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    LAUNDRY TREATING APPARATUS
    1.
    发明申请
    LAUNDRY TREATING APPARATUS 有权
    洗衣处理设备

    公开(公告)号：US20110225857A1

    公开(公告)日：2011-09-22

    申请号：US13039747

    申请日：2011-03-03

    申请人： Jong Seok KIM ,  Sung Min KIM ,  Dae Yun PARK ,  Sog Kie HONG

    发明人： Jong Seok KIM ,  Sung Min KIM ,  Dae Yun PARK ,  Sog Kie HONG

    IPC分类号： D06F87/00

    CPC分类号： D06F58/12

    摘要： The present invention relates to a laundry treating apparatus which can make easy drying, deodorizing, crumple removal and sterilization of clothes, characterized in that laundry treating apparatus is provided with a hanger bar for receiving clothes hangers of different shapes.

    摘要翻译： 本发明涉及一种衣物处理装置，其能够容易地进行衣物的干燥，除臭，去除和消毒，其特征在于，衣物处理装置设置有用于接收不同形状的衣架的衣架条。

    SHOES INCLUDING ARCH PAD
    2.
    发明申请
    SHOES INCLUDING ARCH PAD 有权

    公开(公告)号：US20210227925A1

    公开(公告)日：2021-07-29

    申请号：US17054501

    申请日：2019-10-10

    申请人： Sung Min KIM

    发明人： Sung Min KIM

    IPC分类号： A43B7/14

    摘要： The present invention may provide shoes comprising an arch pad, the shoes comprising: an arch pad provided with a block seating groove that is formed in an area corresponding to the arch part of a foot; and an arch block positioned on the block seating groove and formed convexly so as to protrude from the upper surface of the arch pad such that the upper surface of the arch block pressurizes the arch part of the foot. The arch block comprises: a base portion fixed to the block seating groove; and a deformation portion which can be attached to/detached from the base portion such that the position in which the deformation portion pressurizes the arch part can be adjusted according to the position in which the deformation portion is installed on the base portion.

    PROBE AND APPARATUS FOR MEASURING THICKNESS OF OXIDE LAYER OF FUEL ROD
    3.
    发明申请
    PROBE AND APPARATUS FOR MEASURING THICKNESS OF OXIDE LAYER OF FUEL ROD 有权
    用于测量燃料氧化层厚度的探头和装置

    公开(公告)号：US20130010911A1

    公开(公告)日：2013-01-10

    申请号：US13335197

    申请日：2011-12-22

    申请人： Jung Cheol SHIN ,  Sang Kyun WOO ,  Yong Chan KIM ,  Sung Min KIM ,  Chae Joon LIM

    发明人： Jung Cheol SHIN ,  Sang Kyun WOO ,  Yong Chan KIM ,  Sung Min KIM ,  Chae Joon LIM

    IPC分类号： G21C17/06

    CPC分类号： G21C17/06

    摘要： Provided are a probe and an apparatus for measuring a thickness of an oxide layer of a fuel rod, capable of testing claddings of inner and outer fuel rods of a nuclear fuel assembly without disassembling the nuclear fuel assembly. The probe includes a fuel rod transfer region on which an eddy current sensor capable of continuously testing claddings of outer fuel rods of a fixed nuclear fuel assembly is mounted. Further, the apparatus includes a frame in which a cylinder driven in upward and downward directions is mounted, a first probe connected to one side of the cylinder in order to test claddings of outer fuel rods of a nuclear fuel assembly, and a second probe connected to the other side of the cylinder in order to test claddings of inner fuel rods of the nuclear fuel assembly.

    摘要翻译： 提供了一种用于测量燃料棒的氧化物层的厚度的探针和装置，其能够在不拆卸核燃料组件的情况下测试核燃料组件的内燃料棒和外燃料棒的包层。 探头包括燃料棒传送区域，在该燃料棒传送区域上安装能够连续测试固定核燃料组件的外部燃料棒的包层的涡流传感器。 此外，该装置包括：框架，其中安装有沿上下方向驱动的气缸;第一探头，其连接到气缸的一侧，以测试核燃料组件的外部燃料棒的包层;以及第二探针， 到筒体的另一侧，以便测试核燃料组件的内燃料棒的包层。

    IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME 有权
    图像传感器模块及其制造方法

    公开(公告)号：US20110159630A1

    公开(公告)日：2011-06-30

    申请号：US13042684

    申请日：2011-03-08

    申请人： Sung Min KIM

    发明人： Sung Min KIM

    IPC分类号： H01L31/18

    CPC分类号： H01L27/14618 ,  H01L27/14687 ,  H01L2224/13

    摘要： An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electrically connected to the photodiode units. A connecting region is formed around the peripheral region. Re-distribution layers are electrically connected to respective pads and extend to the connecting region. A transparent substrate covers the photodiode units and the pads and exposes at least a portion of the re-distribution layers. Connecting layers are electrically connected to the respective re-distribution layers and extend to a top surface of the transparent substrate. Connecting members are connected to the respective connecting layers disposed on the top surface of the transparent substrate.

