Light-emitting device having a dielectric multilayer film arranged on the side surface of the light-emitting element

    公开(公告)号:US11043615B2

    公开(公告)日:2021-06-22

    申请号:US17010828

    申请日:2020-09-03

    摘要: A light-emitting device includes a light-emitting element having a top surface, a bottom surface opposite to the top surface, and side surfaces connecting the top surface and the bottom surface. An element electrode of the light-emitting element is located on the bottom surface. A phosphor layer is disposed above the top surface of the light-emitting element and having side surfaces. A reflective member covers side surfaces of the light-emitting element and side surfaces of the phosphor layer. A dielectric multilayer film is disposed on at least one of the side surfaces of the light-emitting element and disposed on at least one of the side surfaces of the phosphor layer and not located between the light emitting element and the phosphor layer. The dielectric multilayer film is not provided on an upper surface of the phosphor layer.

    SAPPHIRE SUBSTRATE AND SEMICONDUCTOR LIGHT EMITTING DEVICE
    3.
    发明申请
    SAPPHIRE SUBSTRATE AND SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
    SAPPHIRE基板和半导体发光器件

    公开(公告)号:US20140306265A1

    公开(公告)日:2014-10-16

    申请号:US14314516

    申请日:2014-06-25

    IPC分类号: H01L33/32

    摘要: The sapphire substrate has a principal surface for growing a nitride semiconductor to form a nitride semiconductor light emitting device and comprising a plurality of projections of the principal surface, wherein an outer periphery of a bottom surface of each of the projections has at least one depression. This depression is in the horizontal direction. The plurality of projections are arranged so that a straight line passes through the inside of at least any one of projections when the straight line is drawn at any position in any direction in a plane including the bottom surfaces of the plurality of projections.

    摘要翻译: 蓝宝石衬底具有用于生长氮化物半导体以形成氮化物半导体发光器件的主表面,并且包括主表面的多个突起,其中每个突起的底表面的外周具有至少一个凹陷。 这个凹陷在水平方向。 多个突起被布置成使得当直线在包括多个突起的底表面的平面的任何方向上的任何位置处被拉伸时,直线穿过至少任一个突起的内部。

    Light emitting element, light emitting device, and method of manufacturing light emitting element

    公开(公告)号:US11011688B2

    公开(公告)日:2021-05-18

    申请号:US16682062

    申请日:2019-11-13

    摘要: A light emitting element includes: a light reflecting member including a first region and a second region; a first semiconductor layered body disposed between the first region and the second region and configured to emit first light having a first peak wavelength; a second semiconductor layered body disposed between the first semiconductor layered body and the second region and configured to emit second light having a second peak wavelength different from the first peak wavelength; a base member disposed between the first semiconductor layered body and the second semiconductor layered body; and a wavelength conversion member on which the first light and the second light is incident, the wavelength conversion member producing third light having a third peak wavelength different from the first peak wavelength and the second peak wavelength.

    Light emitting element
    6.
    发明授权

    公开(公告)号:US09929316B2

    公开(公告)日:2018-03-27

    申请号:US15388507

    申请日:2016-12-22

    摘要: A light emitting element includes a substrate; a plurality of semiconductor light emitting cells; a plurality of light reflective electrodes; a first insulation layer that continuously covers lateral surfaces of the semiconductor light emitting cells, spaces between the semiconductor light emitting cells, lateral surfaces of the light reflective electrodes, and a portion of upper surfaces of the light reflective electrodes; a plurality of wiring electrodes, and cover the lateral surfaces of the semiconductor light emitting cells and the spaces between the semiconductor light emitting cells via the first insulation layer; and a light reflective metal layer that covers the lateral surfaces of at least two adjacent ones of the semiconductor light emitting cells and the space between said at least two semiconductor light emitting cells, via the first insulation layer.

    Method for manufacturing light-emitting element

    公开(公告)号:US11735686B2

    公开(公告)日:2023-08-22

    申请号:US17113583

    申请日:2020-12-07

    IPC分类号: H01L33/00 H01L33/50 H01L33/22

    摘要: A method for manufacturing a light-emitting element includes dividing a semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region, a first surface being exposed from under the semiconductor structure in the exposed region; etching protrusions formed in the exposed region; bonding a light-transmitting body to a second surface so as to form a bonded body; forming a plurality of modified regions along the exposed region inside the substrate by irradiating a laser beam on the exposed region from the first surface side; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.