公开(公告)号：US5675889A

公开(公告)日：1997-10-14

申请号：US474343

申请日：1995-06-07

申请人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

发明人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

摘要： Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.

摘要翻译： 制造两个基板，每个基板在表面布线层中具有金属触点的平面的镜像矩阵。 衬底被定位成与平行对置的矩阵定义成对的面对的接触。 金属球被定位在每对触点之间，在球与两个相应的触头中的每一个之间具有相应体积的接合材料。 同时熔化接合材料的体积以允许表面张力对准衬底并且在由球的矩阵限定的平面中的每个相应的触头对之间精确地定位球。

公开(公告)号：US06504105B1

公开(公告)日：2003-01-07

申请号：US08640645

申请日：1996-05-01

申请人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  Karl Grant Hoebener ,  David P. Watson ,  John Saunders Corbin, Jr.

发明人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  Karl Grant Hoebener ,  David P. Watson ,  John Saunders Corbin, Jr.

IPC分类号： H05K103

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  B23K2101/36 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

摘要： High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

摘要翻译： 高熔点温度Pb / Sn 95/5焊球通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底底部的铜焊盘上。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊锡球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成为尽可能大的I / O间距，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

公开(公告)号：US5591941A

公开(公告)日：1997-01-07

申请号：US144981

申请日：1993-10-28

申请人： John Acocella ,  Donald R. Banks ,  Joseph A. Benenati ,  Thomas Caulfield ,  Karl G. Hoebener ,  David P. Watson ,  John S. Corbin, Jr.

发明人： John Acocella ,  Donald R. Banks ,  Joseph A. Benenati ,  Thomas Caulfield ,  Karl G. Hoebener ,  David P. Watson ,  John S. Corbin, Jr.

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42 ,  H06K1/14

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

摘要： High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

摘要翻译： 高熔点温度Pb / Sn 95/5焊球通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底底部的铜焊盘上。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊锡球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成为尽可能大的I / O间距，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

公开(公告)号：US5455387A

公开(公告)日：1995-10-03

申请号：US276564

申请日：1994-07-18

申请人： Paul R. Hoffman ,  Keshav B. Prasad ,  Thomas Caulfield ,  Sean T. Crowley

发明人： Paul R. Hoffman ,  Keshav B. Prasad ,  Thomas Caulfield ,  Sean T. Crowley

IPC分类号： H01L23/04 ,  H01L23/495 ,  H01L23/02

CPC分类号： H01L23/04 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49534 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/484 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1532

摘要： An electronic package with a semiconductor chip, a lead frame, a metal casing, and a redistribution interposer. The chip is mounted on the interposer and wirebonded to first ends of redistribution leads of the interposer. The redistribution leads have second ends orientated in a general flipped orientation relative to their corresponding first ends. The second ends are wirebonded to pads of the lead frame. The interposer allows smaller chips to be used in the package without changing the lead frame. The interposer also allows the chip to be flip-mounted in the package without changing the lead frame or casing, this allows redirection of the chip's thermal path.

摘要翻译： 具有半导体芯片，引线框架，金属外壳和再分配插入件的电子封装。 芯片安装在插入器上并引线键合到插入器的再分配引线的第一端。 再分配引线具有相对于其对应的第一端以一般的翻转取向定向的第二端。 第二端与引线框的焊盘引线键合。 插入器允许在封装中使用更小的芯片而不改变引线框架。 插入器还允许将芯片翻转安装在封装中而不改变引线框架或外壳，这允许芯片的热路径重定向。

公开(公告)号：US5066544A

公开(公告)日：1991-11-19

申请号：US573440

申请日：1990-08-27

申请人： Hemant S. Betrabet ,  Otmar H. Boser ,  Robert H. Kane ,  Susan McGee ,  Thomas Caulfield

发明人： Hemant S. Betrabet ,  Otmar H. Boser ,  Robert H. Kane ,  Susan McGee ,  Thomas Caulfield

IPC分类号： B23K35/26 ,  C22C11/06 ,  C22C13/00 ,  C22C29/00 ,  H05K3/34

CPC分类号： B23K35/268 ,  B23K35/262 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K3/3463 ,  Y10T428/12486 ,  Y10T428/12687

摘要： An improved dispersion strengthened lead-tin alloy solder is provided in which there is dispersed in the solder up to about 5 vol. percent of small particles, of a metal sulfide or a nickel-tin intermetallic.

