公开(公告)号：US20090145648A1

公开(公告)日：2009-06-11

申请号：US12323672

申请日：2008-11-26

申请人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Shigeaki SUGANUMA ,  Naoyuki KOIZUMI ,  Fumimasa KATAGIRI

发明人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Shigeaki SUGANUMA ,  Naoyuki KOIZUMI ,  Fumimasa KATAGIRI

IPC分类号： H05K1/18 ,  H01R12/06 ,  B23K37/00

CPC分类号： B23K20/004 ,  B23K1/0016 ,  B23K2101/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/111 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/10287 ,  H01L2924/00012

摘要： A multilayer wiring board is so constituted that: a group of electronic part mounting capture pads are provided on one surface thereof; a first wiring layer formed on an uppermost layer thereof includes a first connection part arranged on the same surface as the surface where the pads are provided, and a second connection part spaced from the first connection part; the pad and the first connection part are electrically connected through a conductor wire, and the conductor wire is provided in a first insulating layer laminated on the first wiring layer; and the first connection part is connected linearly or curvedly to the second connection part through a first wiring pattern.

摘要翻译： 多层布线板的结构是：一组电子部件安装捕获垫设置在其一个表面上; 形成在其最上层的第一布线层包括布置在与设置有焊盘的表面相同的表面上的第一连接部分和与第一连接部分间隔开的第二连接部分; 所述焊盘和所述第一连接部分通过导线电连接，并且所述导线设置在层压在所述第一布线层上的第一绝缘层中; 并且第一连接部分通过第一布线图形线性地或弯曲地连接到第二连接部分。

公开(公告)号：US20090072370A1

公开(公告)日：2009-03-19

申请号：US12205057

申请日：2008-09-05

申请人： Michio HORIUCHI ,  Fumimasa KATAGIRI ,  Shigeaki SUGANUMA ,  Yasue TOKUTAKE ,  Jun YOSHIKE

发明人： Michio HORIUCHI ,  Fumimasa KATAGIRI ,  Shigeaki SUGANUMA ,  Yasue TOKUTAKE ,  Jun YOSHIKE

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49861 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2223/6611 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73204 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19051 ,  H01L2924/19107 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K3/222 ,  H05K3/4046 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2203/0733 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

摘要： There is provided a multilayer wiring substrate on which at least one semiconductor element is mounted. The multilayer wiring substrate includes: a baseboard; a first wiring layer formed on the baseboard and having a plurality of first wiring portions; an insulating layer formed on the baseboard; a second wiring layer formed on the insulating layer and having a plurality of second wiring portions, the second wiring portions being electrically connected to each other via a conductor wire, the conductor wire being arranged within the insulating layer three-dimensionally in a curved manner; and conductor portions configured to pass through the insulating layer and connecting the first wiring portions and the second wiring portions.

摘要翻译： 提供了一种其上安装有至少一个半导体元件的多层布线基板。 多层布线基板包括：基板; 形成在所述基板上并具有多个第一布线部的第一布线层; 形成在基板上的绝缘层; 形成在所述绝缘层上并且具有多个第二布线部的第二布线层，所述第二布线部经由导体布线彼此电连接，所述导线以三维方式弯曲地布置在所述绝缘层内; 以及导体部，被配置为穿过所述绝缘层并连接所述第一布线部和所述第二布线部。

公开(公告)号：US20110095433A1

公开(公告)日：2011-04-28

申请号：US12908943

申请日：2010-10-21

申请人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA ,  Tsuyoshi KOBAYASHI ,  Tatsuaki DENDA

发明人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA ,  Tsuyoshi KOBAYASHI ,  Tatsuaki DENDA

IPC分类号： H01L23/535 ,  H05K1/02 ,  H01L21/768 ,  B05D5/12

CPC分类号： H05K3/323 ,  H01L24/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0315 ,  H05K2203/1142 ,  H05K2203/1147 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

摘要： There is provided a method of manufacturing a conductive film. The method includes: (a) providing an anodized layer having a plurality of through holes extending therethrough in its thickness direction; (b) forming a plurality of linear conductors by filling each of the through holes with a conductive material; (c) forming protection layers on both surfaces of the anodized layer; (d) removing the anodized layer to form a plurality of gaps between the linear conductors; (e) forming an organic insulation layer between the protection layers to fill the gaps with the organic insulation layer; and (f) removing the protection layers.

摘要翻译： 提供了一种制造导电膜的方法。 该方法包括：（a）提供阳极氧化层，其具有在其厚度方向上延伸穿过其中的多个通孔; （b）通过用导电材料填充每个所述通孔来形成多个线性导体; （c）在阳极氧化层的两个表面上形成保护层; （d）去除所述阳极化层以在所述线状导体之间形成多个间隙; （e）在保护层之间形成有机绝缘层，以用有机绝缘层填充间隙; 和（f）去除保护层。

公开(公告)号：US20100307808A1

公开(公告)日：2010-12-09

申请号：US12792334

申请日：2010-06-02

申请人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA ,  Masao NAKAZAWA

发明人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA ,  Masao NAKAZAWA

IPC分类号： H05K1/11

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/0287 ,  H05K1/0306 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/09609 ,  H05K2201/09945 ,  H01L2924/00 ,  H01L2224/0401

摘要： A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors.

摘要翻译： 布线基板包括芯基板，该芯基板具有密封地设置在绝缘基材中的绝缘基材和大量丝状导体，并且在其厚度方向上刺穿绝缘基材。 由布线层部分构成的垫相对地设置在芯基板的两个表面上，并且以多个丝状导体的相对端电连接，使得焊盘共享丝状导体。 通过焊盘制造芯基板的一个表面侧和另一个表面侧之间的布线连接。 绝缘基材由无机电介质制成。 由布线层的一部分制成的垫片设置在芯基板的两个表面上，并且仅电连接到由多个丝状导体形成的不同组的相应一端侧。

公开(公告)号：US20120313245A1

公开(公告)日：2012-12-13

申请号：US13493123

申请日：2012-06-11

申请人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA

发明人： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA

IPC分类号： H01L23/52

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00

摘要： One embodiment provides a semiconductor device having: a core substrate having first and second surfaces and an accommodation hole penetrating therethrough; a semiconductor element accommodated in the accommodation hole so that a front surface thereof is on the first surface side; a first metal film formed on a back surface of the semiconductor element; a second metal film formed on the second surface of the core substrate; an insulating layer covering the first and second metal films; and a third metal film formed on the insulating layer, via parts thereof penetrating through the insulating layer to respectively reach the first and second metal films.

摘要翻译： 一个实施例提供一种半导体器件，其具有：具有第一和第二表面的芯基板和贯穿其中的容纳孔; 容纳在所述容纳孔中使得其前表面位于所述第一表面侧的半导体元件; 形成在所述半导体元件的背面上的第一金属膜; 形成在芯基板的第二表面上的第二金属膜; 覆盖第一和第二金属膜的绝缘层; 以及形成在所述绝缘层上的第三金属膜，经由其穿过所述绝缘层的部分分别到达所述第一和第二金属膜。