公开(公告)号：US08121697B2

公开(公告)日：2012-02-21

申请号：US12861729

申请日：2010-08-23

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： A61N1/00

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US09592396B2

公开(公告)日：2017-03-14

申请号：US13351899

申请日：2012-01-17

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： H05K3/34 ,  A61N1/375 ,  A61N1/05 ,  H05K3/36 ,  H05K1/03 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20120131794A1

公开(公告)日：2012-05-31

申请号：US13351899

申请日：2012-01-17

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： H05K3/10

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20110213443A1

公开(公告)日：2011-09-01

申请号：US12861729

申请日：2010-08-23

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： A61F9/08

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07813796B2

公开(公告)日：2010-10-12

申请号：US11455028

申请日：2006-07-24

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC分类号： A61N1/00

CPC分类号： A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07211103B2

公开(公告)日：2007-05-01

申请号：US10174349

申请日：2002-06-17

申请人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

发明人： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok

IPC分类号： A61N1/00

CPC分类号： A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封的电子封装通过几种方法之一直接接合到柔性电路或电极，包括通过导电粘合剂（例如环氧树脂或聚酰亚胺）附着，其包含生物相容性胶中的铂金属薄片; 由绝缘层覆盖的铂凸块的扩散接合; 线钉热焊接; 或集成互连制造。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07142909B2

公开(公告)日：2006-11-28

申请号：US10236396

申请日：2002-09-06

申请人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

发明人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC分类号： A61N1/00

CPC分类号： A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US08880165B2

公开(公告)日：2014-11-04

申请号：US13009769

申请日：2011-01-19

申请人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

发明人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC分类号： A61N1/00 ,  A61N1/36 ,  A61N1/05 ,  A61N1/375 ,  H01L23/498 ,  H05K3/36 ,  H05K1/03 ,  H05K3/46 ,  H05K3/32 ,  H05K3/42 ,  H01L21/56 ,  H05K3/40

CPC分类号： A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07904148B2

公开(公告)日：2011-03-08

申请号：US11517860

申请日：2006-09-07

申请人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

发明人： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC分类号： A61N1/00

CPC分类号： A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07571011B2

公开(公告)日：2009-08-04

申请号：US10655772

申请日：2003-09-05

申请人： Dau Min Zhou ,  Robert J. Greenberg ,  Neil H. Talbot

发明人： Dau Min Zhou ,  Robert J. Greenberg ,  Neil H. Talbot

IPC分类号： A61N1/05

CPC分类号： A61L31/088 ,  A61N1/05 ,  A61N1/0565 ,  C25D5/08 ,  C25D5/10 ,  C25D9/06

摘要： An implantable electrode and method for manufacturing the electrode wherein the electrode has a strong, adherent surface coating of iridium oxide or titanium nitride on a platinum surface, which demonstrates an increase in surface area of at least five times when compared to smooth platinum of the same geometry. The iridium oxide coating may be formed on platinum by a physical deposition process, such as sputtering. The process of electroplating the iridium oxide surface coating is accomplished by voltage control processes. A gradient coating of iridium oxide ranging in composition from essentially pure platinum to essentially pure iridium oxide is produced by sputtering.

摘要翻译： 一种用于制造电极的可植入电极和方法，其中电极在铂表面上具有强烈的，氧化铱或氮化钛的粘附表面涂层，与其相同的平滑铂相比，其表面积增加至少为五倍 几何。 氧化铱涂层可以通过诸如溅射的物理沉积工艺在铂上形成。 电镀铱氧化物表面涂层的过程是通过电压控制过程完成的。 通过溅射产生从基本上纯的铂到基本上纯的氧化铱的组成范围内的氧化铱的梯度涂层。