公开(公告)号：US08316908B2

公开(公告)日：2012-11-27

申请号：US12997042

申请日：2009-06-16

申请人： Kenji Ujiie ,  Yoshiki Katada ,  Koji Tamai ,  Chikao Nakashima

发明人： Kenji Ujiie ,  Yoshiki Katada ,  Koji Tamai ,  Chikao Nakashima

IPC分类号： B29C65/00

CPC分类号： B60J1/00 ,  B32B17/10036 ,  B32B17/10761 ,  B32B17/10816 ,  Y10T156/1741

摘要： [Object] When press-bonding superposed curved glass plates together by a plurality of curved rolls, even if curvature of the curved glass changes, a preliminary bonding method and device of a laminated glass can cope with a variety of curvatures of the curved glass plate by an easy adjustment.[Means to solve] The preliminary bonding device of the laminated glass has a pair of arcuately-curved rigid fixed shafts, each of which has an arc shape at a middle portion thereof and a linear shape at both ends thereof, a pair of curved rolls, each of which is formed from a covering roll member of a flexible resin layer that covers whole outermost circumferential surfaces of a plurality of short rigid cylindrical members that are provided at an outer circumference of the fixed shaft and are able to rotate through bearings, a roll driving means which drives and rotates the covering roll member of the curved roll, a curvature direction adjusting means that can adjust an angle of a direction of a curved convex portion of the arcuate fixed shaft, and a roll pressing means which sandwiches and presses the glass plates between the curved rolls. By adjusting rotation of the fixed shafts of the pair of upper and lower curved rolls by means of the curvature direction adjusting means, the preliminary bonding device can bond the glass plates of the laminated glass plate from a flat glass plate to a curved glass plate by sandwiching and pressing the glass plates.

摘要翻译： 当通过多个弯曲辊将叠加的弯曲玻璃板压合在一起时，即使弯曲玻璃的曲率发生变化，夹层玻璃的预粘合方法和装置可以应对弯曲玻璃板的各种曲率 通过一个容易的调整。 [解决方案]夹层玻璃的预粘合装置具有一对弧形的刚性固定轴，其中间部分具有弧形，两端具有直线形状，一对弯曲辊 其每一个由柔性树脂层的覆盖辊构件形成，所述覆盖辊构件覆盖设置在固定轴的外周并且能够通过轴承旋转的多个短刚性圆柱形构件的整个最外周表面， 滚动驱动装置，其驱动并旋转弯曲辊的覆盖辊构件;曲率方向调节装置，其可以调节弓形固定轴的弯曲凸部的方向的角度;以及辊压装置，其夹持并按压 弯曲辊之间的玻璃板。 通过利用曲率方向调节装置来调整上下一对弯曲辊的固定轴的旋转，预粘接装置可以将平板玻璃板的玻璃板从平板玻璃板接合到弯曲的玻璃板上 夹住并按压玻璃板。

公开(公告)号：US20120073417A1

公开(公告)日：2012-03-29

申请号：US13376786

申请日：2010-06-02

申请人： Kenji Ujiie ,  Koji Tamai ,  Chikao Nakashima

发明人： Kenji Ujiie ,  Koji Tamai ,  Chikao Nakashima

IPC分类号： B26D7/32 ,  B26D7/01 ,  B26D7/20 ,  B26D1/45

CPC分类号： B26D7/018 ,  B26D7/0006 ,  B26D7/20 ,  B26F1/3813 ,  Y10T83/04 ,  Y10T83/0453 ,  Y10T83/2066 ,  Y10T83/75

摘要： [Task] A sheet material is cut in a predetermined closed loop shape.[Means for solving task]A cutting apparatus for a sheet material, comprises: an air table which is capable of ejecting or sucking air through a plurality of minute punching sections thereof; a template having at least one recess groove section in a predetermined closed loop shape mounted and fixed onto the air table and a punching section located at each of positions on the template which is coincident with a position of each of the punching sections of the air table; a cutter blade disposed on an upper position of the sheet material mounted on the template to cut the sheet material along the recess groove section of the template; and cutter blade driving means which is capable of moving and rotating the cutter blade in X, Y, and Z coordinate axes.

