公开(公告)号：US20050195585A1

公开(公告)日：2005-09-08

申请号：US10790747

申请日：2004-03-03

申请人： John Lauffer ,  Voya Markovich ,  Corey Seastrand ,  David Thomas

发明人： John Lauffer ,  Voya Markovich ,  Corey Seastrand ,  David Thomas

IPC分类号： H01K3/10 ,  H01L23/552 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC分类号： H01L23/552 ,  H01L23/3128 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K3/4688 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  H01L2224/05599

摘要： A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. An electrical assembly including the circuitized substrate as part thereof and a method of making the circuitized substrate are also included. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.

摘要翻译： 其中其中使用的至少一个信号线被一对相对定位的接地线屏蔽的电路化基板，所述接地线又电耦合到位于信号和接地线下方的接地平面，并通过共同的中间介质层与其分离。 包括作为其一部分的电路化基板的电气组件和制造电路化基板的方法也包括在内。 衬底可以形成较大结构的一部分，例如PCB，芯片载体等。

公开(公告)号：US20060200977A1

公开(公告)日：2006-09-14

申请号：US11429990

申请日：2006-05-09

申请人： John Lauffer ,  Voya Markovich ,  Corey Seastrand ,  David Thomas

发明人： John Lauffer ,  Voya Markovich ,  Corey Seastrand ,  David Thomas

IPC分类号： H05K1/11

CPC分类号： H01L23/552 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K2201/0715 ,  H05K2201/09236 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.

公开(公告)号：US20070089290A1

公开(公告)日：2007-04-26

申请号：US11634287

申请日：2006-12-06

申请人： John Lauffer ,  Voya Markovich ,  James McNamara ,  David Thomas

发明人： John Lauffer ,  Voya Markovich ,  James McNamara ,  David Thomas

IPC分类号： H05K3/36 ,  H05K3/20

CPC分类号： H05K1/0216 ,  H05K1/0228 ,  H05K2201/09236 ,  H05K2201/09672 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.

摘要翻译： 一种制造印刷电路板的方法，其中所述基板包括在其相对侧上具有电介质层的公共电源平面和每个所述电介质层上的信号层，每个信号层包括基本相似的多条基本上平行的信号线 跨越所述信号层的方向。 一个信号层中的信号线的预定部分相对于并且平行于另一个信号层中的相应的信号线，而功率平面位于这些部分之间。 在两层中的选定信号线之间提供通孔连接，这些连接通过电源平面中的间隙而发生，从而与其隔离。

公开(公告)号：US20060022310A1

公开(公告)日：2006-02-02

申请号：US10900386

申请日：2004-07-28

申请人： Frank Egitto ,  John Lauffer ,  How Lin ,  Voya Markovich ,  David Thomas

发明人： Frank Egitto ,  John Lauffer ,  How Lin ,  Voya Markovich ,  David Thomas

IPC分类号： H01L23/58

CPC分类号： G11C5/06 ,  B82Y10/00 ,  G02B6/43 ,  H01L23/48 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/181 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

摘要翻译： 一种电气组件，其包括由其上具有第一导电图案的有机电介质材料构成的电路化衬底。 电介质层和图案的至少一部分形成有机存储器件的第一基底部分，其余部分是形成在图案部分上的第二聚合物层和形成在聚合物层上的第二导电电路。 如果形成在第二导电电路上的第二电介质层和第一电路图案以包围有机存储器件。 该器件通过第二介电层电耦合到第一电气部件，并且该第一电气部件电耦合到第二电气部件。 还提供了制造电气组件的方法，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

公开(公告)号：US20060022303A1

公开(公告)日：2006-02-02

申请号：US10900385

申请日：2004-07-28

申请人： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

发明人： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

IPC分类号： H01L29/00 ,  H01L21/00

CPC分类号： G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

摘要： A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

摘要翻译： 一种电路化衬底，由至少一层具有导电图案的电介质材料构成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。 衬底优选地与其它介电电路分层组件组合以形成多层衬底，在多层衬底上，可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其上以与之组合工作。 还提供了能够使用基板的电气组件，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

公开(公告)号：US20070249089A1

公开(公告)日：2007-10-25

申请号：US11808596

申请日：2007-06-12

申请人： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

发明人： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

IPC分类号： H01L51/40

CPC分类号： G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

摘要： A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.

