摘要:
It is to obtain a silica glass suitable as a material for an optical material constituting an optical system to be used for EUVL, which has a low coefficient of thermal expansion from 0 to 100° C., and on which formation of concave defects is suppressed in a polishing step to achieve a high level of flatness.A silica glass containing from 0.1 to 10 mass % of Sn calculated as SnO2 and from 3 to 10 mass % of Ti calculated as TiO2, which has a homogeneity of the coefficient of thermal expansion from 0 to 100° C. to the temperature of from 50 to 200 ppb/° C., a coefficient of thermal expansion from 0 to 100° C. of 0±250 ppb/° C., and a Vickers hardness of at most 650.
摘要:
It is to obtain a silica glass suitable as a material for an optical material constituting an optical system to be used for EUVL, which has a low coefficient of thermal expansion from 0 to 100° C., and on which formation of concave defects is suppressed in a polishing step to achieve a high level of flatness. A silica glass containing from 0.1 to 10 mass % of Sn calculated as SnO2 and from 3 to 10 mass % of Ti calculated as TiO2, which has a homogeneity of the coefficient of thermal expansion from 0 to 100° C. to the temperature of from 50 to 200 ppb/° C., a coefficient of thermal expansion from 0 to 100° C. of 0±250 ppb/° C., and a Vickers hardness of at most 650.
摘要:
To provide quartz-type glass for a microlithographic projection exposure apparatus, which contains at least 51 mass % of SiO2 and which further contains at least one member selected from the group consisting of lanthanum, aluminum, hafnium, nitrogen, scandium, yttrium and zirconium. It is a material which is useful for an illumination system for a microlithographic projection exposure apparatus or as a projection object lens and has a refractive index at 248 nm larger than 1.508 of quartz glass and a refractive index at 193 nm larger than 1.560 of quartz glass and which can be small-sized.
摘要:
The claimed invention relates to a process for producing an optical material for EUV lithography, wherein the optical material contains a silica glass having a TiO2 concentration of from 3 to 12 mass % and a hydrogen molecule content of less than 5×1017 molecules/cm3 in the glass. The process including coating a multilayer film on the silica glass by ion beam sputtering.
摘要翻译:所要求保护的发明涉及一种用于制造用于EUV光刻的光学材料的方法,其中所述光学材料包含玻璃中TiO 2浓度为3至12质量%且氢分子含量小于5×10 17分子/ cm 3的二氧化硅玻璃 。 该方法包括通过离子束溅射在二氧化硅玻璃上涂覆多层膜。
摘要:
Conventional TiO2—SiO2 glass contains hydrogen atoms substantially, and during deposition under ultrahigh vacuum condition, the hydrogen molecules will diffuse in the chamber, and H2 molecules will be taken into a film thereby formed. Hydrogen molecules will readily diffuse, and the optical characteristics of the multilayer film are likely to be thereby changed. In an optical material for EUV lithography, a multilayer film is coated by ion beam sputtering on a silica glass having a TiO2 concentration of from 3 to 12 mass % and a hydrogen molecule content of less than 5×1017 molecules/cm3 in the glass.
摘要:
A glass composition comprising from 45 to 66 wt % of SiO.sub.2, from 0 to 15 wt % of Al.sub.2 O.sub.3, from 10 to 24 wt % of Li.sub.2 O+Na.sub.2 O+K.sub.2 O, from 14 to 26 wt % of CaO+MgO+SrO+BaO+ZnO, and from 0 to 1 wt % of SO.sub.3 +Sb.sub.2 O.sub.3, said glass composition containing substantially no zirconia and having a strain point of at least 560.degree. C. and a linear thermal expansion coefficient of at least 80.times.10.sup.-7 /.degree.C. within a temperature range of from 50.degree. to 350.degree. C.
摘要翻译:包含45至66重量%的SiO 2,0至15重量%的Al 2 O 3,10至24重量%的Li 2 O + Na 2 O + K 2 O,14至26重量%的CaO + MgO + SrO + BaO + ZnO和0〜1重量%的SO 3 + Sb 2 O 3,所述玻璃组合物基本上不含氧化锆,应变点至少为560℃,线性热膨胀系数为至少80×10 -7 /℃ 温度范围为50〜350℃
摘要:
A glass composition comprising from 45 to 66 wt % of SiO.sub.2, from 0 to 15 wt % of Al.sub.2 O.sub.3, from 10 to 24 wt % of Li.sub.2 O+Na.sub.2 O+K.sub.2 O, from 14 to 26 wt % of CaO+MgO+SrO+BaO+ZnO, and from 0 to 1 wt % of SO.sub.3 +Sb.sub.2 O.sub.3, said glass composition containing substantially no zirconia and having a strain point of at least 560.degree. C. and a linear thermal expansion coefficient of at least 80.times.10.sup.-7 /.degree.C. within a temperature range of from 50.degree. to 350.degree. C.
摘要翻译:一种玻璃组合物,其包含45至66重量%的SiO 2,0至15重量%的Al 2 O 3,10至24重量%的Li 2 O + Na 2 O + K 2 O,14至26重量%的CaO + MgO + SrO + BaO + ZnO和0〜1重量%的SO 3 + Sb 2 O 3,所述玻璃组合物基本上不含氧化锆,应变点至少为560℃,线性热膨胀系数为至少80×10 -7 /℃ 温度范围为50〜350℃
摘要:
An optical amplifying glass comprising 100 parts by mass of a matrix glass and from 0.1 to 10 parts by mass of Er doped to the matrix glass, wherein the matrix glass comprises Bi2O3, at least one of B2O3 and SiO2, at least one member selected from the group consisting of Ga2O3, WO3 and TeO2, and La2O3 in such a ratio that Bi2O3 is from 20 to 80 mol %, B2O3+SiO2 is from 5 to 75 mol %, Ga2O3+WO3+TeO2 is from 0.1 to 35 mol %, and La2O3 is from 0.01 to 15 mol %.
摘要翻译:一种光学放大玻璃,其包含100质量份的基质玻璃和0.1〜10质量份的掺杂到基体玻璃中的铒,其中所述基质玻璃包含Bi 2 O 3,B 2 O 3和SiO 2中的至少一种,选自 由Ga2O3,WO3,TeO2组成的组和Bi2O3为20〜80mol%,B2O3 + SiO2的La2O3为5〜75mol%,Ga2O3 + WO3 + TeO2为0.1〜35mol% La 2 O 3为0.01〜15摩尔%。
摘要:
A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes heat spreaders, and electric terminals embedded therein. Each of the heat spreaders has a fin heat sink exposed to the flow of the coolant. The fin heat sink is welded to a surface of each of the heat spreaders through an insulator, thus minimizing an electrical leakage from the heat spreader to the coolant.
摘要:
To provide a process for producing a glass/resin composite having a sufficient transportability, handling efficiency and processability, even though the thickness of the glass is very thin, without impairing excellent properties of glass.A process for producing a glass/resin composite, which comprises forming molten glass into a glass ribbon and forming a resin layer on at least one surface of the glass ribbon is provided. The resin layer is preferably formed by bonding to a glass ribbon, applying a heat melt resin or applying a curable resin. Further, a process for producing a glass/resin composite, wherein a cut glass substrate is bonded on a continuously supplied resin film is provided.