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公开(公告)号：US08278749B2
公开(公告)日：2012-10-02
申请号：US12645969
申请日：2009-12-23
申请人： Rudolf Lachner , Linus Maurer , Maciej Wojnowski
发明人： Rudolf Lachner , Linus Maurer , Maciej Wojnowski
IPC分类号： H01L23/538 , H01L21/50
CPC分类号： H01L23/66 , H01L23/3128 , H01L23/3135 , H01L24/12 , H01L24/19 , H01L2223/6611 , H01L2223/6655 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48247 , H01L2224/73204 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1815 , H01L2924/18162 , H01L2924/19107 , H01L2924/3011 , H01L2924/351 , H01Q1/2283 , H01Q9/0407 , H01Q9/045 , H01Q9/0457 , H01L2924/00
摘要： A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.
摘要翻译： 半导体模块包括一个晶片级封装中的部件。 该模块包括嵌入在封装模塑料中的集成电路（IC）芯片。 该封装包括耦合到界面层的成型复合封装层，用于将天线结构和接合互连结构集成到IC芯片。 接合互连结构包括三维互连。 天线结构和接合互连结构在相同的晶片制造过程中耦合到IC芯片并且集成在界面层内。
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公开(公告)号：US20100193935A1
公开(公告)日：2010-08-05
申请号：US12645969
申请日：2009-12-23
申请人： Rudolf Lachner , Linus Maurer , Maciej Wojnowski
发明人： Rudolf Lachner , Linus Maurer , Maciej Wojnowski
IPC分类号： H01L23/538 , H01L21/50
CPC分类号： H01L23/66 , H01L23/3128 , H01L23/3135 , H01L24/12 , H01L24/19 , H01L2223/6611 , H01L2223/6655 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48247 , H01L2224/73204 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1423 , H01L2924/181 , H01L2924/1815 , H01L2924/18162 , H01L2924/19107 , H01L2924/3011 , H01L2924/351 , H01Q1/2283 , H01Q9/0407 , H01Q9/045 , H01Q9/0457 , H01L2924/00
摘要： A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.
摘要翻译： 半导体模块包括一个晶片级封装中的部件。 该模块包括嵌入在封装模塑料中的集成电路（IC）芯片。 该封装包括耦合到界面层的成型复合封装层，用于将天线结构和接合互连结构集成到IC芯片。 接合互连结构包括三维互连。 天线结构和接合互连结构在相同的晶片制造过程中耦合到IC芯片并且集成在界面层内。
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公开(公告)号：US20120104574A1
公开(公告)日：2012-05-03
申请号：US12914274
申请日：2010-10-28
申请人： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Thorsten Meyer
发明人： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Thorsten Meyer
IPC分类号： H01L23/552 , H01L21/50 , H01L23/52
CPC分类号： H01L24/20 , G01S7/032 , H01L23/49816 , H01L23/66 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/19 , H01L24/32 , H01L24/81 , H01L24/96 , H01L2223/6677 , H01L2224/0401 , H01L2224/11318 , H01L2224/1132 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/1319 , H01L2224/13191 , H01L2224/13299 , H01L2224/14051 , H01L2224/141 , H01L2224/14505 , H01L2224/14517 , H01L2224/16225 , H01L2224/17517 , H01L2224/21 , H01L2224/2101 , H01L2224/211 , H01L2224/215 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/831 , H01L2924/01029 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/18162 , H01L2924/3512 , H01L2924/384 , H01Q1/44 , H01Q17/00 , H01Q23/00 , H05K3/3436 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor module having one or more integrated antennas in a single package is provided herein to comprise a bonding interconnect structure having a plurality of individual bonding elements that are confined to a relatively small area of the bottom of a package. In particular, the semiconductor module comprises a bonding interconnect structure configured to connect an integrated package to a printed circuit board (PCB), wherein the integrated antenna structures are located at greater center-to-center distance from the IC device than the three dimensional interconnect structures. Therefore, the bonding interconnect structures are confined to a connection area that causes a part of the package containing the one or more antenna structures to extend beyond the bonding interconnect structure as a cantilevered structure. Such a bonding interconnect structure result in a package that is in contact with a PCB at a relatively small area that supports the load of the package.