摘要翻译： [任务]以预定的闭环形状切割片材。 [解决任务的手段]一种用于片材的切割装置，包括：能够通过其多个微小冲压部排出或吸入空气的空气台; 模板，其具有安装并固定在空气台上的预定闭环形状的至少一个凹槽部分和位于模板上的每个位置处的冲孔部分，其与空气台的每个冲压部分的位置重合 ; 切割刀片，设置在安装在模板上的片材的上部位置，以沿着模板的凹槽部分切割片材; 以及能够使刀片在X，Y，Z坐标轴上移动和旋转的刀片驱动装置。

公开(公告)号：US20110100530A1

公开(公告)日：2011-05-05

申请号：US12997042

申请日：2009-06-16

申请人： Kenji Ujiie ,  Yoshiki Katada ,  Koji Tamai ,  Chikao Nakashima

发明人： Kenji Ujiie ,  Yoshiki Katada ,  Koji Tamai ,  Chikao Nakashima

IPC分类号： B32B17/00 ,  B32B37/10

CPC分类号： B60J1/00 ,  B32B17/10036 ,  B32B17/10761 ,  B32B17/10816 ,  Y10T156/1741

摘要： [Object] When press-bonding superposed curved glass plates together by a plurality of curved rolls, even if curvature of the curved glass changes, a preliminary bonding method and device of a laminated glass can cope with a variety of curvatures of the curved glass plate by an easy adjustment.[Means to Solve] The preliminary bonding device of the laminated glass has a pair of arcuately-curved rigid fixed shafts, each of which has an arc shape at a middle portion thereof and a linear shape at both ends thereof, a pair of curved rolls, each of which is formed from a covering roll member of a flexible resin layer that covers whole outermost circumferential surfaces of a plurality of short rigid cylindrical members that are provided at an outer circumference of the fixed shaft and are able to rotate through bearings, a roll driving means which drives and rotates the covering roll member of the curved roll, a curvature direction adjusting means that can adjust an angle of a direction of a curved convex portion of the arcuate fixed shaft, and a roll pressing means which sandwiches and presses the glass plates between the curved rolls. By adjusting rotation of the fixed shafts of the pair of upper and lower curved rolls by means of the curvature direction adjusting means, the preliminary bonding device can bond the glass plates of the laminated glass plate from a flat glass plate to a curved glass plate by sandwiching and pressing the glass plates.

摘要翻译： 当通过多个弯曲辊将叠加的弯曲玻璃板压合在一起时，即使弯曲玻璃的曲率发生变化，夹层玻璃的预粘合方法和装置可以应对弯曲玻璃板的各种曲率 通过一个容易的调整。 [解决手段]夹层玻璃的预粘合装置具有一对弧形的刚性固定轴，其中间部分具有圆弧状，其两端呈直线状，一对弯曲辊 其每一个由柔性树脂层的覆盖辊构件形成，所述覆盖辊构件覆盖设置在固定轴的外周并且能够通过轴承旋转的多个短刚性圆柱形构件的整个最外周表面， 滚动驱动装置，其驱动并旋转弯曲辊的覆盖辊构件;曲率方向调节装置，其可以调节弓形固定轴的弯曲凸部的方向的角度;以及辊压装置，其夹持并按压 弯曲辊之间的玻璃板。 通过利用曲率方向调节装置来调整上下一对弯曲辊的固定轴的旋转，预粘接装置可以将平板玻璃板的玻璃板从平板玻璃板接合到弯曲的玻璃板上 夹住并按压玻璃板。

公开(公告)号：US06770547B1

公开(公告)日：2004-08-03

申请号：US09698186

申请日：2000-10-30

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L2120

CPC分类号： H01L23/3157 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device.

