公开(公告)号：US5675889A

公开(公告)日：1997-10-14

申请号：US474343

申请日：1995-06-07

申请人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

发明人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

摘要： Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.

摘要翻译： 制造两个基板，每个基板在表面布线层中具有金属触点的平面的镜像矩阵。 衬底被定位成与平行对置的矩阵定义成对的面对的接触。 金属球被定位在每对触点之间，在球与两个相应的触头中的每一个之间具有相应体积的接合材料。 同时熔化接合材料的体积以允许表面张力对准衬底并且在由球的矩阵限定的平面中的每个相应的触头对之间精确地定位球。

公开(公告)号：US06504105B1

公开(公告)日：2003-01-07

申请号：US08640645

申请日：1996-05-01

申请人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  Karl Grant Hoebener ,  David P. Watson ,  John Saunders Corbin, Jr.

发明人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  Karl Grant Hoebener ,  David P. Watson ,  John Saunders Corbin, Jr.

IPC分类号： H05K103

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  B23K2101/36 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

摘要： High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

摘要翻译： 高熔点温度Pb / Sn 95/5焊球通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底底部的铜焊盘上。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊锡球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成为尽可能大的I / O间距，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

公开(公告)号：US5591941A

公开(公告)日：1997-01-07

申请号：US144981

申请日：1993-10-28

申请人： John Acocella ,  Donald R. Banks ,  Joseph A. Benenati ,  Thomas Caulfield ,  Karl G. Hoebener ,  David P. Watson ,  John S. Corbin, Jr.

发明人： John Acocella ,  Donald R. Banks ,  Joseph A. Benenati ,  Thomas Caulfield ,  Karl G. Hoebener ,  David P. Watson ,  John S. Corbin, Jr.

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42 ,  H06K1/14

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

摘要： High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

摘要翻译： 高熔点温度Pb / Sn 95/5焊球通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底底部的铜焊盘上。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊锡球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成为尽可能大的I / O间距，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

公开(公告)号：US5092510A

公开(公告)日：1992-03-03

申请号：US616152

申请日：1990-11-20

申请人： Joel R. Anstrom ,  Robert D. Hrehor, Jr. ,  Robert A. Holloway ,  David P. Watson

发明人： Joel R. Anstrom ,  Robert D. Hrehor, Jr. ,  Robert A. Holloway ,  David P. Watson

IPC分类号： B23P21/00 ,  H05K3/34 ,  H05K13/00 ,  H05K13/04

CPC分类号： H05K13/0465 ,  H05K13/0069

摘要： The method and apparatus of the present invention may be utilized to support a selected mounting point on a circuit board during the mounting an electronic component. An integrated circuit device is selected and positioned adjacent a first side of a circuit board at a desired mounting point utilizing a robotic manipulator and a placement head. A support fixture is then urged into temporary contact with a second side of the circuit board utilizing a flexible mounting system such that minor variations or misalignments between the plane of the support fixture, the circuit board and the placement head are eliminated. In one embodiment of the present invention a flexible fluid filled bag is utilized in conjunction with the support fixture so that the presence of components on the second side of the circuit board may be accommodated while supporting the circuit board during component mounting. Finally, the requirement for providing a robotic manipulator and placement head capable of generating the substantial downward forces necesary to create a bond between a circuit board and an electronic component is eliminated by positioning the placement head and heated bonding tool proximate to the conductive leads of an electronic component and then forcefully urging the support fixture upward toward the heated bonding tool while maintaining the heated bonding tool in a fixed position.

