公开(公告)号：US5976916A

公开(公告)日：1999-11-02

申请号：US737137

申请日：1996-11-07

申请人： Makoto Kuwamura ,  Kazuhiro Ikemura ,  Shinya Akizuki ,  Takashi Fukushima ,  Shinichiro Sudo ,  Satoshi Ito

发明人： Makoto Kuwamura ,  Kazuhiro Ikemura ,  Shinya Akizuki ,  Takashi Fukushima ,  Shinichiro Sudo ,  Satoshi Ito

IPC分类号： H01L21/54 ,  H01L23/13 ,  H01L23/24 ,  H01L21/56

CPC分类号： H01L23/13 ,  H01L21/54 ,  H01L23/24 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181

摘要： A method of production of a semiconductor device such as a plastic pin grid array (PPGA) and a plastic ball grid array (PBGA) having a cavity-fill form. In this method, first, a semiconductor element (3) is placed in a cavity (6) formed in a multiple step-like substrate (2). Under this state, a pellet (7), which is in a solid state at a normal temperature, made of an encapsulating resin composition containing specific components, and has specific characteristics, is placed on the semiconductor element (3). Next, the semiconductor device is heated so that the pellet can melt to fill the cavity (6) with the composition, thereby encapsulating the semiconductor device (3). According to the present invention, a semiconductor device having low stress performance and excellent moisture-proof reliability can be efficiently produced.

摘要翻译： PCT No.PCT / JP96 / 00523 Sec。 371日期：1996年11月7日 102（e）1996年11月7日PCT PCT 1996年3月5日PCT公布。 第WO96 / 27900号公报 日期1996年9月12日制造具有空穴填充形式的诸如塑料针栅格阵列（PPGA）和塑料球栅阵列（PBGA）的半导体器件的制造方法。 在该方法中，首先，将半导体元件（3）放置在形成于多台阶状基板（2）中的空腔（6）中。 在这种状态下，在半导体元件（3）上放置由常规温度为固态的由具有特定成分的包封树脂组合物形成的具有特定特性的颗粒（7）。 接下来，加热半导体器件，使得颗粒可以熔化以用组合物填充空腔（6），从而封装半导体器件（3）。 根据本发明，可以有效地制造具有低应力性能和优异的防湿可靠性的半导体器件。

公开(公告)号：US5565709A

公开(公告)日：1996-10-15

申请号：US551941

申请日：1995-11-02

申请人： Takashi Fukushima ,  Satoshi Ito ,  Makoto Kuwamura ,  Shinya Akizuki ,  Kazuhiro Ikemura ,  Shinichiro Sudo

发明人： Takashi Fukushima ,  Satoshi Ito ,  Makoto Kuwamura ,  Shinya Akizuki ,  Kazuhiro Ikemura ,  Shinichiro Sudo

IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L23/3128 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/181

摘要： A semiconductor device comprising a semiconductor element encapsulated with a cured resin having at least two secondary differential peaks of linear thermal expansion by a thermomechanical analytical measurement, the interval between the peaks being at least 20.degree. C. The semiconductor device encapsulated with the cured resin does not cause a warp and is excellent in the TCT test characteristics and the cracking resistance.

摘要翻译： 一种半导体器件，包括用固化树脂封装的半导体元件，所述固化树脂通过热机械分析测量具有至少两个线性热膨胀的二次微分峰，峰之间的间隔至少为20℃。用固化树脂封装的半导体器件 不引起翘曲，TCT试验特性和耐龟裂性优异。

公开(公告)号：US20050154152A1

公开(公告)日：2005-07-14

申请号：US11000905

申请日：2004-12-02

申请人： Eiji Toyoda ,  Takeshi Okada ,  Keisuke Yoshikawa ,  Takuya Eto ,  Kazuhiro Ikemura ,  Shinya Akizuki ,  Tsuyoshi Ishizaka ,  Takahiro Uchida ,  Kei Toyota

发明人： Eiji Toyoda ,  Takeshi Okada ,  Keisuke Yoshikawa ,  Takuya Eto ,  Kazuhiro Ikemura ,  Shinya Akizuki ,  Tsuyoshi Ishizaka ,  Takahiro Uchida ,  Kei Toyota

IPC分类号： C08G59/00 ,  C08G59/18 ,  C08G59/62 ,  C08G59/68 ,  C08L61/04 ,  C08L61/06 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08L61/00

CPC分类号： C08L61/06 ,  C08G59/621 ,  C08G59/688 ,  C08L61/04 ,  C08L63/00 ,  H01L23/293 ,  H01L2224/45144 ,  H01L2224/48091 ,  C08L2666/22 ,  C08L2666/16 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.