摘要翻译： 本文提供了在单个封装中具有一个或多个集成天线的半导体模块，其包括具有限定在封装的底部的较小区域的多个单独的结合元件的接合互连结构。 特别地，半导体模块包括被配置为将集成封装连接到印刷电路板（PCB）的接合互连结构，其中集成天线结构位于距离IC器件更大的中心到距离三维互连 结构。 因此，接合互连结构被限制在连接区域上，该连接区域使得包含一个或多个天线结构的封装的一部分延伸超过作为悬臂结构的接合互连结构。 这种接合互连结构导致在支撑封装负载的较小区域处与PCB接触的封装。
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公开(公告)号：US08451618B2
公开(公告)日：2013-05-28
申请号：US12914274
申请日：2010-10-28
申请人： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Thorsten Meyer
发明人： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Thorsten Meyer
IPC分类号： H05K1/18
CPC分类号： H01L24/20 , G01S7/032 , H01L23/49816 , H01L23/66 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/19 , H01L24/32 , H01L24/81 , H01L24/96 , H01L2223/6677 , H01L2224/0401 , H01L2224/11318 , H01L2224/1132 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/1319 , H01L2224/13191 , H01L2224/13299 , H01L2224/14051 , H01L2224/141 , H01L2224/14505 , H01L2224/14517 , H01L2224/16225 , H01L2224/17517 , H01L2224/21 , H01L2224/2101 , H01L2224/211 , H01L2224/215 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/831 , H01L2924/01029 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/18162 , H01L2924/3512 , H01L2924/384 , H01Q1/44 , H01Q17/00 , H01Q23/00 , H05K3/3436 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor module having one or more integrated antennas in a single package is provided herein to comprise a bonding interconnect structure having a plurality of individual bonding elements that are confined to a relatively small area of the bottom of a package. In particular, the semiconductor module comprises a bonding interconnect structure configured to connect an integrated package to a printed circuit board (PCB), wherein the integrated antenna structures are located at greater center-to-center distance from the IC device than the three dimensional interconnect structures. Therefore, the bonding interconnect structures are confined to a connection area that causes a part of the package containing the one or more antenna structures to extend beyond the bonding interconnect structure as a cantilevered structure. Such a bonding interconnect structure result in a package that is in contact with a PCB at a relatively small area that supports the load of the package.
摘要翻译： 本文提供了在单个封装中具有一个或多个集成天线的半导体模块，其包括具有限定在封装的底部的较小区域的多个单独的结合元件的接合互连结构。 特别地，半导体模块包括被配置为将集成封装连接到印刷电路板（PCB）的接合互连结构，其中集成天线结构位于距离IC器件更大的中心到距离三维互连 结构。 因此，接合互连结构被限制在连接区域上，该连接区域使得包含一个或多个天线结构的封装的一部分延伸超过作为悬臂结构的接合互连结构。 这种接合互连结构导致在支撑封装负载的较小区域处与PCB接触的封装。
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5.发明授权公开(公告)号：US08866292B2
公开(公告)日：2014-10-21
申请号：US13736641
申请日：2013-01-08
IPC分类号： H01L23/34 , H01L23/498 , H01L21/768
CPC分类号： H01L23/49816 , H01L21/568 , H01L21/76802 , H01L21/76885 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2223/6677 , H01L2224/12105 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/17519 , H01L2224/211 , H01L2224/215 , H01L2224/82101 , H01L2224/96 , H01L2924/0002 , H01L2924/12042 , H01L2924/1301 , H01L2924/181 , H01Q1/2283 , H01Q9/0407 , H01Q9/16 , H01Q23/00 , H01L2224/19 , H01L2924/014 , H01L2924/01022 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/01029 , H01L2924/01055 , H01L2924/01064 , H01L2924/01044 , H01L2924/01042 , H01L2924/01015 , H01L2924/0105 , H01L2924/00012 , H01L2924/00
摘要： In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar.