摘要翻译： 提供了一种改进的分散强化的铅锡合金焊料，其中在焊料中分散到约5体积％。 百分比的小颗粒，金属硫化物或镍 - 锡金属间化合物。

公开(公告)号：US20120274069A1

公开(公告)日：2012-11-01

申请号：US13505245

申请日：2010-10-29

申请人： Milton Venetos ,  Thomas Caulfield ,  William M. Conlon ,  Robert Brown Callery

发明人： Milton Venetos ,  Thomas Caulfield ,  William M. Conlon ,  Robert Brown Callery

IPC分类号： F24J2/30 ,  F03G6/00 ,  H02K7/18 ,  F24J2/00

CPC分类号： F03G6/067 ,  F24S10/70 ,  F24S20/20 ,  F24S23/80 ,  F24S80/20 ,  Y02E10/41 ,  Y02E10/46

摘要： Systems for producing vaporous working fluid are provided, including: a first fluid passage configured to convey a working fluid to a first solar heating system, wherein the first solar heating system heats the working fluid to produce a heated working fluid having a temperature t1 and a quality X1; a second fluid passage configured to convey a heat transfer fluid to a second solar heating system to produce a heated heat transfer fluid; and a heat exchanger configured to transfer heat from the heated heat transfer fluid to the heated working fluid. When X1

摘要翻译： 提供了一种用于产生蒸汽工作流体的系统，包括：第一流体通道，其构造成将工作流体输送到第一太阳能加热系统，其中第一太阳能加热系统加热工作流体以产生具有温度t1和 质量X1; 第二流体通道，其构造成将传热流体输送到第二太阳能加热系统以产生加热的传热流体; 以及热交换器，其构造成将热量从加热的传热流体传递到加热的工作流体。 当X1 <1时，传热导致被加热工作流体的质量提高，当X1 = 1时，传热导致加热的工作流体的温度升高。 还提供了使用该系统来产生蒸汽工作流体的方法。

公开(公告)号：US07179816B2

公开(公告)日：2007-02-20

申请号：US10954808

申请日：2004-09-30

申请人： Patrick Mailliet ,  Jean-Francois Riou ,  Marcel Alasia ,  Thomas Caulfield ,  Gilles Doerflinger ,  Jean-Louis Mergny ,  Abdelazize Laoui ,  Odile Petitgenet ,  Emmanuelle Renou

发明人： Patrick Mailliet ,  Jean-Francois Riou ,  Marcel Alasia ,  Thomas Caulfield ,  Gilles Doerflinger ,  Jean-Louis Mergny ,  Abdelazize Laoui ,  Odile Petitgenet ,  Emmanuelle Renou

IPC分类号： C07D239/50 ,  C07D213/02 ,  C07D215/38 ,  A61K31/505 ,  A61K31/506 ,  A61P35/00

CPC分类号： C07D401/12 ,  A61K31/53 ,  C07D401/14 ,  C07D453/02

摘要： The present invention relates to cancer therapy and to novel anticancer agents having a mechanism of action which inhibits telomerase. It also relates to novel chemical compounds as well as their therapeutic application in humans.

