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公开(公告)号：US07989929B2
公开(公告)日：2011-08-02
申请号：US11930217
申请日：2007-10-31
IPC分类号： H01L23/48
CPC分类号： H05K1/147 , H01L23/49805 , H01L24/16 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0228 , H05K1/0237 , H05K3/222 , H05K2201/10356 , H05K2201/10378 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.
摘要翻译： 一种直接连接信号系统，包括印刷电路板和布置在印刷电路板上的第一和第二集成电路封装。 多个电信号导体在悬挂在印刷电路板上的第一和第二集成电路封装之间延伸。
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2.发明授权Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths 有权直接连接集成电路信号系统，用于旁路基板内印刷电路信号路径公开(公告)号：US07307293B2
公开(公告)日：2007-12-11
申请号：US10426930
申请日：2003-04-29
IPC分类号： H01L31/0336 , H05K3/22 , H05K1/00 , H01R12/00
CPC分类号： H05K1/147 , H01L23/49805 , H01L24/16 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0228 , H05K1/0237 , H05K3/222 , H05K2201/10356 , H05K2201/10378 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.
摘要翻译： 一种直接连接信号系统，包括印刷电路板和布置在印刷电路板上的第一和第二集成电路封装。 多个电信号导体在悬挂在印刷电路板上的第一和第二集成电路封装之间延伸。
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公开(公告)号：US20090108416A1
公开(公告)日：2009-04-30
申请号：US11930217
申请日：2007-10-31
IPC分类号： H01L23/48
CPC分类号： H05K1/147 , H01L23/49805 , H01L24/16 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0228 , H05K1/0237 , H05K3/222 , H05K2201/10356 , H05K2201/10378 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.
摘要翻译： 一种直接连接信号系统，包括印刷电路板和布置在印刷电路板上的第一和第二集成电路封装。 多个电信号导体在悬挂在印刷电路板上的第一和第二集成电路封装之间延伸。
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公开(公告)号：US20110065332A1
公开(公告)日：2011-03-17
申请号：US12953171
申请日：2010-11-23
CPC分类号： H01R12/714 , H01R12/52 , H01R12/7082 , H01R13/24 , H01R13/6599
摘要： An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
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公开(公告)号：US20090027137A1
公开(公告)日：2009-01-29
申请号：US12128620
申请日：2008-05-29
IPC分类号： H03H7/38
CPC分类号： H05K1/0243 , G01R31/2822 , H01L23/13 , H01L23/49822 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2223/6633 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/49175 , H01L2924/00014 , H01L2924/14 , H01L2924/15173 , H01L2924/1903 , H01L2924/19039 , H01L2924/3011 , H01L2924/3025 , H01P3/08 , H01P5/028 , H05K1/024 , H05K2201/0191 , H05K2201/09154 , H05K2201/09727 , Y10S438/981 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
摘要翻译： 公开了锥形电介质和导体结构，其提供受控的阻抗互连，同时信号导体线从更细的间距转换到较粗的间距，从而消除通常与电路接触间距的变化相关的电中断。 还公开了用于构造装置和应用的方法。
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公开(公告)号：US08598696B2
公开(公告)日：2013-12-03
申请号：US13044194
申请日：2011-03-09
IPC分类号： H01L23/52
CPC分类号： H01L24/85 , H01L21/56 , H01L23/3107 , H01L23/49517 , H01L23/49537 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/32245
摘要： An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
摘要翻译： 具有多个表面的IC封装，用于与互连元件互连，从IC芯片连接到位于其多于一个表面上的封装组件的I / O端子，并且与空间上分离的其它器件或组件互连。
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公开(公告)号：US08324727B2
公开(公告)日：2012-12-04
申请号：US12720110
申请日：2010-03-09
申请人： Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , William F. Wiedemann , Thomas J. Obenhuber , Inessa Obenhuber, legal representative
发明人： Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , William F. Wiedemann , Thomas J. Obenhuber
IPC分类号： H01L23/34
CPC分类号： H01C7/003 , H01C13/02 , H01G4/33 , H01L23/49816 , H01L23/49822 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48235 , H01L2224/49109 , H01L2924/00014 , H01L2924/01078 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K1/0231 , H05K1/0233 , H05K1/0234 , H05K1/0246 , H05K1/186 , H05K3/4602 , H05K2201/09536 , H05K2201/10643 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
摘要翻译： 公开了适用于在电子互连衬底内，互连衬底和电子部件之间或IC封装内的垂直互连模式下放置和使用的薄型离散电子部件结构。
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公开(公告)号：US20110215475A1
公开(公告)日：2011-09-08
申请号：US13044194
申请日：2011-03-09
申请人： Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Inessa Obenhuber , Kevin P. Grundy
发明人： Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Inessa Obenhuber , Kevin P. Grundy
IPC分类号： H01L23/532
CPC分类号： H01L24/85 , H01L21/56 , H01L23/3107 , H01L23/49517 , H01L23/49537 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/32245
摘要： An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
摘要翻译： 具有多个表面的IC封装，用于与互连元件互连，从IC芯片连接到位于其多于一个表面上的封装组件的I / O端子，并且与空间上分离的其它器件或组件互连。
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9.发明申请公开(公告)号：US20110171857A1
公开(公告)日：2011-07-14
申请号：US13052831
申请日：2011-03-21
IPC分类号： H01R13/46
CPC分类号： H01R12/714 , H01R12/52 , H01R12/7082 , H01R13/24 , H01R13/6599
摘要： An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
摘要翻译： 电连接器。 一种电连接器，包括具有第一通道的连接器主体和在第一末端部分中延伸穿过第一通道的第一导电元件。 第一末端部分具有第一力矩臂，当被迫与第一导电表面接触时，扭转第一导电元件以产生扭转力。 扭转力保持第一末端部分与第一导电表面接触。
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10.发明申请High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for their Manufacture 有权高速，直通，阶梯式，电子连接器，具有改进的信号完整性特性及其制造方法公开(公告)号：US20100151704A1
公开(公告)日：2010-06-17
申请号：US12693097
申请日：2010-01-25
IPC分类号： H01R12/00
CPC分类号： H05K1/117 , H01R12/523 , H01R12/62 , H01R12/716 , H01R13/24 , H01R13/6587 , H05K1/142 , H05K3/366 , H05K3/368 , H05K2201/09063 , H05K2201/09445 , H05K2201/09472 , H05K2201/09709 , H05K2201/09845 , H05K2201/10189 , H05K2203/167
摘要： An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
摘要翻译： 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。
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