摘要翻译： 一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子 绝缘层并与半导体器件的电极电连接。

公开(公告)号：US07497096B2

公开(公告)日：2009-03-03

申请号：US10792573

申请日：2004-03-04

申请人： Osamu Asai ,  Yoshiki Katada ,  Kenji Ujiie

发明人： Osamu Asai ,  Yoshiki Katada ,  Kenji Ujiie

IPC分类号： C03B13/16 ,  C03B13/00 ,  B65G13/00 ,  B65G21/10 ,  B65G41/00 ,  C03B23/033

CPC分类号： C03B35/189 ,  C03B35/165 ,  C03B35/166 ,  C03B35/187

摘要： An apparatus for conveying a curved glass sheet includes a disk roll conveyor and a roll conveyor set positioned downstream of the disk roll conveyor. The roll conveyor set has a plurality of roll conveyor units. In this apparatus, first and second adjusting devices are operable to provide the curved glass sheet with (a) a first conveyance route in which the disk roll conveyor and the roll conveyor set are in a horizontal position to provide a smooth horizontal conveyance surface or (b) a second conveyance route in which the disk roll conveyor is in a downward position and in which at least one roll conveyor unit at a downstream side of the roll conveyor set is in an upward position to provide a continuous concave conveyance surface.

摘要翻译： 用于输送弯曲玻璃板的设备包括盘辊式输送机和位于盘式辊式输送机下游的辊式输送机组。 辊式输送机组具有多个辊式输送机单元。 在该装置中，第一调节装置和第二调节装置可操作以向弯曲的玻璃板提供（a）第一输送路径，其中盘辊式输送机和辊式输送机组处于水平位置以提供平滑的水平输送表面或（ b）第二输送路径，其中盘辊式输送机处于向下位置，并且其中在辊式输送机组的下游侧的至少一个辊式输送单元处于向上位置以提供连续的凹形输送表面。

公开(公告)号：US07371606B2

公开(公告)日：2008-05-13

申请号：US11012156

申请日：2004-12-16

申请人： Kenji Ujiie ,  Bunji Kuratomi

发明人： Kenji Ujiie ,  Bunji Kuratomi

IPC分类号： H01L21/66 ,  H01L21/00 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

摘要： The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts mounting surface of a substrate matrix through bump electrodes are to be sealed all together with a sealing resin in a reduced state of the internal pressure of a cavity of a molding apparatus, a clamping pressure at the time of clamping the substrate matrix by both a lower die and an upper die of a molding die is set at a relatively low pressure in an initial stage of injection of the sealing resin and is changed to a relatively high pressure when the sealing resin has covered the semiconductor chip ICs located in a final stage in the resin injecting direction.

摘要翻译： 提高采用倒装芯片安装方法的半导体器件的密封工艺的成品率。 在通过突起电极安装在基板矩阵的零件安装表面上的多个半导体芯片IC将与密封树脂一起密封在模制装置的空腔的内部压力的状态下的模制过程中，夹紧 在密封树脂的注入的初始阶段中，通过模具的下模和上模将夹持基板矩阵的压力设定在相对低的压力，并且当密封 树脂已经覆盖了位于树脂注入方向的最后阶段的半导体芯片IC。

公开(公告)号：US07057283B2

公开(公告)日：2006-06-06

申请号：US10825436

申请日：2004-04-16

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/3157 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing particles, and an external connection terminal formed on the electrically insulating layer and electrically connected with an electrode of the semiconductor device. The electrically insulating layer is formed with a thickness so as to provide α-ray shielding of the semiconductor device.

摘要翻译： 一种半导体装置，其中可以在没有任何底部填充的情况下进行倒装芯片接合，并且其包括半导体器件，通过掩模印刷含有颗粒的电绝缘材料在半导体器件上形成的电绝缘层，以及形成在电学上的外部连接端子 绝缘层并与半导体器件的电极电连接。 电绝缘层形成为具有提供半导体器件的α射线屏蔽的厚度。

公开(公告)号：US06867502B2

公开(公告)日：2005-03-15

申请号：US10369764

申请日：2003-02-21

申请人： Mitsuaki Katagiri ,  Masami Usami ,  Kenji Ujiie

发明人： Mitsuaki Katagiri ,  Masami Usami ,  Kenji Ujiie

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/56 ,  H01L21/82 ,  H01L21/822 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L27/04 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/50 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/49822 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/0508 ,  H01L2224/05085 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/00

摘要： A flip-chip BGA is disclosed which exhibits an excellent high-speed electric transmission characteristic while minimizing the formation of voids in sealing resin filled between a semiconductor chip and a wiring substrate. A silicon chip is flip-chip-mounted on a package substrate, and in a central area of a main surface of the silicon chip are arranged a power supply circuit, an input/output circuit, and plural bonding pads, while in the other area than the central area are arranged solder bumps in a matrix form, the solder bumps being electrically connected to the bonding pads through Cu wiring. Of the solder bumps, solder bumps for input/output power supply and solder bumps for the input and output of a data signal are arranged in a first area adjacent to the central area, and solder bumps for address signal input are arranged in a second area located outside the first area.

