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公开(公告)号：US08629550B2
公开(公告)日：2014-01-14
申请号：US13206084
申请日：2011-08-09
申请人： Naohiro Hirose , Takashi Kariya , Yoji Mori
发明人： Naohiro Hirose , Takashi Kariya , Yoji Mori
CPC分类号： H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
摘要： A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.
摘要翻译： 一种印刷电路板，包括芯基板，形成在所述芯基板上并包括第一绝缘层的堆积层，形成在所述第一绝缘层上的导体层和形成在所述导体层上的第二绝缘层，以及一个或 在第一绝缘层上形成更多的布线图案。 导体层包括导体部分，并且导体部分分别具有跨越布线图案彼此面对的切口部分。
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公开(公告)号：US08018046B2
公开(公告)日：2011-09-13
申请号：US12389456
申请日：2009-02-20
申请人： Naohiro Hirose , Takashi Kariya , Yoji Mori
发明人： Naohiro Hirose , Takashi Kariya , Yoji Mori
CPC分类号： H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
摘要： A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.
摘要翻译： 一种印刷电路板，包括芯基板，形成在所述芯基板上并包括第一绝缘层的堆积层，形成在所述第一绝缘层上的导体层和形成在所述导体层上的第二绝缘层，以及一个或 在第一绝缘层上形成更多的布线图案。 导体层包括导体部分，并且导体部分分别具有跨越布线图案彼此面对的切口部分。
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公开(公告)号：US20090159327A1
公开(公告)日：2009-06-25
申请号：US12389456
申请日：2009-02-20
申请人： Naohiro Hirose , Takashi Kariya , Yoji Mori
发明人： Naohiro Hirose , Takashi Kariya , Yoji Mori
CPC分类号： H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
摘要： A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.
摘要翻译： 一种印刷电路板，包括芯基板，形成在所述芯基板上并包括第一绝缘层的堆积层，形成在所述第一绝缘层上的导体层和形成在所述导体层上的第二绝缘层，以及一个或 在第一绝缘层上形成更多的布线图案。 导体层包括导体部分，并且导体部分分别具有跨越布线图案彼此面对的切口部分。
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公开(公告)号：US20110290544A1
公开(公告)日：2011-12-01
申请号：US13206084
申请日：2011-08-09
申请人： Naohiro Hirose , Takashi Kariya , Yoji Mori
发明人： Naohiro Hirose , Takashi Kariya , Yoji Mori
IPC分类号： H05K1/02
CPC分类号： H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
摘要： A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.
摘要翻译： 一种印刷电路板，包括芯基板，形成在所述芯基板上并包括第一绝缘层的堆积层，形成在所述第一绝缘层上的导体层和形成在所述导体层上的第二绝缘层，以及一个或 在第一绝缘层上形成更多的布线图案。 导体层包括导体部分，并且导体部分分别具有跨越布线图案彼此面对的切口部分。
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公开(公告)号：US07525190B2
公开(公告)日：2009-04-28
申请号：US11078342
申请日：2005-03-14
申请人： Naohiro Hirose , Takashi Kariya , Yoji Mori
发明人： Naohiro Hirose , Takashi Kariya , Yoji Mori
CPC分类号： H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
摘要： A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
摘要翻译： 在布线图案58b，58c和58d的交叉部分X中，在构成拐角部分C等于或小于90°的部分上添加一个纸条F，并且形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。
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公开(公告)号：US07332816B2
公开(公告)日：2008-02-19
申请号：US10108628
申请日：2002-03-29
申请人： Naohiro Hirose , Takashi Kariya , Yoji Mori
发明人： Naohiro Hirose , Takashi Kariya , Yoji Mori
CPC分类号： H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
摘要： A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
摘要翻译： 在布线图案58b，58c和58d的交叉部分X中，将构图F添加到构成等于或小于90°的拐角部分C的部分，并且形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。
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公开(公告)号：US20050158553A1
公开(公告)日：2005-07-21
申请号：US11078342
申请日：2005-03-14
申请人： Naohiro Hirose , Takashi Kariya , Yoji Mori
发明人： Naohiro Hirose , Takashi Kariya , Yoji Mori
CPC分类号： H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
摘要： A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
摘要翻译： 在布线图案58b，58c和58d的交叉部分X中，将构图F添加到构成等于或小于90°的拐角部分C的部分，并且形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。
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公开(公告)号：US06407345B1
公开(公告)日：2002-06-18
申请号：US09700592
申请日：2000-11-17
申请人： Naohiro Hirose , Takashi Kariya , Yoji Mori
发明人： Naohiro Hirose , Takashi Kariya , Yoji Mori
IPC分类号： H01R909
CPC分类号： H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
摘要： A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
摘要翻译： 在布线图案58b，58c和58d的交叉部分X中，在构成拐角部分C等于或小于90°的部分上添加一个纸条F，并形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。
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9.发明授权Multi-layer printed wiring board including an alignment mark as an index for a position of via holes 有权多层印刷电路板，包括对准标记作为通孔位置的指标公开(公告)号：US07375289B2
公开(公告)日：2008-05-20
申请号：US11331268
申请日：2006-01-13
申请人： Yasuji Hiramatsu , Motoo Asai , Naohiro Hirose , Takashi Kariya
发明人： Yasuji Hiramatsu , Motoo Asai , Naohiro Hirose , Takashi Kariya
CPC分类号： H05K3/4679 , H05K1/0269 , H05K3/0008 , H05K3/0035 , H05K3/0082 , H05K3/421 , H05K3/4652 , H05K3/4655 , H05K2201/09781 , H05K2201/09918 , H05K2203/0554 , Y10S430/146 , Y10T29/49004 , Y10T29/49082 , Y10T29/49085 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.
摘要翻译： 多层印刷电路板包括覆盖有导体层的基板，层间绝缘树脂层，层间绝缘树脂层上的蚀刻金属膜和通孔。 层间绝缘树脂层具有纤维基材。 通孔具有电解电镀膜和无电镀膜，并且连接板的导体层和蚀刻的金属膜。
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公开(公告)号：US07761984B2
公开(公告)日：2010-07-27
申请号：US12053237
申请日：2008-03-21
申请人： Yasuji Hiramatsu , Motoo Asai , Naohiro Hirose , Takashi Kariya
发明人： Yasuji Hiramatsu , Motoo Asai , Naohiro Hirose , Takashi Kariya
IPC分类号： H01K3/10
CPC分类号： H05K3/4679 , H05K1/0269 , H05K3/0008 , H05K3/0035 , H05K3/0082 , H05K3/421 , H05K3/4652 , H05K3/4655 , H05K2201/09781 , H05K2201/09918 , H05K2203/0554 , Y10S430/146 , Y10T29/49004 , Y10T29/49082 , Y10T29/49085 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.
摘要翻译： 多层印刷电路板包括覆盖有导体层的基板，层间绝缘树脂层，层间绝缘树脂层上的蚀刻金属膜和通孔。 层间绝缘树脂层具有纤维基材。 通孔具有电解电镀膜和无电镀膜，并且连接板的导体层和蚀刻的金属膜。
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