摘要:
In a radar target position detecting apparatus, beams (, for example, light beams) irradiated from a transmitter(, for example, LED) have a predetermined divergence angle, a plurality of light (beam) receiving elements such as photodiode arrays each having a different receiving angle (directivity) are arranged in an array form, and a direction of a reflected wave (beam) is identified according to a position of the arrayed beam (wave) receiving elements in the array at which the reflected wave (beam) is captured.
摘要:
The present invention-provides a tunnel-injection device which encompasses, a reception layer made of a first semiconductor, a barrier-forming layer made of a second semiconductor having a bandgap-narrower than the first semiconductor, being in metallurgical contact with the reception layer, a gate insulating film disposed on the barrier-forming layer. The gate electrode controls the width of the barrier generated at the heterojunction interface between the reception layer and the barrier-forming layer so as to change the tunneling probability of carriers through the barrier. The device further encompasses a carrier receiving region being contact with the reception layer and a carrier-supplying region being contact with the barrier-forming layer.
摘要:
A semiconductor device having a surge input detecting circuit is provided with the driving circuit for, for example, reversible motor. To prevent MOS power transistors constituting the power driving circuit from their destructive breakdowns (failures), when the surge input detecting circuit block detects the surge voltage input through the driving circuit which exceeds a predetermined voltage, namely, a maximum rated power supply voltage of the power driving circuit, the surge input detecting circuit outputs the signal to turn the MOS power transistors in off-states. These circuit elements are integrally mounted on a semiconductor chip. The surge input detecting circuit block detects such a surge input through a power supply terminal in terms of either of its voltage, its current, or the temperature rise in the semiconductor chip. The breakdown voltage per power transistor can be half the maximum rated power supply voltage. In addition, the surge input detecting circuit block and these power MOS transistors are fabricated into the same semiconductor chip.
摘要:
A power MOSFET is provided with a protective circuit including a monitor MOSFET whose drain is connected with the drain of the power MOSFET, a monitor resistor connected betwen the sources of the power and monitor MOSFETs, and a monitor transistor for decreasing a gate voltage of the power MOSFET when a voltage across the monitor resistor exceeds a predetermined level representing a dangerous condition of the device.
摘要:
A semiconductor device in which the breakdown voltages of the cell unit and the guard ring can easily be matched, and the surge endurance of the device can be improved. This semiconductor device includes a guard ring region surrounding the cell diffusion layers which is formed from an array of a plurality of guard ring cells, where each of the guard ring cells is identical to each of the cell diffusion layers and the guard ring cells are electrically connected mutually, so that the diffusion depths of each of the cells of the guard ring region and the cell diffusion layers are identical, and consequently the breakdown voltages for the guard ring region and the cell diffusion layers can be made equal to each other.
摘要:
A vertical power MOS transistor, in which a gate oxide film is formed over partial areas of a semiconductor substrate having a first conductivity type, which functions as a drain, a channel region having a second conductivity type formed in the substrate, and a source region having the first conductivity type, formed in the channel region, and a gate electrode is formed on the gate oxide film, in which an insulating film covers the gate electrode, and a source electrode is formed on the insulating film, and in which an ohmic contact electrode is formed on portions of a source region an a channel region, and a coupling member connects the ohmic contact electrode with the source electrode to separate the source electrode from the gate electrode edge portion.
摘要:
A lateral double-diffused MOSFET has a semiconductor substrate, a drain region formed on the substrate, a gate insulation film formed on the drain region, a gate electrode formed on the gate insulation film, source and drain openings formed through the gate electrode, a first conductive region formed under the drain region, a source electrode formed on the source openings, a drain electrode formed on the drain openings, and second conductive regions for connecting the drain electrode to the first conductive region. The source and drain openings are cyclically arranged so that at least two rows of source openings are arranged between adjacent drain openings, to reduce the ON resistance of the MOSFET.
摘要:
A method of manufacturing semiconductor devices by forming a U-shaped insulated gate on a substrate, etching the substrate to expose a sidewall of the U-shaped insulated gate, covering the exposed part with a masking material, forming the sidewall of the masking material only adjoining to the exposed U-shaped insulated gate, etching the substrate vertically to form a groove, forming a semiconductor region on the groove and burying a metal into the groove.
摘要:
A vertical MOSFET device has a first conductivity type substrate layer serving as a drain, a second conductivity type channel region extending into said substrate layer from a top surface, and a first conductivity type source region extending into the channel region from the top surface. The channel region has a peripheral subregion extending deeply into the substrate layer from the top surface under an insulated gate electrode, and a shallow central subregion shallower than the peripheral subregion. There is further provided a second conductivity type underlying layer formed under the shallow central subregion so as to form a voltage regulating diode with the channel region at a position shallower than the bottom of the peripheral subregion.
摘要:
Vertical MOS and another component such as CMOS are made in a single semiconductor substrate having a highly doped underlying layer and a lightly doped epitaxial surface layer of a first conductivity type. The vertical MOS includes a channel region of a second conductivity type, formed in the surface layer, and a source region of the first conductivity type, formed in the channel region. The channel region is made deep and joined with the highly doped underlying layer to form a first Zener diode for regulating a drain-source voltage. A drain electrode is formed on the bottom surface of the substrate and connected to a power supply, and a topside source electrode is connected to a load. The vertical MOS is surrounded, and separated from the CMOS, by a grounded guard ring region of the second conductivity type, formed in the surface layer. The guard ring region is also made deep and joined with the underlying layer.