摘要翻译： 本发明涉及癌症治疗和具有抑制端粒酶的作用机制的新型抗癌剂。 它还涉及新型化合物以及它们在人体中的治疗应用。

公开(公告)号：US20050203170A1

公开(公告)日：2005-09-15

申请号：US11108855

申请日：2005-04-19

申请人： Patrick Mailliet ,  Cecile Combeau ,  Marie-Christine Bissery ,  Marie-Pierre Cherrier ,  Thomas Caulfield ,  Gilles Tiraboschi

发明人： Patrick Mailliet ,  Cecile Combeau ,  Marie-Christine Bissery ,  Marie-Pierre Cherrier ,  Thomas Caulfield ,  Gilles Tiraboschi

IPC分类号： C07C225/22 ,  C07C237/04 ,  C07C279/36 ,  C07D207/16 ,  C07D209/08 ,  C07D405/06 ,  A61K31/401 ,  A61K31/135 ,  A61K31/198

CPC分类号： C07D405/06 ,  C07C225/22 ,  C07C237/04 ,  C07C279/36 ,  C07D207/16 ,  C07D209/08

摘要： 1,3-Diarylprop-2-en-1-ones and derivatives, compositions containing them, manufacturing process and use. Substituted 1,3-diarylprop-2-en-1-ones with therapeutic activity may be used in oncology.

摘要翻译： 1,3-二芳基丙-2-烯-1-酮及其衍生物，含有它们的组合物，制造方法和用途。 具有治疗活性的取代的1,3-二芳基丙-2-烯-1-酮可用于肿瘤学。

公开(公告)号：US06887873B2

公开(公告)日：2005-05-03

申请号：US10103883

申请日：2002-03-25

申请人： Patrick Mailliet ,  Abdelazize Laoui ,  Jean-François Riou ,  Gilles Doerflinger ,  Jean-Louis Mergny ,  François Hamy ,  Thomas Caulfield

发明人： Patrick Mailliet ,  Abdelazize Laoui ,  Jean-François Riou ,  Gilles Doerflinger ,  Jean-Louis Mergny ,  François Hamy ,  Thomas Caulfield

IPC分类号： A61K31/53 ,  C07D401/12 ,  C07D401/14 ,  C07D405/14 ,  C07D453/02

CPC分类号： C07D401/14 ,  A61K31/53 ,  C07D401/12 ,  C07D405/14 ,  C07D453/02

摘要： The present invention relates to cancer therapy and to novel anticancer agents having a mechanism of action which is quite specific. It also relates to novel chemical compounds as well as their therapeutic application in humans.

摘要翻译： 本发明涉及癌症治疗和具有非常特异性的作用机制的新型抗癌剂。 它还涉及新型化合物以及它们在人体中的治疗应用。

公开(公告)号：US06858608B2

公开(公告)日：2005-02-22

申请号：US10040370

申请日：2002-01-09

申请人： Patrick Mailliet ,  Jean-François Riou ,  Marcel Alasia ,  Thomas Caulfield ,  Gilles Doerflinger ,  Jean-Louis Mergny ,  Abdelazize Laoui ,  Odile Petitgenet ,  Emmanuelle Renou

发明人： Patrick Mailliet ,  Jean-François Riou ,  Marcel Alasia ,  Thomas Caulfield ,  Gilles Doerflinger ,  Jean-Louis Mergny ,  Abdelazize Laoui ,  Odile Petitgenet ,  Emmanuelle Renou

IPC分类号： A61K31/53 ,  A61P35/00 ,  C07D401/12 ,  C07D401/14 ,  C07D453/02 ,  C07D213/02 ,  C07D215/38 ,  C07D251/48

CPC分类号： C07D401/12 ,  A61K31/53 ,  C07D401/14 ,  C07D453/02

摘要： The present invention relates to cancer therapy and to novel anticancer agents having a mechanism of action which inhibits telomerase. It also relates to novel chemical compounds as well as their therapeutic application in humans.

摘要翻译： 本发明涉及癌症治疗和具有抑制端粒酶的作用机制的新型抗癌剂。 它还涉及新型化合物以及它们在人体中的治疗应用。