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    Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
    5.
    发明授权
    Method and use of a device for applying coatings to band-like structures during the production of semiconductor components 有权
    在制造半导体部件期间用于将涂层施加到带状结构的装置的方法和用途

    公开(公告)号：US07635612B2

    公开(公告)日：2009-12-22

    申请号：US11549366

    申请日：2006-10-13

    申请人： Bernd Betz ,  Joachim Mahler ,  Ralf Otremba ,  Stefan Paulus

    发明人： Bernd Betz ,  Joachim Mahler ,  Ralf Otremba ,  Stefan Paulus

    IPC分类号： H01L21/56

    CPC分类号： H01L21/56 ,  H01L21/6715 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/0091 ,  H05K2203/013 ,  H05K2203/1545 ,  H01L2924/00

    摘要： In a device (35) and a method a thin organic or inorganic layer is applied to individual component positions of band-like structures (1). The layer can effect improved or optimized adhesion between a coated surface and a plastic housing compound. Furthermore, the layer can be used as a corrosion prevention layer, an electrical insulating layer or as a dielectric for the coated surfaces. For the selective application of the layer, the device (35) has a jet printer (2) having a plurality of electronically controllable jet heads (4-7). The jet printer (2) coats the band-like structures (1) selectively on the upper side (17) in a first coating position (15) and coats the band-like structures (1) selectively on the underside (18) in a second coating position (16).

    摘要翻译： 在设备（35）和方法中，将有机或无机薄层施加到带状结构（1）的各个部件位置。 该层可以实现涂覆表面和塑料外壳化合物之间的改进或优化的粘附。 此外，该层可用作涂覆表面的防腐蚀层，电绝缘层或电介质。 为了选择性地施加该层，装置（35）具有具有多个可电子控制的喷射头（4-7）的喷墨打印机（2）。 喷射打印机（2）在第一涂覆位置（15）中选择性地在上侧（17）上涂覆带状结构（1），并且在下侧（18）上选择性地涂覆带状结构（1） 第二涂布位置（16）。

    Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
    6.
    发明申请
    Method and use of a device for applying coatings to band-like structures during the production of semiconductor components 有权
    在制造半导体部件期间用于将涂层施加到带状结构的装置的方法和用途

    公开(公告)号：US20070128371A1

    公开(公告)日：2007-06-07

    申请号：US11549366

    申请日：2006-10-13

    申请人： Bernd Betz ,  Joachim Mahler ,  Ralf Otremba ,  Stefan Paulus

    发明人： Bernd Betz ,  Joachim Mahler ,  Ralf Otremba ,  Stefan Paulus

    IPC分类号： B05D5/12 ,  B05D5/00 ,  B05D7/00

    CPC分类号： H01L21/56 ,  H01L21/6715 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/0091 ,  H05K2203/013 ,  H05K2203/1545 ,  H01L2924/00

    摘要： In a device (35) and a method a thin organic or inorganic layer is applied to individual component positions of band-like structures (1). The layer can effect improved or optimized adhesion between a coated surface and a plastic housing compound. Furthermore, the layer can be used as a corrosion prevention layer, an electrical insulating layer or as a dielectric for the coated surfaces. For the selective application of the layer, the device (35) has a jet printer (2) having a plurality of electronically controllable jet heads (4-7). The jet printer (2) coats the band-like structures (1) selectively on the upper side (17) in a first coating position (15) and coats the band-like structures (1) selectively on the underside (18) in a second coating position (16).

    摘要翻译： 在设备（35）和方法中，将有机或无机薄层施加到带状结构（1）的各个部件位置。 该层可以实现涂覆表面和塑料外壳化合物之间的改进或优化的粘附。 此外，该层可用作涂覆表面的防腐蚀层，电绝缘层或电介质。 为了选择性地施加层，装置（35）具有喷射打印机（2），其具有多个可电子控制的喷射头（4-7）。 喷射打印机（2）在第一涂覆位置（15）中选择性地在上侧（17）上涂覆带状结构（1），并且在下侧（18）上选择性地涂覆带状结构（1） 第二涂布位置（16）。

    Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
    7.
    发明授权
    Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit 有权

    公开(公告)号：US11189537B2

    公开(公告)日：2021-11-30

    申请号：US13425589

    申请日：2012-03-21

    申请人： Khalil Hosseini ,  Joachim Mahler ,  Edward Fuergut

    发明人： Khalil Hosseini ,  Joachim Mahler ,  Edward Fuergut

    IPC分类号： H01L23/051 ,  H01L21/56 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

    摘要： A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.