公开(公告)号：US06848173B2

公开(公告)日：2005-02-01

申请号：US09766814

申请日：2001-01-22

申请人： Joseph Fjelstad ,  Masud Beroz ,  John W. Smith ,  Belgacem Haba

发明人： Joseph Fjelstad ,  Masud Beroz ,  John W. Smith ,  Belgacem Haba

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01R43/02 ,  H05K3/34

CPC分类号： H01L24/29 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/83138 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/8393 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2224/8593 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a pre-selected displacement relative to one another so as to deform the bonding wires. A flowable dielectric material may be introduced between the first and second elements and around the bonding wires during or after the moving step. The flowable material may be cured to form an encapsulant around at least a portion of the bonding wires.

摘要翻译： 一种制造微电子组件的方法包括将第一元件（例如具有导电引线的电介质片）与其上接触的第二元件（例如半导体芯片）并置，将第一元件上的导电引线接合到触点上 在第二元件上，使得细长的接合线在导电引线和触点之间延伸。 在引线接合步骤之后，第一和第二元件相对于彼此移动通过预先选择的位移，以使接合线变形。 可移动介电材料可以在移动步骤期间或之后在第一和第二元件之间以及接合线周围引入。 可流动材料可以固化以形成围绕至少一部分接合线的密封剂。

公开(公告)号：US06965158B2

公开(公告)日：2005-11-15

申请号：US10167169

申请日：2002-06-11

申请人： John W. Smith ,  Belgacem Haba

发明人： John W. Smith ,  Belgacem Haba

IPC分类号： H01L21/44 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/462 ,  H01L23/49811 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0289 ,  H05K3/4084 ,  H05K3/4092 ,  H05K3/4614 ,  H05K2201/0397 ,  H05K2203/1327 ,  H01L2224/0401

摘要： Multi-layer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and can be selectively connected to provide customization of the structure.

摘要翻译： 诸如电路板的多层部件通过使用引线延伸穿过中间介电层来连接导电特征（诸如迹线一个两个或更多个叠置的基板）来制造。 引线可以紧密间隔以提供高密度垂直互连，并且可以选择性地连接以提供结构的定制。

公开(公告)号：US06429112B1

公开(公告)日：2002-08-06

申请号：US09271688

申请日：1999-03-18

申请人： John W. Smith ,  Belgacem Haba

发明人： John W. Smith ,  Belgacem Haba

IPC分类号： H01L2144

CPC分类号： H05K3/462 ,  H01L23/49811 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0289 ,  H05K3/4084 ,  H05K3/4092 ,  H05K3/4614 ,  H05K2201/0397 ,  H05K2203/1327 ,  H01L2224/0401

摘要： Multilayer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and can be selectively connected to provide customization of the structure.

摘要翻译： 诸如电路板的多层部件通过使用引线延伸通过中间介电层来连接导电特征（例如，迹线，一个两个或更多个叠置的基板）来制造。 引线可以紧密间隔以提供高密度垂直互连，并且可以选择性地连接以提供结构的定制。

公开(公告)号：US06921713B2

公开(公告)日：2005-07-26

申请号：US10685361

申请日：2003-10-14

申请人： John W. Smith ,  Belgacem Haba

发明人： John W. Smith ,  Belgacem Haba

IPC分类号： H01L23/498 ,  H01L21/44

CPC分类号： H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous closely-spaced interconnections. The assembly is provided with terminals movable with respect to the active element and interconnect element. The interconnect element desirably provides low-impedance conductive paths interconnecting active electronic devices within the active element.

摘要翻译： 活性微电子元件如半导体芯片或晶片与具有基本上相同的热膨胀系数的互连元件结合，该互连元件使用小的刚性键，希望通过固相键合技术制成， 间隔互连。 组件设置有可相对于有源元件和互连元件移动的端子。 互连元件期望地提供将有源电子器件互连在有源元件内的低阻抗导电路径。

公开(公告)号：US06828668B2

公开(公告)日：2004-12-07

申请号：US10290010

申请日：2002-11-07

申请人： John W. Smith ,  Belgacem Haba

发明人： John W. Smith ,  Belgacem Haba

IPC分类号： H01L2348

CPC分类号： H01L23/49811 ,  H01L21/6835 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

摘要： An interconnect component comprises a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through the compliant layer. The first ends extend generally parallel to said first surface.

摘要翻译： 互连部件包括具有第一表面的柔性层和具有第一端并延伸穿过柔性层的多个导电引线。 第一端部大致平行于所述第一表面延伸。

公开(公告)号：US06664621B2

公开(公告)日：2003-12-16

申请号：US09850973

申请日：2001-05-08

申请人： John W. Smith ,  Belgacem Haba

发明人： John W. Smith ,  Belgacem Haba

IPC分类号： H01L2352

CPC分类号： H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous closely-spaced interconnections. The assembly is provided with terminals movable with respect to the active element and interconnect element. The interconnect element desirably provides low-impedance conductive paths interconnecting active electronic devices within the active element.