摘要翻译： 根据本发明的实施例，半导体封装包括具有第一主表面和相对的第二主表面的衬底。 第一芯片设置在基板中。 第一芯片包括在第一主表面处的多个接触垫。 通孔棒设置在基板中。 天线结构设置在通孔条内。
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公开(公告)号：US20140035154A1
公开(公告)日：2014-02-06
申请号：US13564922
申请日：2012-08-02
申请人： Ottmar Geitner , Walter Hartner , Maciej Wojnowski , Ulrich Wachter , Michael Bauer , Andreas Stueckjuergen
发明人： Ottmar Geitner , Walter Hartner , Maciej Wojnowski , Ulrich Wachter , Michael Bauer , Andreas Stueckjuergen
CPC分类号： H01L24/96 , H01L23/3128 , H01L23/49855 , H01L23/5389 , H01L23/66 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/32 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/16225 , H01L2224/2105 , H01L2224/211 , H01L2224/214 , H01L2224/24051 , H01L2224/32245 , H01L2224/73151 , H01L2224/73259 , H01L2224/73267 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1304 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/142 , H01L2924/15311 , H01L2924/18162 , H01L2924/014 , H01L2924/01029 , H01L2924/01013 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01046 , H01L2924/0103 , H01L2924/01028 , H01L2924/01026 , H01L2224/13 , H01L2224/21 , H01L2924/00 , H01L2924/00014
摘要： A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.
摘要翻译： 提供了芯片封装，芯片封装包括：芯片，包括形成在芯片正面上的至少一个接触焊盘; 至少部分地围绕所述芯片并且覆盖所述至少一个接触垫的封装材料; 以及通过所述封装材料形成的至少一个电互连，其中所述至少一个电互连构造成将所述至少一个接触焊盘从所述芯片前侧的芯片封装第一侧电重定向到形成在所述芯片前侧上的至少一个焊料结构 芯片封装第二面在芯片背面。
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7.发明申请公开(公告)号：US20140110841A1
公开(公告)日：2014-04-24
申请号：US13736641
申请日：2013-01-08
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L23/49816 , H01L21/568 , H01L21/76802 , H01L21/76885 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2223/6677 , H01L2224/12105 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/17519 , H01L2224/211 , H01L2224/215 , H01L2224/82101 , H01L2224/96 , H01L2924/0002 , H01L2924/12042 , H01L2924/1301 , H01L2924/181 , H01Q1/2283 , H01Q9/0407 , H01Q9/16 , H01Q23/00 , H01L2224/19 , H01L2924/014 , H01L2924/01022 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/01029 , H01L2924/01055 , H01L2924/01064 , H01L2924/01044 , H01L2924/01042 , H01L2924/01015 , H01L2924/0105 , H01L2924/00012 , H01L2924/00
摘要： In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar.
摘要翻译： 根据本发明的实施例，半导体封装包括具有第一主表面和相对的第二主表面的衬底。 第一芯片设置在基板中。 第一芯片包括在第一主表面处的多个接触垫。 通孔棒设置在基板中。 天线结构设置在通孔条内。
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公开(公告)号：US08669655B2
公开(公告)日：2014-03-11
申请号：US13564922
申请日：2012-08-02
申请人： Ottmar Geitner , Walter Hartner , Maciej Wojnowski , Ulrich Wachter , Michael Bauer , Andreas Stueckjuergen
发明人： Ottmar Geitner , Walter Hartner , Maciej Wojnowski , Ulrich Wachter , Michael Bauer , Andreas Stueckjuergen
CPC分类号： H01L24/96 , H01L23/3128 , H01L23/49855 , H01L23/5389 , H01L23/66 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/32 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/16225 , H01L2224/2105 , H01L2224/211 , H01L2224/214 , H01L2224/24051 , H01L2224/32245 , H01L2224/73151 , H01L2224/73259 , H01L2224/73267 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1304 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/142 , H01L2924/15311 , H01L2924/18162 , H01L2924/014 , H01L2924/01029 , H01L2924/01013 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01046 , H01L2924/0103 , H01L2924/01028 , H01L2924/01026 , H01L2224/13 , H01L2224/21 , H01L2924/00 , H01L2924/00014
摘要： A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.
摘要翻译： 提供了芯片封装，芯片封装包括：芯片，包括形成在芯片正面上的至少一个接触焊盘; 至少部分地围绕所述芯片并且覆盖所述至少一个接触垫的封装材料; 以及通过所述封装材料形成的至少一个电互连，其中所述至少一个电互连构造成将所述至少一个接触焊盘从所述芯片前侧的芯片封装第一侧电重定向至形成在所述芯片前侧的至少一个焊料结构 芯片封装第二面在芯片背面。
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