摘要翻译： 公开了一种倒装芯片BGA，其显示出极好的高速电气传输特性，同时最小化填充在半导体芯片和布线基板之间的密封树脂中的空隙的形成。 将硅芯片倒装芯片安装在封装基板上，在硅芯片的主表面的中心区域配置有电源电路，输入输出电路和多个接合焊盘，而在其他区域 比中心区域以矩阵形式布置焊料凸块，焊料凸块通过Cu布线电连接到接合焊盘。 在焊料凸块中，用于输入/输出电源的焊料凸块和用于数据信号的输入和输出的焊料凸块布置在与中心区域相邻的第一区域中，并且用于地址信号输入的焊料凸块布置在第二区域 位于第一区外。

公开(公告)号：US06822317B1

公开(公告)日：2004-11-23

申请号：US09698168

申请日：2000-10-30

申请人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

发明人： Kosuke Inoue ,  Hiroyuki Tenmei ,  Yoshihide Yamaguchi ,  Noriyuki Oroku ,  Hiroshi Hozoji ,  Shigeharu Tsunoda ,  Madoka Minagawa ,  Naoya Kanda ,  Ichiro Anjo ,  Asao Nishimura ,  Akira Yajima ,  Kenji Ujiie

IPC分类号： H01L23495

CPC分类号： H01L23/3114 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3157 ,  H01L2224/05001 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01034

摘要： A semiconductor apparatus comprising a semiconductor device, an electrically insulating layer formed on the semiconductor device, and an external connection terminal formed on the electrically insulating layer and electrically connected to an electrode of the semiconductor device, wherein a power/ground line and a signal line in a region of from an edge of the electrically insulating layer to a uniform-thickness flat portion of the electrically insulating layer are different in kind of wiring pattern from each other.

摘要翻译： 一种半导体器件，包括半导体器件，形成在半导体器件上的电绝缘层和形成在电绝缘层上并与半导体器件的电极电连接的外部连接端子，其中电源/接地线和信号线 在从电绝缘层的边缘到电绝缘层的均匀厚度平坦部分的区域中，布线图案的种类不同。

公开(公告)号：US06661093B2

公开(公告)日：2003-12-09

申请号：US09988684

申请日：2001-11-20

申请人： Kenji Ujiie ,  Kenichi Yamamoto ,  Junichi Arita

发明人： Kenji Ujiie ,  Kenichi Yamamoto ,  Junichi Arita

IPC分类号： H01L2348

CPC分类号： H01L24/16 ,  H01L23/3107 ,  H01L23/53228 ,  H01L23/556 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/45 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48

摘要： For preventing &agr;-rays induced soft errors in a semiconductor device in which solder bumps are connected with Cu wirings formed on Al wirings, bump lands connected with solder bumps and Cu wirings connected integrally therewith are constituted of a stacked film of a Cu film and an Ni film formed thereon, the thickness of the stacked film is larger than the thickness of the photosensitive polyimide resin film, the thickness of the inorganic passivation film, the thickness of the third Al wiring layer and the bonding pad and the thickness of the second interlayer insulative film formed below the Cu wirings and the bump land, that is, the bump land being constituted with such a thickness as larger than any of the thickness for the insulation material and the wiring material interposed between the MISFET (n-channel MISFET and p-channel MISFET) constituting the memory cell and the bump land.

摘要翻译： 为了防止在焊料凸块与形成在Al布线上的Cu布线连接的半导体器件中的α射线引起的软错误，与焊料凸块连接的凸起焊盘和与其一体连接的Cu布线由Cu膜和 形成在其上的Ni膜，层叠膜的厚度大于光敏聚酰亚胺树脂膜的厚度，无机钝化膜的厚度，第三Al布线层和接合焊盘的厚度以及第二夹层的厚度 形成在Cu配线和凸块焊盘之下的绝缘膜，即，凸起焊盘的面积大于绝缘材料的厚度以及布置在MISFET（n沟道MISFET和p 沟道MISFET）构成存储单元和凸起区域。