摘要:
Process for the at least partial direct coating of an extensible backing material with a pressure-sensitive adhesive composition, the backing material being guided by a transporting apparatus against a coating apparatus in such a way that the coating apparatus applies the pressure-sensitive adhesive composition to the backing material, characterized in that the coating apparatus is abhesively treated.
摘要:
Backing materials which have been given a self-adhesive treatment on at least one side, characterized in that the self-adhesive composition is a pressure-sensitive hotmelt adhesive composition which at a frequency of 0.1 rad/s has a dynamic-complex glass transition temperature of less than −3° C., preferably from −6° C. to −30° C. and, with particular preference, from −9° C. to −25° C., and their use, in particular, for producing medical products such as plasters, bandages or dressings.
摘要:
The invention relates to the use of a non-woven fabric which is over-stitched by means of stitching threads as a supporting material for medical purposes. The invention is characterized in that the maximum tensile force of supporting material is equal to at least 30 N/cm and at least one side of the supporting material is partially or completely coated with a self-adhesive mass.
摘要:
A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.
摘要:
Laser-inscribable film, comprising a contrast layer based on a cured acrylate coating composition and, arranged above the contrast layer, an engraving layer, where the cured acrylate coating composition is based on a composition comprising from 30 to 80% by weight of a trifunctional oligomer A, from 0 to 20% by weight of a trifunctional monomer B, from 1 to 30% by weight of a difunctional monomer C, and from 2 to 40% by weight of a colorant pigment.
摘要:
The invention relates to a method for the production of a layered or stacked inorganic/organic composite material, a predominantly inorganic material being provided and a polymer material being provided, characterized in that the predominantly inorganic material has a glass transition temperature or melting temperature lower than 500° C., that the predominantly inorganic material and the polymer material are each molten, and that the predominantly inorganic material and the polymer material are coextruded from the melt and thus form the composite material.
摘要:
A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly.
摘要:
The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
摘要:
Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.