摘要翻译： 一种半导体封装用环氧树脂组合物的制造方法，其不产生空穴生成等，可靠性优异。 一种半导体封装用环氧树脂组合物的制造方法，其含有以下成分（A）〜（C）：（A）环氧树脂，（B）酚醛树脂，（C）硬化促进剂， 预先在1.333〜66.65kPa的减压下和100〜230℃的加热条件下预先含有成分（A）〜（C）的成分中除了成分（A）以外的成分的全部或一部分 然后将组分（A）和其余组分与所得混合物混合。

公开(公告)号：US07268191B2

公开(公告)日：2007-09-11

申请号：US11000905

申请日：2004-12-02

申请人： Eiji Toyoda ,  Takeshi Okada ,  Keisuke Yoshikawa ,  Takuya Eto ,  Kazuhiro Ikemura ,  Shinya Akizuki ,  Tsuyoshi Ishizaka ,  Takahiro Uchida ,  Kei Toyota

发明人： Eiji Toyoda ,  Takeshi Okada ,  Keisuke Yoshikawa ,  Takuya Eto ,  Kazuhiro Ikemura ,  Shinya Akizuki ,  Tsuyoshi Ishizaka ,  Takahiro Uchida ,  Kei Toyota

IPC分类号： C08L63/00 ,  C08L63/02 ,  C08L63/04 ,  H01L23/29

CPC分类号： C08L61/06 ,  C08G59/621 ,  C08G59/688 ,  C08L61/04 ,  C08L63/00 ,  H01L23/293 ,  H01L2224/45144 ,  H01L2224/48091 ,  C08L2666/22 ,  C08L2666/16 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.

摘要翻译： 一种半导体封装用环氧树脂组合物的制造方法，其不产生空穴生成等，可靠性优异。 一种半导体封装用环氧树脂组合物的制造方法，其含有以下成分（A）〜（C）：（A）环氧树脂，（B）酚醛树脂，（C）硬化促进剂， 预先在1.333〜66.65kPa的减压下和100〜230℃的加热条件下预先含有成分（A）〜（C）的成分中除了成分（A）以外的成分的全部或一部分 然后将组分（A）和其余组分与所得混合物混合。

公开(公告)号：US07265167B2

公开(公告)日：2007-09-04

申请号：US10703494

申请日：2003-11-10

申请人： Shinya Akizuki ,  Kazuhiro Ikemura ,  Hisataka Ito ,  Takahiro Uchida ,  Takuya Eto ,  Tsutomu Nishioka ,  Katsumi Shimada

发明人： Shinya Akizuki ,  Kazuhiro Ikemura ,  Hisataka Ito ,  Takahiro Uchida ,  Takuya Eto ,  Tsutomu Nishioka ,  Katsumi Shimada

IPC分类号： C08K3/36 ,  C08L63/00 ,  C08L63/02 ,  H01L23/29

CPC分类号： H01L23/295 ,  C08G59/621 ,  C08K3/04 ,  C08K3/36 ,  C08K9/02 ,  H01L2224/13 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

摘要翻译： 一种用于半导体封装的环氧树脂组合物，其能够提供即使在互连电极距离或导体线距离的间距减小中也不会引起短路的高可靠性的半导体器件以及使用该半导体器件的半导体器件。 用于半导体封装的环氧树脂组合物，其包含以下组分（A）至（C）：（A）环氧树脂，（B）酚醛树脂，和（C）用于防止半导体短路的无机填料 半导体封装的一个步骤。

公开(公告)号：US5294835A

公开(公告)日：1994-03-15

申请号：US920657

申请日：1992-07-28

申请人： Kazumasa Igarashi ,  Hideto Kimura ,  Megumu Nagasawa ,  Tsutomu Nishioka ,  Kazuhiro Ikemura ,  Hideyuki Usui ,  Michio Komoto ,  Haruo Tabata ,  Satoshi Ito