摘要翻译： 一种制造电路化衬底的方法，所述电路化衬底由其上具有导电图案的至少一种电介质材料组成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。

公开(公告)号：US20050133257A1

公开(公告)日：2005-06-23

申请号：US10740398

申请日：2003-12-22

申请人： John Lauffer ,  Voya Markovich ,  James McNamara ,  David Thomas

发明人： John Lauffer ,  Voya Markovich ,  James McNamara ,  David Thomas

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/42

CPC分类号： H05K1/0216 ,  H05K1/0228 ,  H05K2201/09236 ,  H05K2201/09672 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.

摘要翻译： 一种印刷电路板及其制造方法，其中所述板包括在其相对侧上具有电介质层的公共电源平面和每个所述电介质层上的信号层，每个信号层包括多条基本上平行的信号线， 基本相似的方向跨越所述信号层。 一个信号层中的信号线的预定部分相对于并且平行于另一个信号层中的相应的信号线，而功率平面位于这些部分之间。 在两层中的选定信号线之间提供通孔连接，这些连接通过电源平面中的间隙而发生，从而与其隔离。

公开(公告)号：US20070166944A1

公开(公告)日：2007-07-19

申请号：US11324432

申请日：2006-01-04

申请人： Robert Japp ,  John Lauffer ,  Voya Markovich ,  William Wilson

发明人： Robert Japp ,  John Lauffer ,  Voya Markovich ,  William Wilson

IPC分类号： H01L21/20

CPC分类号： H05K3/4641 ,  H05K3/429 ,  H05K2203/068

摘要： A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.

摘要翻译： 一种制造电路化基板的方法和使用其的电气组件，其中基板由至少两个亚复合材料构成，其中这些亚复合材料中的至少一个的介电材料在粘合（例如，层压）期间被加热到 另一个足以使电介质材料流入并基本上填充用于接合结构的导电层中的开口。 导电通孔形成在接合结构内，以耦合所选择的结构导电层。 通过将一个或多个电气部件（例如，半导体芯片或芯片载体）定位在最终结构上并将其电耦合到结构的外部电路，可以形成电组件。

公开(公告)号：US20070010065A1

公开(公告)日：2007-01-11

申请号：US11352279

申请日：2006-02-13

申请人： Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

发明人： Rabindra Das ,  John Lauffer ,  How Lin ,  Voya Markovich

IPC分类号： H01L21/20 ,  H01L21/44

CPC分类号： H05K1/162 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/013 ,  H05K2203/0568

摘要： A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.

摘要翻译： 一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成 至少两个电容器作为衬底的内部元件。 电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。 还提供了一种制造包括这种基板的信息处理系统的方法。

公开(公告)号：US20060154434A1

公开(公告)日：2006-07-13

申请号：US11172794

申请日：2005-07-05

申请人： Rabindra Das ,  John Lauffer ,  Voya Markovich ,  James Matthews

发明人： Rabindra Das ,  John Lauffer ,  Voya Markovich ,  James Matthews

IPC分类号： H01L21/20 ,  H01L21/44

CPC分类号： H05K1/162 ,  H05K3/4611 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2203/0207

摘要： A method of forming a capacitive substrate in which first and second conductors are formed opposite a dielectric, with one of these electrically coupled to a thru-hole connection. Each functions as an electrode for the resulting capacitor. The substrate is then adapted for being incorporated within a larger structure to form a circuitized substrate such as a printed circuit board or a chip carrier. Additional capacitors are also possible.

摘要翻译： 一种形成电容基板的方法，其中第一和第二导体与电介质相对地形成，其中一个电气基板电耦合到通孔连接。 每个都用作所得电容器的电极。 然后将衬底适用于并入更大的结构中以形成诸如印刷电路板或芯片载体的电路化衬底。 附加的电容器也是可能的。