摘要:
A slip ring apparatus includes a pair of slip rings electrically insulated from each other and disposed coaxially, a pair of electric conductive elements for providing electric connection between the pair of slip rings and a field coil of an automotive alternator, and an insulating member for holding the pair of slip rings and the pair of electric conductive elements. The electric conductive elements have at least one deformation absorbing portion for absorbing a deformation of the electric conductive elements.
摘要:
A receiving device is provided capable of avoiding reception of unnecessary energy when a signal waveform actually changes on a receiving side. An impedance control circuit includes a sensing unit to sense one or more of a voltage, current, or power of a signal to be received by a receiving circuit. The impedance control unit varies an input impedance according to the change in the sensed one or more quantities so that the received signal will be reflected. Thus the excess energy of the signal is reflected and fed to any other receiving circuit achieving stable communications.
摘要:
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.
摘要:
A communication system comprises the network, plural nodes, and a reducer. The network comprises a main line and a plurality of branch lines branched from the main line respectively, the main line and each of the branch lines being respectively formed into a differential two-wire type of communication line consisting of a first communion line and a second communication line. The plural nodes are connected to two or more branch lines of the branch lines to communicate frames of data among the branches with each other. The reducer is arranged to each node to reduce either an impedance of each of the first and second communication lines or an impedance between the first and second communication lines during a specified period of time starting at a time instant when a node completes sending out the frames of data to be transmitted.
摘要:
A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.
摘要:
A game apparatus functioning as a stereo enhancement apparatus includes a CPU, and the CPU generates sound signals of stereo sounds required for the game. The CPU adjusts volumes of stereo sounds simultaneously played from respective sound sources on the basis of pan of the respective sound sources, and mixes the plurality of stereo sounds whose volumes have been adjusted to generate a stereo sound of two channels. Next, the stereo sound including an L channel sound signal (Lin) and an R channel sound signal (Rin) that have been mixed is divided into two systems, and then, a stereo enhancement signal (Lin−Rin) is generated. Then, the stereo enhancement signal is delayed, an added signal obtained by adding the delayed stereo enhancement signal to the Lin is generated, and a subtracted signal obtained by subtracting the delayed stereo enhancement signal from the Rin is generated. Then, the added signal is output from a speaker for L channel, and the subtracted signal is output from a speaker for R channel.
摘要:
A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要:
A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
摘要:
An imaging device capable of displaying an outline of a moving picture as a still picture is realized. Further, reproduction of a moving picture that is started from any desired scene by using an index picture can be realized. When VD index pictures displayed on a browser screen are selected, a corresponding index representative still picture is displayed. Therefore, a moving picture such as a moving picture of a quick motion whose contents cannot be easily grasped only by the VD index picture, can be easily recognized with the addition of the corresponding index representative still picture. By selecting the VD index pictures displayed on the browser screen, display of the corresponding moving picture is started from a portion corresponding to the selected VD index picture.
摘要:
A soldered product having secure reliable joints, without the use of flux, is disclosed. The soldered product includes a first member having a connected portion and a second member, also having a connected portion, facing the first member. The connected portions of the first and second members are electrically connected by a connecting material. A layer of hydrocarbon, including alkane, alkene or alkyne, is disposed around the periphery of the connecting material.