    摘要翻译： 图像传感器模块包括半导体芯片。 光电二极管单元设置在半导体芯片的有源区域中，以将光转换为电信号。 垫片设置在围绕有源区域形成的周边区域中，并且焊盘电连接到光电二极管单元。 围绕周边区域形成连接区域。 再分布层电连接到相应的焊盘并延伸到连接区域。 透明基板覆盖光电二极管单元和焊盘并暴露至少一部分再分布层。 连接层电连接到相应的再分布层并延伸到透明基底的顶表面。 连接构件连接到设置在透明基板的顶表面上的各个连接层。

    Semiconductor Devices Including Active Patterns Having Different Pitches and Methods of Fabricating the Same
    6.
    发明申请
    Semiconductor Devices Including Active Patterns Having Different Pitches and Methods of Fabricating the Same 有权
    包括具有不同间距的主动模式的半导体器件及其制造方法

    公开(公告)号：US20160211168A1

    公开(公告)日：2016-07-21

    申请号：US15000425

    申请日：2016-01-19

    申请人： Sunhom Steve PAAK ,  Sung Min KIM

    发明人： Sunhom Steve PAAK ,  Sung Min KIM

    IPC分类号： H01L21/762 ,  H01L21/02 ,  H01L21/027 ,  H01L29/66 ,  H01L21/308

    CPC分类号： H01L29/6656 ,  H01L21/3086 ,  H01L21/76232 ,  H01L27/1104 ,  H01L27/11524 ,  H01L27/11536

    摘要： Methods for fabricating semiconductor devices are provided including sequentially stacking hardmask layers, a first sacrificial layer, and a second sacrificial layer on a substrate, forming first mandrels on the first sacrificial layer by etching the second sacrificial layer, forming first spacers on side walls of the first mandrels, forming a photoresist pattern disposed outside a region from which the first mandrels have been removed, forming second and third mandrels by etching the first sacrificial layer using the first spacers and the photoresist pattern as respective etching masks, forming second and third spacers on side walls of the second and third mandrels, forming first and second active patterns respectively having first and second pitches by etching the hardmask layer and at least a portion of the substrate, and forming a device isolation layer so that upper portions of the first and second active patterns protrude therefrom.

    摘要翻译： 提供了制造半导体器件的方法，包括在衬底上顺序堆叠硬掩模层，第一牺牲层和第二牺牲层，通过蚀刻第二牺牲层在第一牺牲层上形成第一心轴，在第二牺牲层的侧壁上形成第一间隔物 第一心轴，形成设置在从其中去除第一心轴的区域之外的光致抗蚀剂图案，通过使用第一间隔物和光致抗蚀剂图案蚀刻第一牺牲层形成第二和第三心轴作为各自的蚀刻掩模，在第 第二和第三心轴的侧壁，通过蚀刻硬掩模层和至少一部分基底形成分别具有第一和第二间距的第一和第二有源图案，并且形成器件隔离层，使得第一和第二心轴的上部 活动图案突出。

    SEMICONDUCTOR PACKAGE HAVING THROUGH ELECTRODES THAT REDUCE LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    SEMICONDUCTOR PACKAGE HAVING THROUGH ELECTRODES THAT REDUCE LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME 有权
    具有降低泄漏电流的电极的半导体封装及其制造方法

    公开(公告)号：US20120045895A1

    公开(公告)日：2012-02-23

    申请号：US13286376

    申请日：2011-11-01

    申请人： Seung Hee JO ,  Sung Cheol KIM ,  Sung Min KIM

    发明人： Seung Hee JO ,  Sung Cheol KIM ,  Sung Min KIM

    IPC分类号： H01L21/283

    CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/3128 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311

    摘要： A stacked semiconductor package having through electrodes that exhibit a reduced leakage current and a method of making the same are presented. The stacked semiconductor package includes a semiconductor chip, through-holes, and a current leakage prevention layer. The semiconductor chip has opposing first and second surfaces. The through-holes pass entirely through the semiconductor chip and are exposed at the first and second surfaces. A polarized part is formed on at least one of the first and second surfaces of the semiconductor chip. The through-electrodes are disposed within the through-holes. The current leakage prevention layer covers the polarized part and exposes ends of the through-electrodes.

    摘要翻译： 本发明提供一种具有通过电极显示泄漏电流减小的叠层半导体封装及其制造方法。 叠层半导体封装包括半导体芯片，通孔和防止漏电流层。 半导体芯片具有相对的第一和第二表面。 通孔完全穿过半导体芯片，并在第一和第二表面露出。 偏振部分形成在半导体芯片的第一和第二表面中的至少一个上。 通孔设置在通孔内。 电流防漏层覆盖极化部分并暴露通孔的端部。

    SEMICONDUCTOR PACKAGE HAVING THROUGH ELECTRODES THAT REDUCE LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    SEMICONDUCTOR PACKAGE HAVING THROUGH ELECTRODES THAT REDUCE LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    具有降低泄漏电流的电极的半导体封装及其制造方法

    公开(公告)号：US20110031609A1

    公开(公告)日：2011-02-10

    申请号：US12640102

    申请日：2009-12-17

    申请人： Seung Hee JO ,  Sung Cheol KIM ,  Sung Min KIM

    发明人： Seung Hee JO ,  Sung Cheol KIM ,  Sung Min KIM

    IPC分类号： H01L23/52 ,  H01L21/44

    CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/3128 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311

    摘要： A stacked semiconductor package having through electrodes that exhibit a reduced leakage current and a method of making the same are presented. The stacked semiconductor package includes a semiconductor chip, through-holes, and a current leakage prevention layer. The semiconductor chip has opposing first and second surfaces. The through-holes pass entirely through the semiconductor chip and are exposed at the first and second surfaces. A polarized part is formed on at least one of the first and second surfaces of the semiconductor chip. The through-electrodes are disposed within the through-holes. The current leakage prevention layer covers the polarized part and exposes ends of the through-electrodes.

    摘要翻译： 本发明提供一种具有通过电极显示泄漏电流减小的叠层半导体封装及其制造方法。 叠层半导体封装包括半导体芯片，通孔和防止漏电流层。 半导体芯片具有相对的第一和第二表面。 通孔完全穿过半导体芯片，并在第一和第二表面露出。 偏振部分形成在半导体芯片的第一和第二表面中的至少一个上。 通孔设置在通孔内。 电流防漏层覆盖极化部分并暴露通孔的端部。