公开(公告)号：US06489674B2

公开(公告)日：2002-12-03

申请号：US09923712

申请日：2001-08-07

申请人： Belgacem Haba ,  John W. Smith

发明人： Belgacem Haba ,  John W. Smith

IPC分类号： H01L2348

CPC分类号： H01L24/80 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A method of connecting a substrate to a semiconductor chip and component therefor to allow for the packaging of a chip even after successive die shrinks. The method compensates for successive die shrinks by providing a substrate that has connection sections of electrical leads that are releasable and/or be displaceable from a surface of the substrate as a result of a force from a bonding tool on the connection sections through at least one substrate aperture. A contact bearing surface of a semiconductor chip may then be aligned with the substrate so that the connection sections are in general alignment with the chip contacts. The connection sections may then be displaced and bonded to respective chip contacts. Other methods may be used to ensure that the chip, after die shrink, fits within the same package such as aligning the chip asymmetrically with the substrate and designing the location and dimensions of the substrate apertures so that the connection sections can be in alignment with the chip contacts.

摘要翻译： 将基板连接到半导体芯片及其部件的方法，即使在连续的模具收缩之后也能够对芯片进行封装。 该方法通过提供一种衬底，该衬底具有电引线的连接部分，这是由于通过至少一个连接部分上的接合工具的力而可释放的和/或可从衬底的表面移位的 基板孔径。 然后可以将半导体芯片的接触支承表面与衬底对准，使得连接部分与芯片触头大致对齐。 然后可以将连接部分移位并结合到相应的芯片触点。 可以使用其他方法来确保芯片在收缩之后装配在相同的封装内，例如使芯片与衬底不对称地对准并设计衬底孔的位置和尺寸，使得连接部分可以与 芯片接触。

公开(公告)号：US06300231B1

公开(公告)日：2001-10-09

申请号：US09322217

申请日：1999-05-28

申请人： Belgacem Haba ,  John W. Smith

发明人： Belgacem Haba ,  John W. Smith

IPC分类号： H01L2144

CPC分类号： H01L24/80 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A method of connecting a substrate to a semiconductor chip and component therefor to allow for the packaging of a chip even after successive die shrinks. The method compensates for successive die shrinks by providing a substrate that has connection sections of electrical leads that are releasable and/or be displaceable from a surface of the substrate as a result of a force from a bonding tool on the connection sections through at least one substrate aperture. A contact bearing surface of a semiconductor chip may then be aligned with the substrate so that the connection sections are in general alignment with the chip contacts. The connection sections may then be displaced and bonded to respective chip contacts. Other methods may be used to ensure that the chip, after die shrink, fits within the same package such as aligning the chip asymmetrically with the substrate and designing the location and dimensions of the substrate apertures so that the connection sections can be in alignment with the chip contacts.

摘要翻译： 将基板连接到半导体芯片及其部件的方法，即使在连续的模具收缩之后也能够对芯片进行封装。 该方法通过提供一种衬底，该衬底具有电引线的连接部分，这是由于通过至少一个连接部分上的接合工具的力而可释放的和/或可从衬底的表面移位的 基板孔径。 然后可以将半导体芯片的接触支承表面与衬底对准，使得连接部分与芯片触头大致对齐。 然后可以将连接部分移位并结合到相应的芯片触点。 可以使用其他方法来确保芯片在收缩之后装配在相同的封装内，例如使芯片与衬底不对称地对准并设计衬底孔的位置和尺寸，使得连接部分可以与 芯片接触。

公开(公告)号：US06117694A

公开(公告)日：2000-09-12

申请号：US267058

申请日：1999-03-12

申请人： John W. Smith ,  Belgacem Haba

发明人： John W. Smith ,  Belgacem Haba

IPC分类号： H01L21/302 ,  H01R9/09

CPC分类号： H01L24/72 ,  H01L23/4985 ,  H01L2924/12042

摘要： A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporary support which is removed after the bending operation and after injecting and curing a dielectric material to form a dielectric layer surrounding and supporting the leads.

摘要翻译： 通过在一对元件之间连接多个引线并使元件彼此远离地移动以便将引线朝向垂直广泛的布置弯曲来制造诸如连接器或封装半导体器件的微电子部件。 元件中的一个包括在弯曲操作之后被移除并且在注入和固化电介质材料以形成围绕和支撑引线的电介质层之后的临时支撑件。

公开(公告)号：US07067742B2

公开(公告)日：2006-06-27

申请号：US10033988

申请日：2001-12-28

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.