High power radiation emitter device and heat dissipating package for electronic components
    3.
    发明授权
    High power radiation emitter device and heat dissipating package for electronic components 失效
    用于电子元件的大功率辐射发射器件和散热封装

    公开(公告)号:US07075112B2

    公开(公告)日:2006-07-11

    申请号:US10470879

    申请日:2002-01-31

    IPC分类号: H01L27/15 H01L31/12 H01L33/00

    摘要: The electronic component package (10) of the present invention includes a sealed chamber; a liquid or gel (20) contained in the sealed chamber; at least one electronic component (12) disposed in the sealed chamber in physical and thermal contact with the liquid or gel (20); and at least one electrical conductor electrically coupled to the electronic component and extending out of the sealed chamber. The electronic component(s) (12) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.

    摘要翻译: 本发明的电子部件封装(10)包括密封室; 包含在密封室中的液体或凝胶(20); 设置在所述密封室中的与所述液体或凝胶(20)物理和热接触的至少一个电子部件(12); 以及电耦合到电子部件并延伸出密封室的至少一个电导体。 电子部件(12)可以包括辐射发射器,热或光学传感器,电阻器和微处理器或其他半导体部件中的任何一个或其组合。

    High power radiation emitter device and heat dissipating package for electronic components
    9.
    发明授权
    High power radiation emitter device and heat dissipating package for electronic components 有权
    用于电子元件的大功率辐射发射器件和散热封装

    公开(公告)号:US07489031B2

    公开(公告)日:2009-02-10

    申请号:US11426761

    申请日:2006-06-27

    IPC分类号: H01L23/22

    摘要: The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at least one electrical conductor electrically coupled to the electronic component and extending out of the sealed chamber. The electronic component(s) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.

    摘要翻译: 本发明的电子部件封装包括:密封室; 包含在密封室中的液体或凝胶; 设置在所述密封室中的至少一个电子部件与所述液体或凝胶物理和热接触; 以及电耦合到电子部件并延伸出密封室的至少一个电导体。 电子部件可以包括辐射发射器,热或光学传感器,电阻器和微处理器或其它半导体部件中的任何一个或组合。