optically responsive layer. For a transversely illuminated embodiment, waveguiding layers may also be disposed above and below the PiN structure. In one example the optically responsive layer is comprised of GaAs:As. The GaAs:As exhibits a very low room temperature dark current, even under forward bias conditions, and a responsivity to 1.3 micrometer radiation modulated at frequencies greater than 1 GHz.

    摘要翻译: 具有金属沉淀物的掺杂或未掺杂的光响应材料,以及利用该材料用于检测波长为1.3微米的光的PiN光电二极管。 PiN光电二极管包括其上设置有第一化合物半导体层的基板。 PiN光电二极管还包括设置在第一化合物半导体层上方的光学响应化合物半导体层。 光学响应层包括多个埋置的肖特基势垒,其中每个都包含在III-V族材料的晶格内。 PiN器件还包括设置在光学响应层上方的另一化合物半导体层。 对于横向照明的实施例,也可以在PiN结构的上方和下方设置波导层。 在一个实例中,光响应层由GaAs:As组成。 GaAs:As表现出非常低的室温暗电流,即使在正向偏置条件下,并且对频率大于1 GHz的1.3微米辐射的响应度也是如此。

    Compound semiconductor having metallic inclusions and devices fabricated
therefrom
    2.
    发明授权
    Compound semiconductor having metallic inclusions and devices fabricated therefrom 失效
    具有金属夹杂物的复合半导体及其制造的器件

    公开(公告)号:US5371399A

    公开(公告)日:1994-12-06

    申请号:US104423

    申请日:1993-08-09

    CPC分类号: H01L31/0232 H01L31/105

    摘要: A doped or undoped photoresponsive material having metallic precipitates, and a PiN photodiode utilizing the material for detecting light having a wavelength of 1.3 micrometers. The PiN photodiode includes a substrate having a first compound semiconductor layer disposed thereon. The PiN photodiode further includes an optically responsive compound semiconductor layer disposed above the first compound semiconductor layer. The optically responsive layer includes a plurality of buried Schottky barriers, each of which is associated with an inclusion within a crystal lattice of a Group III-V material. The PiN device also includes a further compound semiconductor layer disposed above the optically responsive layer. For a transversely illuminated embodiment, waveguiding layers may also be disposed above and below the PiN structure. In one example the optically responsive layer is comprised of GaAs:As. The GaAs:As exhibits a very low room temperature dark current, even under forward bias conditions, and a responsivity to 1.3 micrometer radiation modulated at frequencies greater than 1 GHz.

    摘要翻译: 具有金属沉淀物的掺杂或未掺杂的光响应材料,以及利用该材料用于检测波长为1.3微米的光的PiN光电二极管。 PiN光电二极管包括其上设置有第一化合物半导体层的基板。 PiN光电二极管还包括设置在第一化合物半导体层上方的光学响应化合物半导体层。 光学响应层包括多个埋置的肖特基势垒,其中每个都包含在III-V族材料的晶格内。 PiN器件还包括设置在光学响应层上方的另一化合物半导体层。 对于横向照明的实施例,也可以在PiN结构的上方和下方设置波导层。 在一个实例中,光响应层由GaAs:As组成。 GaAs:As表现出非常低的室温暗电流,即使在正向偏置条件下,并且对频率大于1 GHz的1.3微米辐射的响应度也是如此。

    Compound semiconductor interface control using cationic ingredient oxide
to prevent fermi level pinning
    4.
    发明授权
    Compound semiconductor interface control using cationic ingredient oxide to prevent fermi level pinning 失效
    使用阳离子成分氧化物的化合物半导体界面控制以防止费米能级钉扎

    公开(公告)号:US5021365A

    公开(公告)日:1991-06-04

    申请号:US322583

    申请日:1989-03-13

    摘要: Control of the Fermi level pinning problem and the production of flat band surface performance in compound semiconductors is achieved by providing a cationic oxide free of anionic species on the surface of the semiconductor for flat band performance and with a localized inclusion of some anionic species for barrier performance so that oxide and metal work function responsiveness is available in structure and performance in MOSFET, MESFET and different work function metal FET structures. A cationic gallium oxide is produced on GaAs by oxide growth during illumination and while being rinsed with oxygenated water. The oxidation is used to produce both anionic and cationic species while the rinsing process selectively removes all the anionic species.

    摘要翻译: 通过在半导体的表面上提供不含阴离子物质的阳离子氧化物以实现平带性能并且将一些阴离子物质局部包含在屏障中来实现费米能级钉扎问题的控制和化合物半导体中的平带表面性能的产生 性能,使得氧化物和金属功能响应性在MOSFET,MESFET和不同功能金属FET结构中的结构和性能方面是可用的。 阳离子氧化镓通过照射期间的氧化物生长和用氧化水冲洗而在GaAs上产生。 氧化用于产生阴离子和阳离子物质,而漂洗过程选择性地除去所有阴离子物质。

    Compound semiconductor interface control
    6.
    发明授权
    Compound semiconductor interface control 失效
    复合半导体接口控制

    公开(公告)号:US4843450A

    公开(公告)日:1989-06-27

    申请号:US874738

    申请日:1986-06-16

    摘要: Control of the Fermi level pinning problem and the production of flat band surface performance in compound semiconductors is achieved by providing a cationic oxide free of anionic species on the surface of the semiconductor for flat band performance and with a localized inclusion of some anionic species for barrier performance so that oxide and metal work function responsiveness is available in structure and performance in MOSFET, MESFET and different work function metal FET structures. A cationic gallium oxide is produced on GaAs by oxide growth during illumination and while being rinsed with oxygenated water. The oxidation is used to produce both anionic and cationic species while the rinsing process selectively removes all the anionic species.

    摘要翻译: 通过在半导体的表面上提供不含阴离子物质的阳离子氧化物以实现平带性能并且将一些阴离子物质局部包含在屏障中来实现费米能级钉扎问题的控制和化合物半导体中的平带表面性能的产生 性能,使得氧化物和金属功能响应性在MOSFET,MESFET和不同功能金属FET结构中的结构和性能方面是可用的。 阳离子氧化镓通过照射期间的氧化物生长和用氧化水冲洗而在GaAs上产生。 氧化用于产生阴离子和阳离子物质,而漂洗过程选择性地除去所有阴离子物质。