发明人： Kazumasa Igarashi ,  Hideto Kimura ,  Megumu Nagasawa ,  Tsutomu Nishioka ,  Kazuhiro Ikemura ,  Hideyuki Usui ,  Michio Komoto ,  Haruo Tabata ,  Satoshi Ito

IPC分类号： H01L23/29 ,  H01L23/28

CPC分类号： H01L23/296 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465

摘要： A semiconductor device in which a semiconductor chip is encapsulated in an epoxy resin composition comprising (A) an epoxy resin represented by formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents an alkyl group having from 1 to 4 carbon atoms, and (B) a reaction product obtained by preliminarily reacting a silane compound represented by formula (II): ##STR2## wherein X represents a monovalent organic group having at least one functional group selected from the group consisting of a glycidyl group, an amino group, and a mercapto group; Y represents an alkoxy group having from 1 to 4 carbon atoms; and n represents 0, 1 or 2, with a phenol aralkyl resin represented by formula (III) ##STR3## wherein m represents 0 or a positive integer. The epoxy resin composition has low moisture absorption and low stress to provide a semiconductor device excellent in thermal crack resistance and moisture resistance.

摘要翻译： 一种半导体器件，其中将半导体芯片封装在环氧树脂组合物中，其包含（A）由式（I）表示的环氧树脂：（*化学结构*）（I）其中R1，R2，R3和R4各自表示 具有1至4个碳原子的烷基，和（B）通过使由式（II）表示的硅烷化合物预先反应获得的反应产物：（*化学结构*）（II）其中X表示至少具有一个 一个选自缩水甘油基，氨基和巯基的官能团; Y表示具有1至4个碳原子的烷氧基; 和n表示0,1或2，与式（III）表示的酚芳烷基树脂（*化学结构*）（III）表示，其中m表示0或正整数。 环氧树脂组合物具有低吸湿性和低应力，以提供耐热裂纹性和耐湿性优异的半导体器件。

公开(公告)号：US07943427B2

公开(公告)日：2011-05-17

申请号：US11632131

申请日：2005-07-13

申请人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20305 ,  H01L2924/00012

摘要： A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheet 50 having a base layer 51 and an adhesive layer 52, and a plurality of independently provided electrically conductive portions 20. A semiconductor element having electrodes 11 formed thereon is firmly fixed onto the substrate B, and upper portions of the plurality of electrically conductive portions 20 and the electrodes 11 of the semiconductor element 10 are electrically connected by using wires 30. The semiconductor element 10, wires 30 and electrically conductive portions 20 are sealed by using a sealing resin 40. Each of the electrically conductive portions 20 has overhanging portions 20a, and a side face 60a of the electrically conductive portion 20 is roughened, thus enhancing the joining strength between each electrically conductive portion 20 and the sealing resin 40.

摘要翻译： 使用用于制造半导体器件的基板B，该基板包括具有基底层51和粘合层52的粘合片50以及多个独立设置的导电部分20.具有形成电极11的半导体元件 其上牢固地固定在基板B上，并且多个导电部分20的上部和半导体元件10的电极11通过使用导线30电连接。半导体元件10，导线30和导电部分20是 通过使用密封树脂40密封。每个导电部分20具有突出部分20a，并且导电部分20的侧面60a被粗糙化，从而增强每个导电部分20和密封树脂40之间的接合强度 。

公开(公告)号：US20080136048A1

公开(公告)日：2008-06-12

申请号：US11665967

申请日：2005-10-18

申请人： Takuya Eto ,  Kazuhiro Ikemura ,  Eiji Toyoda ,  Katsuyuki Nakabayashi ,  Daisuke Tsukahara

发明人： Takuya Eto ,  Kazuhiro Ikemura ,  Eiji Toyoda ,  Katsuyuki Nakabayashi ,  Daisuke Tsukahara

IPC分类号： H01L23/29 ,  C08G67/00 ,  C09K3/00

CPC分类号： C08G59/621 ,  C08L63/00 ,  H01L23/295 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

摘要： An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The epoxy resin composition for semiconductor encapsulation comprises the following components (A) to (D). Conductive foreign metallic particles having a size of 20 μM or more are substantially not contained in the aforementioned epoxy resin composition.(A) An epoxy resin.(B) A phenol resin.(C) A hardening accelerator.(D) An inorganic filler.