摘要翻译： 本发明的方法和装置可以用于在安装电子部件期间支撑电路板上选定的安装点。 使用机器人操纵器和放置头，在期望的安装点处选择并定位与电路板的第一侧相邻的集成电路器件。 然后，使用柔性安装系统，将支撑固定装置与电路板的第二侧暂时接触，从而消除了支撑固定装置的平面，电路板和放置头之间的微小的变化或不对准。 在本发明的一个实施例中，柔性流体填充的袋与支撑固定装置结合使用，使得可以容纳在电路板的第二侧上的部件的存在，同时在部件安装期间支撑电路板。 最后，通过将放置头和加热的接合工具定位在靠近导电引线的位置，可以消除提供能够产生用于在电路板和电子部件之间形成结合的基本向下的力的机器人操纵器和放置头的要求 然后在将加热的焊接工具保持在固定位置的同时将支撑固定装置向上强制地向着加热的焊接工具推动。

公开(公告)号：US5094381A

公开(公告)日：1992-03-10

申请号：US616150

申请日：1990-11-20

申请人： Robert A. Amos ,  Joel R. Anstrom ,  Francis W. Bogaczyk ,  Robert W. Kulterman ,  Gilbert B. Nebgen ,  Darryl R. Polk ,  Michael A. Rubsam ,  David P. Watson ,  Terry L. Wilmoth ,  Clifford M. Wood

发明人： Robert A. Amos ,  Joel R. Anstrom ,  Francis W. Bogaczyk ,  Robert W. Kulterman ,  Gilbert B. Nebgen ,  Darryl R. Polk ,  Michael A. Rubsam ,  David P. Watson ,  Terry L. Wilmoth ,  Clifford M. Wood

IPC分类号： H01L21/52 ,  H01L21/00 ,  H01L21/60 ,  H05K13/04 ,  H05K13/08

CPC分类号： H01L21/67144 ,  H05K13/0465 ,  H05K13/08

摘要： The apparatus of the present invention may be utilized for the automated bonding of electronic components to a circuit board. A placement and bonding head is attached to a manipulatable robotic arm and is utilized to select an electronic component having a plurality of conductive leads from a supply of such components and position that component adjacent a plurality of contact pads on a circuit board. While retaining the electronic component within the placement and bonding head, the component is then thermally bonded to the contact pads. In one embodiment of the present invention, an electronic component may be optically inspected while being retained within the placement and bonding head. In another embodiment, thermal bonding is accomplished utilizing a plurality of thermally activatable blades which each include a thermocouple mounted adjacent thereto. Selective low current control signals are then coupled to the placement and bonding head where transformers are utilized to amplify the current prior to coupling the control signal to individually thermally activatable blades. In yet another embodiment of the present invention, the placement and bonding head includes a plenum for supplying inert gas to the bonding site so that the use of flux is not necessary.

公开(公告)号：US07574497B2

公开(公告)日：2009-08-11

申请号：US10344876

申请日：2002-05-30

申请人： David H. Scheidt ,  David P. Watson ,  David L. Alger ,  Christopher B. McCubbin ,  Shon D. Vick

发明人： David H. Scheidt ,  David P. Watson ,  David L. Alger ,  Christopher B. McCubbin ,  Shon D. Vick

IPC分类号： G06F15/173 ,  G06F15/177

CPC分类号： G06N5/00 ,  G06F8/24 ,  G06F8/313

摘要： The Open Autonomy Kernel (OAK) addresses critical infrastructure requirements for next generation autonomous and semi-autonomous systems (24), including performance tracking, anomaly detection, diagnosis, fault recovery, and plant “safing”. OAK combines technologies in automated planning and scheduling, control agent-based systems (22), and model based reasoning to form a portable software architecture (26), knowledge-base, and open Application Programming Interface (API) to enable integrated auxiliary subsystem autonomy.

摘要翻译： 开放自主内核（OAK）解决了下一代自主和半自主系统（24）的关键基础架构要求，包括性能跟踪，异常检测，诊断，故障恢复和工厂“安全”。 OAK将自动化计划和调度技术，基于控制代理的系统（22）和基于模型的推理相结合，形成便携式软件架构（26），知识库和开放的应用程序编程接口（API），以实现集成的辅助子系统自主性 。