公开(公告)号：US08121697B2

公开(公告)日：2012-02-21

申请号：US12861729

申请日：2010-08-23

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： A61N1/00

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20110213443A1

公开(公告)日：2011-09-01

申请号：US12861729

申请日：2010-08-23

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： A61F9/08

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07813796B2

公开(公告)日：2010-10-12

申请号：US11455028

申请日：2006-07-24

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： A61N1/00

CPC分类号： A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US09592396B2

公开(公告)日：2017-03-14

申请号：US13351899

申请日：2012-01-17

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： H05K3/34 ,  A61N1/375 ,  A61N1/05 ,  H05K3/36 ,  H05K1/03 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20120131794A1

公开(公告)日：2012-05-31

申请号：US13351899

申请日：2012-01-17

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： H05K3/10

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07211103B2

公开(公告)日：2007-05-01

申请号：US10174349

申请日：2002-06-17

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

IPC分类号： A61N1/00

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封的电子封装通过几种方法之一直接接合到柔性电路或电极，包括通过导电粘合剂（例如环氧树脂或聚酰亚胺）附着，其包含生物相容性胶中的铂金属薄片; 由绝缘层覆盖的铂凸块的扩散接合; 线钉热焊接; 或集成互连制造。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US08175714B2

公开(公告)日：2012-05-08

申请号：US13044825

申请日：2011-03-10

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  James S. Little ,  Karl-Heinz Ihrig ,  Brian V. Mech ,  Neil H. Talbot ,  DaoMin Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  James S. Little ,  Karl-Heinz Ihrig ,  Brian V. Mech ,  Neil H. Talbot ,  DaoMin Zhou

IPC分类号： A61N1/375

CPC分类号： A61N1/0543

摘要： This invention is a retinal electrode array assembly and methods of using the same that facilitate surgical implant procedures by providing the operating surgeon with visual references and grasping means and with innovations that reduce actual and potential damage to the retina and the surrounding tissue.

摘要翻译： 本发明是一种视网膜电极阵列组件及其使用方法，其通过向操作外科医生提供视觉参考和抓握装置以及减少对视网膜和周围组织的实际和潜在损伤的创新来促进手术植入程序。

公开(公告)号：US08060211B2

公开(公告)日：2011-11-15

申请号：US11728144

申请日：2007-03-23

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  James S. Little ,  Karl-Heinz Ihrig ,  Brian V. Mech ,  Neil H. Talbot ,  DaoMin Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  James S. Little ,  Karl-Heinz Ihrig ,  Brian V. Mech ,  Neil H. Talbot ,  DaoMin Zhou

IPC分类号： A61N1/375

CPC分类号： A61N1/0543

摘要： This invention is methods of reducing stress in the retina that are caused by the implanted electrode array body having an oval shape that is curved to conform to the curvature of the retina and having a mounting aperture in the body for attaching the electrode array to the retina with a tack where a strain relief internal tab is place around a strain relief slot.

摘要翻译： 本发明是一种降低由植入的电极阵列体引起的视网膜应力的方法，所述植入电极阵列体具有弯曲以符合视网膜的曲率的椭圆形，并且在体内具有用于将电极阵列附着到视网膜上的安装孔 其中应力消除内部突片位于应变消除槽周围。

公开(公告)号：US07338522B2

公开(公告)日：2008-03-04

申请号：US09783236

申请日：2001-02-13

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  James S. Little ,  Karl-Heinz Ihrig ,  Brian V. Mech ,  Neil H. Talbot ,  DaoMin Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  James S. Little ,  Karl-Heinz Ihrig ,  Brian V. Mech ,  Neil H. Talbot ,  DaoMin Zhou

IPC分类号： A61F2/16

CPC分类号： A61N1/0543

摘要： This invention is a retinal electrode array assembly and methods of using the same that facilitate surgical implant procedures by providing the operating surgeon with visual references and grasping means and with innovations that reduce actual and potential damage to the retina and the surrounding tissue.

摘要翻译： 本发明是一种视网膜电极阵列组件及其使用方法，其通过向操作外科医生提供视觉参考和抓握装置以及减少对视网膜和周围组织的实际和潜在损伤的创新来促进手术植入程序。

公开(公告)号：US09907949B2

公开(公告)日：2018-03-06

申请号：US11933878

申请日：2007-11-01

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  James S. Little ,  Karl-Heinz Ihrig ,  Brian V. Mech ,  Neil H. Talbot ,  DaoMin Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  James S. Little ,  Karl-Heinz Ihrig ,  Brian V. Mech ,  Neil H. Talbot ,  DaoMin Zhou

IPC分类号： A61N1/05

CPC分类号： A61N1/0543

摘要： This invention is a retinal electrode array assembly and methods of using the same that facilitate surgical implant procedures by providing the operating surgeon with visual references and grasping means and with innovations that reduce actual and potential damage to the retina and the surrounding tissue.