摘要翻译： 一种用于半导体封装的环氧树脂组合物，其不含有通过用于消除导电性异质金属颗粒的传统方法不能检测和消除的尺寸的导电异物金属颗粒。 用于半导体封装的环氧树脂组合物包括以下组分（A）至（D）。 在上述环氧树脂组合物中基本上不含有尺寸为20μm以上的导电性异质金属粒子。 （A）环氧树脂。 （B）酚醛树脂。 （C）硬化促进剂。 （D）无机填料。

公开(公告)号：US20070241445A1

公开(公告)日：2007-10-18

申请号：US11632348

申请日：2005-07-13

申请人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L21/568 ,  H01L21/4828 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/62 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： A semiconductor device P includes a die pad 20, a semiconductor element 30 which is loaded on the die pad 20, and a sealing resin 40. A plurality of electrically conductive portions 10 each having a layered structure including a metal foil 1 comprising copper or a copper alloy, and electrically conductive portion plating layers 2 provided at both upper and lower ends of the metal foil 1 are arranged around the die pad 20. The die pad 20 has a lower die pad plating layer 2b, and the semiconductor element 30 is loaded on the die pad 20 comprising such a die pad plating layer 2b. Electrodes 30a provided on the semiconductor element 30 are electrically connected with top ends of the electrically conductive portions 10 via wires 3, respectively. The lower electrically conductive portion plating layers 2 of the electrically conductive portions 10 and the die pad plating layer 2b of the die pad 20 are exposed outside from the sealing resin 40 on their back faces.

摘要翻译： 半导体器件P包括管芯焊盘20，负载在管芯焊盘20上的半导体元件30和密封树脂40。 每个具有包括铜或铜合金的金属箔1的层状结构的多个导电部分10和设置在金属箔1的上端和下端的导电部分镀层2围绕管芯焊盘20布置 。 管芯焊盘20具有下焊盘镀覆层2b，并且将半导体元件30装载在包括这种管芯焊盘镀层2b的管芯焊盘20上。 设置在半导体元件30上的电极30a分别经由导线3与导电部10的顶端电连接。 导电部分10的下部导电部分电镀层2和芯片焊盘20的芯片焊盘镀层2b在其背面从密封树脂40的外部露出。

公开(公告)号：US20050253286A1

公开(公告)日：2005-11-17

申请号：US11115307

申请日：2005-04-27

申请人： Keisuke Yoshikawa ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Kazuhiro Ikemura

发明人： Keisuke Yoshikawa ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Kazuhiro Ikemura

IPC分类号： C08G59/00 ,  C08G59/62 ,  C08G59/68 ,  C08L63/00 ,  C09J163/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L21/568 ,  C08G59/621 ,  C08G59/688 ,  C09J163/00 ,  H01L23/293 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/1073 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An epoxy resin composition for semiconductor encapsulation in producing surface mount lead-less thin semiconductor devices. The epoxy resin composition for surface mount lead-less semiconductor device encapsulation which device comprising an encapsulating resin layer and, encapsulated therein, a substrate, a semiconductor element mounted on the substrate, two or more conductive parts disposed around the semiconductor element, and wires which electrically connect electrodes of the semiconductor element to the conductive parts, wherein the bottom face of the substrate and the bottom face of each conductive part are exposed without being encapsulated in the encapsulating resin layer, and the epoxy resin composition used for forming the encapsulating resin layer has the following properties (α) and (β): (α) a melt viscosity of 2-10 Pa.s at 175° C.; and (β) a flexural strength of cured state of 130 MPa or higher at ordinary temperature.

摘要翻译： 一种用于半导体封装的环氧树脂组合物，用于生产表面安装无铅薄型半导体器件。 用于表面安装的无铅半导体器件封装的环氧树脂组合物，其包括封装树脂层，并且封装在其中的衬底，安装在衬底上的半导体元件，设置在半导体元件周围的两个或更多个导电部件，以及电线 将半导体元件的电极电连接到导电部分，其中基板的底面和每个导电部分的底面暴露而不被封装在封装树脂层中，并且用于形成封装树脂层的环氧树脂组合物 具有以下性质（α）和（β）：（α）在175℃下的熔体粘度为2-10Pa.s; 和（β）常温下固化状态的弯曲强度为130MPa以上。