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    VIA STACK STRUCTURES
    2.
    发明申请
    VIA STACK STRUCTURES 审中-公开
    通过堆叠结构

    公开(公告)号：US20080029898A1

    公开(公告)日：2008-02-07

    申请号：US11461511

    申请日：2006-08-01

    申请人： Mukta G. Farooq ,  Robert Hannon ,  Dae Young Jung ,  Ian D. Melville ,  Donna S. Zupanski-Nielsen

    发明人： Mukta G. Farooq ,  Robert Hannon ,  Dae Young Jung ,  Ian D. Melville ,  Donna S. Zupanski-Nielsen

    IPC分类号： H01L23/48

    CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Via stack structures are disclosed. In one embodiment, a structure includes a via stack including: a first substantially cross-shaped line in a first dielectric layer; a second substantially cross-shaped line set in a second dielectric layer, and a via stud coupling the first substantially cross-shaped line to the second substantially cross-shaped line. In another embodiment, a structure includes a first via stack, and a second via stack, wherein the first via stack and the second via stack extend in a divergent manner from one another. Each via stack structure is useful for support, for example, in under wire bond applications. The via stack structures can be mixed with other via stack structures and selectively placed within a layout to replace conventional metal plate and via stud array configurations.

    摘要翻译： 公开了通过堆叠结构。 在一个实施例中，结构包括通孔堆叠，其包括：第一介电层中的第一基本十字形的线; 设置在第二电介质层中的第二基本上十字形的线，以及将第一基本上十字形的线耦合到第二基本十字形线的通孔柱。 在另一个实施例中，结构包括第一通孔堆叠和第二通孔堆叠，其中第一通孔堆叠和第二通孔堆叠以彼此发散的方式延伸。 每个通孔堆叠结构可用于支持，例如在引线键合应用中。 通孔堆叠结构可以与其它通孔堆叠结构混合并且选择性地放置在布局内以代替传统的金属板和经由螺柱阵列配置。

    High performance compliant wafer test probe
    7.
    发明授权
    High performance compliant wafer test probe 有权
    高性能兼容晶圆测试探头

    公开(公告)号：US08487304B2

    公开(公告)日：2013-07-16

    申请号：US12771697

    申请日：2010-04-30

    申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

    发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

    IPC分类号： H01L23/58 ,  H01L23/48 ,  H01L23/52

    CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

    摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

    High Performance Compliant Wafer Test Probe
    8.
    发明申请
    High Performance Compliant Wafer Test Probe 有权
    高性能合格晶圆测试探头

    公开(公告)号：US20110266539A1

    公开(公告)日：2011-11-03

    申请号：US12771697

    申请日：2010-04-30

    申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

    发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

    IPC分类号： H01L23/544 ,  H01L23/58

    CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

    摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。